第一部分 信號完整性知識基礎.................................................................................5第一章 高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章 串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章 電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章 使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309
上傳時間： 2013-11-07
上傳用戶：aa7821634
題目：利用條件運算符的嵌套來完成此題：學習成績>=90分的同學用A表示，60-89分之間的用B表示，60分以下的用C表示。 1.程序分析：(a>b)?a:b這是條件運算符的基本例子。
上傳時間： 2015-01-08
上傳用戶：lifangyuan12
源代碼\用動態規劃算法計算序列關系個數 用關系"<"和"="將3個數a，b，c依次序排列時，有13種不同的序列關系： a=b=c,a=b<c,a<b=v,a<b<c,a<c<b a=c<b,b<a=c,b<a<c,b<c<a,b=c<a c<a=b,c<a<b,c<b<a 若要將n個數依序列，設計一個動態規劃算法，計算出有多少種不同的序列關系， 要求算法只占用O(n),只耗時O(n*n).
上傳時間： 2013-12-26
上傳用戶：siguazgb
The government of a small but important country has decided that the alphabet needs to be streamlined and reordered. Uppercase letters will be eliminated. They will issue a royal decree in the form of a String of B and A characters. The first character in the decree specifies whether a must come ( B )Before b in the new alphabet or ( A )After b . The second character determines the relative placement of b and c , etc. So, for example, "BAA" means that a must come Before b , b must come After c , and c must come After d . Any letters beyond these requirements are to be excluded, so if the decree specifies k comparisons then the new alphabet will contain the first k+1 lowercase letters of the current alphabet. Create a class Alphabet that contains the method choices that takes the decree as input and returns the number of possible new alphabets that conform to the decree. If more than 1,000,000,000 are possible, return -1. Definition
標簽： government streamline important alphabet
上傳時間： 2015-06-09
上傳用戶：weixiao99
電力系統在臺穩定計算式電力系統不正常運行方式的一種計算。它的任務是已知電力系統某一正常運行狀態和受到某種擾動，計算電力系統所有發電機能否同步運行 1運行說明： 請輸入初始功率S0，形如a+bi 請輸入無限大系統母線電壓V0 請輸入系統等值電抗矩陣B 矩陣B有以下元素組成的行矩陣 1正常運行時的系統直軸等值電抗Xd 2故障運行時的系統直軸等值電抗X d 3故障切除后的系統直軸等值電抗 請輸入慣性時間常數Tj 請輸入時段數N 請輸入哪個時段發生故障Ni 請輸入每時段間隔的時間dt
上傳時間： 2015-06-13
上傳用戶：it男一枚
上下文無關文法（Context-Free Grammar, CFG）是一個4元組G=(V, T, S, P)，其中，V和T是不相交的有限集，S∈V，P是一組有限的產生式規則集，形如A→α，其中A∈V，且α∈(V∪T)*。V的元素稱為非終結符，T的元素稱為終結符，S是一個特殊的非終結符，稱為文法開始符。 設G=(V, T, S, P)是一個CFG，則G產生的語言是所有可由G產生的字符串組成的集合，即L(G)={x∈T* | Sx}。一個語言L是上下文無關語言（Context-Free Language, CFL），當且僅當存在一個CFG G，使得L=L(G)。 *⇒ 例如，設文法G：S→AB A→aA|a B→bB|b 則L(G)={a^nb^m | n,m>=1} 其中非終結符都是大寫字母，開始符都是S，終結符都是小寫字母。
標簽： Context-Free Grammar CFG
上傳時間： 2013-12-10
上傳用戶：gaojiao1999
一:需求分析 1. 問題描述 魔王總是使用自己的一種非常精練而抽象的語言講話,沒人能聽懂,但他的語言是可逐步解釋成人能聽懂的語言,因為他的語言是由以下兩種形式的規則由人的語言逐步抽象上去的: ----------------------------------------------------------- (1) a---> (B1)(B2)....(Bm) (2)[(op1)(p2)...(pn)]---->[o(pn)][o(p(n-1))].....[o(p1)o] ----------------------------------------------------------- 在這兩種形式中,從左到右均表示解釋.試寫一個魔王語言的解釋系統,把 他的話解釋成人能聽得懂的話. 2. 基本要求: 用下述兩條具體規則和上述規則形式(2)實現.設大寫字母表示魔王語言的詞匯 小寫字母表示人的語言的詞匯 希臘字母表示可以用大寫字母或小寫字母代換的變量.魔王語言可含人的詞匯. (1) B --> tAdA (2) A --> sae 3. 測試數據: B(ehnxgz)B 解釋成 tsaedsaeezegexenehetsaedsae若將小寫字母與漢字建立下表所示的對應關系,則魔王說的話是:"天上一只鵝地上一只鵝鵝追鵝趕鵝下鵝蛋鵝恨鵝天上一只鵝地上一只鵝". | t | d | s | a | e | z | g | x | n | h | | 天 | 地 | 上 | 一只| 鵝 | 追 | 趕 | 下 | 蛋 | 恨 |
上傳時間： 2014-12-02
上傳用戶：jkhjkh1982
We have a group of N items (represented by integers from 1 to N), and we know that there is some total order defined for these items. You may assume that no two elements will be equal (for all a, b: a<b or b<a). However, it is expensive to compare two items. Your task is to make a number of comparisons, and then output the sorted order. The cost of determining if a < b is given by the bth integer of element a of costs (space delimited), which is the same as the ath integer of element b. Naturally, you will be judged on the total cost of the comparisons you make before outputting the sorted order. If your order is incorrect, you will receive a 0. Otherwise, your score will be opt/cost, where opt is the best cost anyone has achieved and cost is the total cost of the comparisons you make (so your score for a test case will be between 0 and 1). Your score for the problem will simply be the sum of your scores for the individual test cases.
標簽： represented integers group items
上傳時間： 2016-01-17
上傳用戶：jeffery
The XML Toolbox converts MATLAB data types (such as double, char, struct, complex, sparse, logical) of any level of nesting to XML format and vice versa. For example, >> project.name = MyProject >> project.id = 1234 >> project.param.a = 3.1415 >> project.param.b = 42 becomes with str=xml_format(project, off ) "<project> <name>MyProject</name> <id>1234</id> <param> <a>3.1415</a> <b>42</b> </param> </project>" On the other hand, if an XML string XStr is given, this can be converted easily to a MATLAB data type or structure V with the command V=xml_parse(XStr).
標簽： converts Toolbox complex logical
上傳時間： 2016-02-12
上傳用戶：a673761058
漢諾塔！！！ Simulate the movement of the Towers of Hanoi puzzle Bonus is possible for using animation eg. if n = 2 A→B A→C B→C if n = 3 A→C A→B C→B A→C B→A B→C A→C
標簽： the animation Simulate movement
上傳時間： 2017-02-11
上傳用戶：waizhang
