高速高頻PCB走線精品設(shè)計(jì)指南 八套連發(fā)
標(biāo)簽： PCB 設(shè)計(jì)指南
上傳時(shí)間： 2013-10-29
上傳用戶：超凡大師
基于高速FPGA 的PCB 設(shè)計(jì)技巧 如果高速PCB 設(shè)計(jì)能夠像連接原理圖節(jié)點(diǎn)那樣簡(jiǎn)單，以及像在計(jì)算機(jī)顯示器上所看到的那樣優(yōu)美的話，那將是一件多么美好的事情。然而，除非設(shè)計(jì)師初入PCB 設(shè)計(jì)，或者是極度的幸運(yùn)，實(shí)際的PCB 設(shè)計(jì)通常不像他們所從事的電路設(shè)計(jì)那樣輕松。在設(shè)計(jì)最終能夠正常工作、有人對(duì)性能作出肯定之前，PCB設(shè)計(jì)師都面臨著許多新的挑戰(zhàn)。這正是目前高速PCB設(shè)計(jì)的現(xiàn)狀–設(shè)計(jì)規(guī)則和設(shè)計(jì)指南不斷發(fā)展，如果幸運(yùn)的話，它們會(huì)形成一個(gè)成功的解決方案。
標(biāo)簽： FPGA PCB 設(shè)計(jì)技巧
上傳時(shí)間： 2013-11-08
上傳用戶：ly1994
LVDS(低壓差分信號(hào))標(biāo)準(zhǔn)ANSI/TIA /E IA26442A22001廣泛應(yīng)用于許多接口器件和一些ASIC及FPGA中。文中探討了LVDS的特點(diǎn)及其PCB (印制電路板)設(shè)計(jì),糾正了某些錯(cuò)誤認(rèn)識(shí)。應(yīng)用傳輸線理論分析了單線阻抗、雙線阻抗及LVDS差分阻抗計(jì)算方法,給出了計(jì)算單線阻抗和差分阻抗的公式,通過實(shí)際計(jì)算說明了差分阻抗與單線阻抗的區(qū)別,并給出了PCB布線時(shí)的幾點(diǎn)建議。關(guān)鍵詞: LVDS, 阻抗分析, 阻抗計(jì)算, PCB設(shè)計(jì) LVDS (低壓差分信號(hào))是高速、低電壓、低功率、低噪聲通用I/O接口標(biāo)準(zhǔn),其低壓擺幅和差分電流輸出模式使EM I (電磁干擾)大大降低。由于信號(hào)輸出邊緣變化很快,其信號(hào)通路表現(xiàn)為傳輸線特性。因此,在用含有LVDS接口的Xilinx或Altera等公司的FP2GA及其它器件進(jìn)行PCB (印制電路板)設(shè)計(jì)時(shí),超高速PCB設(shè)計(jì)和差分信號(hào)理論就顯得特別重要。
上傳時(shí)間： 2013-10-31
上傳用戶：adada
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................885.3.2 芯片外部開關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
8層全志A80BOX高清機(jī)頂盒AXT530124+EMMC-BGA169+AXP806原理圖+PCB 8層飛思卡爾I.MX6x智能家居控制主板MAX8903C+WM8962+MT41K128M16JT 6層瑞芯微RK3288平板方案DSN+BRD 6層安霸A7LA30方案行車記錄儀原理圖和PCB文檔 6層Rockchip_Wireless_HDMI_presentation的pcb+原理圖下載 6層HI3531海思最新最全的硬件設(shè)計(jì)資料整合包含芯片手冊(cè)，SCH和PCB 4層使用AM8252B做的帶WiFi-HDMI功能的手機(jī)互聯(lián)原理圖和PCB 4層海思HI3535網(wǎng)絡(luò)硬盤錄像機(jī)PBGA563+QFN64+BGA96+原理圖+PCB文件 4層MT7620A智能路由器（小米同款）原理圖和PCB文件分享下載 2層STM32F107智能家居主板IR0038+SPX1117M3-3.3+CH340G+MOC3063原理圖+PCB文件 2層LCD12864萬年歷(帶原理圖和PCB) 2層ESP8266系統(tǒng)板+CH340G+LM1117-V33+原理圖+PCB文件分享下載 16層官方Xilinx Kintex UltraScale FPGA KCU105+4片DDR4分享下載 14層美高森美SmartFusion2 SOC FPGA開發(fā)板FT4232H+TPS51200+USB3340+原理圖+PCB 14層高速板sch和brd文件下載 12層altera的5片DDR2組成72數(shù)據(jù)位寬 10層英特爾x86atom電腦主板BAYTRAIL+ISL95837HRZ-T+RTL8111GS原理圖與PCB文件
標(biāo)簽： 實(shí)用電工
上傳時(shí)間： 2013-04-15
上傳用戶：eeworm
射頻與數(shù)模混合類高速PCB設(shè)計(jì)，對(duì)手機(jī)設(shè)計(jì)者，及PROTEL熟練者大有裨益! 射頻與數(shù)模混合類高速PCB設(shè)計(jì)，對(duì)手機(jī)設(shè)計(jì)者，及PROTEL熟練者大有裨益!
上傳時(shí)間： 2013-07-22
上傳用戶：mfhe2005
隨著信息寬帶化和高速化的發(fā)展，以前的低速PCB已完全不能滿足日益增長(zhǎng)信息化發(fā)展的需要，而高速PCB的出現(xiàn)將對(duì)硬件人員提出更高的要求，僅僅依靠自
標(biāo)簽： Cadence ALlegro PCB 信號(hào)完整性
上傳時(shí)間： 2013-05-22
上傳用戶：julin2009
DSP系統(tǒng)的降噪技術(shù),PowerPCB在印制電路板設(shè)計(jì)中的應(yīng)用技術(shù),PCB互連設(shè)計(jì)過程中最大程度降低RF效應(yīng)的基本方法
標(biāo)簽： PCB
上傳時(shí)間： 2013-10-11
上傳用戶：gmh1314
pcb
上傳時(shí)間： 2013-11-04
上傳用戶：fac1003
信號(hào)完整性是高速數(shù)字系統(tǒng)中要解決的一個(gè)首要問題之一，如何在高速PCB 設(shè)計(jì)過程中充分考慮信號(hào)完整性因素,并采取有效的控制措施,已經(jīng)成為當(dāng)今系統(tǒng)設(shè)計(jì)能否成功的關(guān)鍵。在這方面，差分線對(duì)具有很多優(yōu)勢(shì)，比如更高的比特率 ,更低的功耗 ,更好的噪聲性能和更穩(wěn)定的可靠性等。目前，差分線對(duì)在高速數(shù)字電路設(shè)計(jì)中的應(yīng)用越來越廣泛，電路中最關(guān)鍵的信號(hào)往往都要采用差分線對(duì)設(shè)計(jì)。介紹了差分線對(duì)在PCB 設(shè)計(jì)中的一些要點(diǎn)，并給出具體設(shè)計(jì)方案。
上傳時(shí)間： 2014-12-24
上傳用戶：540750247
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