Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
為了有效地提升鉛酸蓄電池的使用壽命，同時實現對充電過程的監(jiān)控，設計出一種用單片機控制的36 V鉛酸蓄電池充電電源。本電路采用反激式拓撲，連續(xù)電流工作模式，電源管理IC設計在電源的副邊，由ELAN公司的EM78P258N單片機模擬，是用可編程器件模擬電源管理IC，實現智能電源低成本化的一次成功嘗試，通過對單片機的軟件設計實現了充電電源的狀態(tài)顯示、充電時間控制、報警、過溫保護、過壓保護、過流保護等功能。本充電器真正的實現了鉛酸蓄電池的三段式充電過程，其最高輸出功率可達90 W，效率約85%，成本不到20元，具有很高的市場競爭力。
Abstract: In order to extend the life of lead-acid battery efficiently and supervise the charging process meanwhile， a 36V lead-acid battery charge powe supply controlled by microcontroller is designed. The charger is flyback switching power supply and works in CCM mode. A EM78P258N microcontroller made by ELAN microelectronics corporation is used as power management IC which is designed at the secondary circuit. The project is a successful attempt to low-cost intelligent power used microcontroller simulating power management IC. The charger also has the functions of the status reveal， charge time control， alarming， thermal protect， current limit and overvoltage protect by the software design. The circuit actually implements the three-step charge process， whose power is up to 90W and whose efficiency can get 85%. The net cost of this charger is less than 20 RMB， so that the charger is of powerful market competitiveness.
介紹一種基于C8051F060單片機和NAND Flash的數據采集存儲系統(tǒng)，該系統(tǒng)可實現3路信號采樣，每路采樣率為5KS/s,通過異步串行通信接口實現數據傳輸。并詳細說明系統(tǒng)的軟件設計。
Abstract:
An acquisition and storage system based on C8051F060and NAND Flash is designed in this paper.The system is used to sample three-channel of signal,5KSPS each channel,and can upload data to test bench through UART（Universal Asynchronous Receiver/Transmitter）.The software design is discussed in detail.
The TL2575 and TL2575HV represent superior alternatives to popular three-terminal linear regulators. Due totheir high efficiency, the devices significantly reduce the size of the heatsink and, in many cases, no heatsink isrequired. Optimized for use with standard series of inductors available from several different manufacturers, theTL2575 and TL2575HV greatly simplify the design of switch-mode power supplies by requiring a minimaladdition of only four to six external components for operation.
本文依據集成電路設計方法學，探討了一種基于標準Intel 8086 微處理器的單芯片計算機平臺的架構。研究了其與SDRAM，8255 并行接口等外圍IP 的集成，并在對AMBA協(xié)議和8086 CPU分析的基礎上，采用遵從AMBA傳輸協(xié)議的系統(tǒng)總線代替?zhèn)鹘y(tǒng)的8086 CPU三總線結構，搭建了基于8086 IP 軟核的單芯片計算機系統(tǒng)，并實現了FPGA 功能演示。關鍵詞：微處理器； SoC；單芯片計算機；AMBA 協(xié)議
Design of 8086 CPU Based Computer-on-a-chip System（School of Electrical Engineering and Automation, Heifei University of Technology, Hefei, 230009,China）Abstract: According to the IC design methodology, this paper discusses the design of one kind of Computer-on-a-chip system architecture, which is based on the standard Intel8086 microprocessor,investigates how to integrate the 8086 CPU and peripheral IP such as, SDRAM controller, 8255 PPI etc. Based on the analysis of the standard Intel8086 microprocessor and AMBA Specification,the Computer-on-a-chip system based on 8086 CPU which uses AMBA bus instead of traditional three-bus structure of 8086 CPU is constructed, and the FPGA hardware emulation is fulfilled.Key words: Microprocessor; SoC; Computer-on-a-chip; AMBA Specification
The main objective of this book is to present all the relevant informationrequired for RF and micro-wave power amplifier design includingwell-known and novel theoretical approaches and practical design techniquesas well as to suggest optimum design approaches effectively combininganalytical calculations and computer-aided design. This bookcan also be very useful for lecturing to promote the analytical way ofthinking with practical verification by making a bridge between theoryand practice of RF and microwave engineering. As it often happens, anew result is the well-forgotten old one. Therefore, the demonstrationof not only new results based on new technologies or circuit schematicsis given, but some sufficiently old ideas or approaches are also introduced,that could be very useful in modern practice or could contributeto appearance of new ideas or schematic techniques.
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
