當(dāng)設(shè)計(jì)高速信號(hào)PCB或者復(fù)雜的PCB時(shí)，常常需要考慮信號(hào)的干擾和抗干擾的問(wèn)題，也就是設(shè)計(jì)這樣的PCB時(shí)，需要提高PCB的電磁兼容性。為了實(shí)現(xiàn)這個(gè)目的，除了在原理圖設(shè)計(jì)時(shí)增加抗干擾的元件外，在設(shè)計(jì)PCB時(shí)也必須考慮這個(gè)問(wèn)題，而最重要的實(shí)現(xiàn)手段之一就是使用高速信號(hào)布線的基本技巧和原則。 高速信號(hào)布線的基本技巧包括控制走線長(zhǎng)度、蛇形布線、差分對(duì)布線和等長(zhǎng)布線，使用這些基本的布線方法，可以大大提高高速信號(hào)的質(zhì)量和電磁兼容性。下面分別介紹這些布線方法的設(shè)置和操作。
上傳時(shí)間： 2013-11-08
上傳用戶：座山雕牛逼
本內(nèi)容匯總了近30個(gè)PCB布線知識(shí)面試題是PCB工程師必備的知識(shí)點(diǎn)總結(jié)，也是面試者需要的知識(shí)。如何處理實(shí)際布線中的一些理論沖突的問(wèn)題，在高速設(shè)計(jì)中，如何解決信號(hào)的完整性問(wèn)題?差分布線方式是如何實(shí)現(xiàn)的?對(duì)于只有一個(gè)輸出端的時(shí)鐘信號(hào)線，如何實(shí)現(xiàn)差分布線?等問(wèn)題
上傳時(shí)間： 2013-12-15
上傳用戶：asdfasdfd
LVDS(低壓差分信號(hào))標(biāo)準(zhǔn)ANSI/TIA /E IA26442A22001廣泛應(yīng)用于許多接口器件和一些ASIC及FPGA中。文中探討了LVDS的特點(diǎn)及其PCB (印制電路板)設(shè)計(jì),糾正了某些錯(cuò)誤認(rèn)識(shí)。應(yīng)用傳輸線理論分析了單線阻抗、雙線阻抗及LVDS差分阻抗計(jì)算方法,給出了計(jì)算單線阻抗和差分阻抗的公式,通過(guò)實(shí)際計(jì)算說(shuō)明了差分阻抗與單線阻抗的區(qū)別,并給出了PCB布線時(shí)的幾點(diǎn)建議。關(guān)鍵詞: LVDS, 阻抗分析, 阻抗計(jì)算, PCB設(shè)計(jì) LVDS (低壓差分信號(hào))是高速、低電壓、低功率、低噪聲通用I/O接口標(biāo)準(zhǔn),其低壓擺幅和差分電流輸出模式使EM I (電磁干擾)大大降低。由于信號(hào)輸出邊緣變化很快,其信號(hào)通路表現(xiàn)為傳輸線特性。因此,在用含有LVDS接口的Xilinx或Altera等公司的FP2GA及其它器件進(jìn)行PCB (印制電路板)設(shè)計(jì)時(shí),超高速PCB設(shè)計(jì)和差分信號(hào)理論就顯得特別重要。
上傳時(shí)間： 2013-11-19
上傳用戶：水中浮云
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來(lái)了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見(jiàn)設(shè)計(jì)中可能出現(xiàn)的各種問(wèn)題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來(lái)說(shuō)，最令人頭大的莫過(guò)于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過(guò)較長(zhǎng)的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問(wèn)題。本章就是圍繞信號(hào)完整性的問(wèn)題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來(lái)...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過(guò)孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for differential transmission lineson FR4. This is especially noticeable in the case of surface microstrip configurations. The anomaly is shown tobe due to the nature of the substrate material. This needs to be considered as a layered structure of epoxy resinand glass fibre. Calculations, using Boundary Element field methods, show that the distribution of the electricfield within this layered structure determines the apparent dielectric constant and therefore affects theimpedance. Thus FR4 cannot be considered to be uniform dielectric when calculating differential impedance.
上傳時(shí)間： 2014-12-24
上傳用戶：DE2542
LT®1991提供了很多的功能，因而有可能是您必須保持一定庫(kù)存量的最後一款放大器。它不是一款應(yīng)用受限的單用途差分或儀表放大器。
標(biāo)簽： 外部電阻 精準(zhǔn)增益
上傳時(shí)間： 2013-10-26
上傳用戶：18752787361
LTC®2991 系統(tǒng)監(jiān)視器內(nèi)置了這種精細(xì)復(fù)雜的電路，它能把一個(gè)小信號(hào)晶體管變成一個(gè)準(zhǔn)確的溫度傳感器。該器件不僅可在測(cè)量遠(yuǎn)端二極管溫度時(shí)提供 ±1°C的準(zhǔn)確度，還能測(cè)量其自身的電源電壓、單端電壓(0 至 VCC) 和差分電壓 (±325mV)。
上傳時(shí)間： 2013-11-05
上傳用戶：gps6888
ADM2582E/ADM2587E是具備±15 kV ESD保護(hù)功能的完全集成式隔離數(shù)據(jù)收發(fā)器，適合用于多點(diǎn)傳輸線路上的高速通信應(yīng)用。ADM2582E/ADM2587E包含一個(gè)集成式隔離DC-DC電源，不再需要外部DC/DC隔離模塊。 該器件針對(duì)均衡的傳輸線路而設(shè)計(jì)，符合ANSI TIA/EIA-485-A-98和ISO 8482:1987(E)標(biāo)準(zhǔn)。 它采用ADI公司的iCoupler®技術(shù)，在單個(gè)封裝內(nèi)集成了一個(gè)三通道隔離器、一個(gè)三態(tài)差分線路驅(qū)動(dòng)器、一個(gè)差分輸入接收器和一個(gè)isoPower DC/DC轉(zhuǎn)換器。該器件采用5V或3.3V單電源供電，從而實(shí)現(xiàn)了完全集成的信號(hào)和電源隔離RS-485解決方案。 ADM2582E/ADM2587E驅(qū)動(dòng)器帶有一個(gè)高電平有效使能電路，并且還提供一個(gè)高電平接收機(jī)有效禁用電路，可使接收機(jī)輸出進(jìn)入高阻抗?fàn)顟B(tài)。 該器件具備限流和熱關(guān)斷特性，能夠防止輸出短路。 隔離的RS-485/RS-422收發(fā)器，可配置成半雙工或全雙工模式 isoPower™集成式隔離DC/DC轉(zhuǎn)換器 在RS-485輸入/輸出引腳上提供±15 kV ESD保護(hù)功能 符合ANSI/TIA/EIA-485-A-98和ISO 8482:1987(E)標(biāo)準(zhǔn) ADM2587E數(shù)據(jù)速率： 500 kbps 5 V或3.3V電源供電 總線上擁有256個(gè)節(jié)點(diǎn) 開(kāi)路和短路故障安全接收機(jī)輸入 高共模瞬態(tài)抑制能力： >25 kV/μs 熱關(guān)斷保護(hù)
上傳時(shí)間： 2013-10-27
上傳用戶：名爵少年
介紹了一款輸入級(jí)采用差分放大作倒相的推挽功放, 它的額定輸出功率為, 如果提高輸出級(jí)電源電壓, 還可在不變動(dòng)電路條件下, 把輸出功率提高到, 可以滿足一些對(duì)功率要求比較高的發(fā)燒友需要。
上傳時(shí)間： 2013-11-08
上傳用戶：zhaiye
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