·原書名： WCDMA FOR UMTS-Radio Access for Third Generation Mobile Communication 作者：（芬）哈里.霍爾馬 安提.托斯卡拉 [同作者作品] 譯者： 周勝[同譯者作品] 等 叢書名： 其他 出版社：機(jī)械工業(yè)出版社* ISBN：7111096681 上架時(shí)間：2002-1-19 出版日期：2002 年1月 頁碼：266 版次：1-1
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Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
The SN65LBC170 and SN75LBC170 aremonolithic integrated circuits designed forbidirectional data communication on multipointbus-transmission lines. Potential applicationsinclude serial or parallel data transmission, cabledperipheral buses with twin axial, ribbon, ortwisted-pair cabling. These devices are suitablefor FAST-20 SCSI and can transmit or receivedata pulses as short as 25 ns, with skew lessthan 3 ns.These devices combine three 3-state differentialline drivers and three differential input linereceivers, all of which operate from a single 5-Vpower supply.The driver differential outputs and the receiverdifferential inputs are connected internally to formthree differential input/output (I/O) bus ports thatare designed to offer minimum loading to the buswhenever the driver is disabled or VCC = 0. Theseports feature a wide common-mode voltage rangemaking the device suitable for party-lineapplications over long cable runs.
