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VD5026，VD5027是CMOS大規(guī)模數(shù)字集成電路(見(jiàn)圖1)。前者是編碼器，后者是譯碼器。他們組合應(yīng)用起來(lái)構(gòu)成一個(gè)發(fā)射—接收數(shù)字編譯碼系統(tǒng)。
上傳時(shí)間： 2013-12-26
上傳用戶：jennyzai
放大電路靜態(tài)工作點(diǎn)的穩(wěn)定問(wèn)題 溫度對(duì)靜態(tài)工作點(diǎn)的影響 射極偏置電路 1. 基極分壓式射極偏置電路 2. 含有雙電源的射極偏置電路 3. 含有恒流源的射極偏置電路
標(biāo)簽： 放大電路 靜態(tài)工作點(diǎn)
上傳時(shí)間： 2014-01-04
上傳用戶：wentian_e
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來(lái)了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見(jiàn)設(shè)計(jì)中可能出現(xiàn)的各種問(wèn)題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來(lái)說(shuō)，最令人頭大的莫過(guò)于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過(guò)較長(zhǎng)的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（SI）問(wèn)題。本章就是圍繞信號(hào)完整性的問(wèn)題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來(lái)...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過(guò)孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2014-05-15
上傳用戶：dudu1210004
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESIM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSIM 進(jìn)行后仿真......................................................................2732.1 用BOARDSIM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2014-04-18
上傳用戶：wpt
設(shè)計(jì)了一種以FX3U系列PLC為控制核心的太陽(yáng)能自動(dòng)跟蹤控制系統(tǒng)。該跟蹤控制系統(tǒng)將視日運(yùn)動(dòng)軌跡跟蹤與傳感器跟蹤相結(jié)合，即第一級(jí)采用視日運(yùn)動(dòng)軌跡跟蹤，初步跟蹤太陽(yáng)的運(yùn)行軌跡，第二級(jí)采用傳感器跟蹤校正，并采用雙軸式跟蹤調(diào)整裝置。系統(tǒng)還設(shè)計(jì)了時(shí)間顯示模塊，能夠顯示實(shí)時(shí)時(shí)間，同時(shí)也可以對(duì)時(shí)間進(jìn)行實(shí)時(shí)調(diào)整。
標(biāo)簽： PLC 太陽(yáng)能 跟蹤控制 系統(tǒng)設(shè)計(jì)
上傳時(shí)間： 2013-12-30
上傳用戶：hz07104032
數(shù)控開(kāi)關(guān)電源設(shè)計(jì)及原理分析
標(biāo)簽： 數(shù)控開(kāi)關(guān) 分 電源設(shè)計(jì)
上傳時(shí)間： 2013-12-20
上傳用戶：sclyutian
TI33072高轉(zhuǎn)換率單電源運(yùn)算放大器
標(biāo)簽： 33072 TI tl 轉(zhuǎn)換
上傳時(shí)間： 2014-11-30
上傳用戶：rtsm07
很好用的軟件 VIPER開(kāi)關(guān)電源
標(biāo)簽： VIPER 開(kāi)關(guān)電源 設(shè)計(jì)軟件
上傳時(shí)間： 2014-01-05
上傳用戶：18752787361
關(guān)于開(kāi)關(guān)電源的設(shè)計(jì)較全面
標(biāo)簽： 開(kāi)關(guān)電源設(shè)計(jì)
上傳時(shí)間： 2013-11-25
上傳用戶：wanqunsheng
如何在PCB的設(shè)計(jì)中注意到電磁兼容的問(wèn)題，這里有你需要的問(wèn)題
上傳時(shí)間： 2013-11-25
上傳用戶：jcljkh
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