According to CIBC World Markets, Equity Research, theFlat Panel Display (FPD) industry has achieved sufficientcritical mass for its growth to explode. Thus, it can nowattract the right blend of capital investments and R&Dresources to drive technical innovation toward continuousimprovement in view quality, manufacturing efficiency,and system integration. These in turn are sustainingconsumer interest, penetration, revenue growth, and thepotential for increasing long-term profitability for industryparticipants. CIBC believes that three essential conditionsare now converging to drive the market forward
為了能夠滿足基站易于選址、優質快速的建站要求和易維護、低成本、高可靠的運行要求，本文對以方艙來實現一體化結構基站做出一番探討。從系統設計的觀點闡述了移動通信高性能基站天線設計的幾個關鍵問題，介紹了智能天線技術在基站中的應用，并且用HFSS軟件仿真了一種新型的對稱陣子天線，該天線駐波比小于2的帶寬可以達到60%，具有良好的寬頻帶特性。
Abstract:
In order to meet the station construction requirement of easy site selection and fast base station， and meet the operational requirement of easy maintenance， low cost and high reliability， this paper discussed the unified architecture base station using shelter. Several key problems of high performance mobile communication base station antenna were illustrated from the view of system design， the application of smart antenna in base station was also introduced. And a novel dipole antenna was simulated by using HFSS， the VSWR of the antenna is less than 2， and the bandwidth was reach to 60%. So it has good broadband properties.
MAXQUSBJTAGOW評估板軟件:關鍵特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory view and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
MAXQUSBJTAGOW評估板軟件:關鍵特性 Easily Load and Debug Code Interface Provides In-Application Debugging Features Step-by-Step Execution Tracing Breakpointing by Code Address, Data Memory Address, or Register Access Data Memory view and Edit Supports Logic Levels from 1.1V to 3.6V Supports JTAG and 1-Wire Protocols Each Adapter Has Its Own Unique Serial ID, Allowing Multiple Adapters to be Connected Without COM Port Conflicts Has In-Field Upgradable Capability if Firmware Needs to be Upgraded Enclosure Protects from Shorts and ESD
According to CIBC World Markets, Equity Research, theFlat Panel Display (FPD) industry has achieved sufficientcritical mass for its growth to explode. Thus, it can nowattract the right blend of capital investments and R&Dresources to drive technical innovation toward continuousimprovement in view quality, manufacturing efficiency,and system integration. These in turn are sustainingconsumer interest, penetration, revenue growth, and thepotential for increasing long-term profitability for industryparticipants. CIBC believes that three essential conditionsare now converging to drive the market forward
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
