《器件封裝用戶向?qū)А焚愳`思產(chǎn)品封裝資料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process tech...
The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT ...
The XPS Ethernetlite peripheral does not provide any mechanism to access the Ethernet PHYregisters. These registers are used to configure auto negot...
針對(duì)飛行模擬器座艙數(shù)據(jù)采集的復(fù)雜性,設(shè)計(jì)了一種基于以太網(wǎng)分布式的數(shù)據(jù)采集控制系統(tǒng),該系統(tǒng)是RCM5700微處理器模塊上的以太網(wǎng)應(yīng)用。在系統(tǒng)的基礎(chǔ)上具體討論了PoE技術(shù)的應(yīng)用,在傳輸數(shù)據(jù)的網(wǎng)線上同時(shí)提供電流,提出并實(shí)現(xiàn)了一種包括輔助電源在內(nèi)的完整可靠的PoE供電方案。設(shè)計(jì)采用美國(guó)國(guó)家半導(dǎo)體的LM507...