Generate a great circle "trajectory" from [lat1,lon1] to [lat2, lon2].
％ resulting points will be seperated by approximately delta_ft feet.
％ By default, delta_ft = 100 feet. All lat/lon inputs & outputs are in
％ degrees.
Piezoelectric motors are used in digital cameras for autofocus,zooming and optical image stabilization. Theyare relatively small, lightweight and effi cient, but theyalso require a complicated driving scheme. Traditionally,this challenge has been met with the use ofseparatecircuits, including a step-up converter and an oversizedgeneric full-bridge drive IC. The resulting high componentcount and large board space are especially problematicin the design of cameras for ever shrinking cell phones.The LT®3572 solves these problems by combining astep-up regulator and a dual full-bridge driver in a 4mm× 4mm QFN package. Figure 1 shows a typical LT3572Piezo motor drive circuit. A step-up converter is usedto generate 30V from a low voltage power source suchas a Li-Ion battery or any input power source within thepart’s wide input voltage range of 2.7V to 10V. The highoutput voltage of the step-up converter, adjustable upto 40V, is available for the drivers at the VOUT pin. Thedrivers operate in a full-bridge fashion, where the OUTAand OUTB pins are the same polarity as the PWMA andPWMB pins, respectively, and the OUTA and OUTB pinsare inverted from PWMA and PWMB, respectively. Thestep-up converter and both Piezo drivers have their ownshutdown control. Figure 2 shows a typical layout
As environmental concerns over traditional lighting increaseand the price of LEDs decreases, high power LEDsare fast becoming a popular lighting solution for offl ineapplications. In order to meet the requirements of offl inelighting—such as high power factor, high effi ciency, isolationand TRIAC dimmer compatibility—prior LED driversused many external discrete components, resulting incumbersome solutions. The LT®3799 solves complexity,space and performance problems by integrating all therequired functions for offl ine LED lighting.
數字控制的交流調速系統所選用的微處理器、功率器件及產生PWM波的方法是影響交流調速系統性能好壞的直接因素。在介紹了正弦脈寬調制(SPWM)技術的基礎上，設計了一種以8098單片機作為控制器，以智能功率模塊IPM為開關器件的變頻調速系統。通過軟件編程，產生正弦脈沖寬度調制波形來控制絕緣柵雙極晶體管的導通和關斷，從而達到控制異步電動機轉速的目的。實驗結果表明，該系統可調頻率調電壓，穩定度高，調速范圍寬，具有較強的實用價值
Abstract:
AC variable speed with digital control systems used microprocessors， power devices and generate PWM wave is the direct factors of affecting the performance AC speed regulation system. On the basis of introducing the sinusoidal pulse width modulation (SPWM) technology，this paper designed variable speed system which used 8098 as a controller， intelligent power module IPM as switching device. Through software programming， resulting in sinusoidal pulse width modulation waveform to control the insulated gate bipolar transistor turn on and off， so as to achieve the purpose of speed control of induction motors. Experimental results show that the system can adjust frequency modulation voltage， high stability， wide speed range， has a strong practical value.
Luminary Micro provides an analog-to-digital converter (ADC) module on some members of theStellaris microcontroller family. The hardware resolution of the ADC is 10 bits; however, due to noiseand other accuracy-diminishing factors, the true accuracy is less than 10 bits. This application noteprovides a software-based oversampling technique, resulting in an improved Effective Number OfBits (ENOB) in the conversion result. This document describes methods of oversampling an inputsignal, and the impact on precision and overall system performance.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
