ExpressPCB 是一款免費的PCB設計軟件，簡單實使。可以畫雙層板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit BOARDs is simple for the beginner and efficient for the professional. Our BOARD manufacturing service makes top quality two and four layer PCBs. Use our MiniBOARD service and pay only $51 for three BOARDs (plus $8 shipping).
標簽： ExpressPCB PCB 設計軟件
上傳時間： 2013-11-15
上傳用戶：lchjng
superpro 3000u 驅動 PIC16C65B@QFP44 [SA245] PIC16C65B: Part number QFP44: Package in QFP44 SA245: Adapter purchase number AM29DL320GT@FBGA48 [SA642+B026] AM29DL320GT: Part number FBGA48: Package in FBGA48 SA642: Adapter purchase number (Top BOARD with socket) B026: Adapter purchase number (Bottom BOARD, exchangable for different parts) 87C196CA@PLCC68(universal adapter) [PEP+S414T] 87C196CA: Part number PLCC68: Package in PLCC68 universal adapter: this adapter is valid for all parts in this package PEP: The PEP (Pin-driver Expansion Pack necessary to work with the adapter S414T) S414T: Adapter purchase number (Universal for all parts in this package) S71PL127J80B@FBGA64(special adapter) [(SA642A-B079A-Y096AF001)] S71PL127J80B: Part number FBGA64: Package in FBGA64 special adapter: this adapter is valid for this
上傳時間： 2013-10-23
上傳用戶：Avoid98
ExpressPCB 是一款免費的PCB設計軟件，簡單實使。可以畫雙層板。 Our Free PCB software is a snap to learn and use. For the first time, designing circuit BOARDs is simple for the beginner and efficient for the professional. Our BOARD manufacturing service makes top quality two and four layer PCBs. Use our MiniBOARD service and pay only $51 for three BOARDs (plus $8 shipping).
標簽： ExpressPCB PCB 設計軟件
上傳時間： 2013-10-09
上傳用戶：1047385479
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit BOARD (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
標簽： Considerations Guidelines and Design
上傳時間： 2013-11-09
上傳用戶：ls530720646
使用Nios II軟件構建工具 This chapter describes the Nios® II Software Build Tools (SBT), a set of utilities and scripts that creates and builds embedded C/C++ application projects, user library projects, and BOARD support packages (BSPs). The Nios II SBT supports a repeatable, scriptable, and archivable process for creating your software product. You can invoke the Nios II SBT through either of the following user interfaces: ■ The Eclipse™ GUI ■ The Nios II Command Shell The purpose of this chapter is to make you familiar with the internal functionality of the Nios II SBT, independent of the user interface employed.
上傳時間： 2013-10-12
上傳用戶：china97wan
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the BOARD and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
This application note shows how to achieve low-cost, efficient serial configuration for Spartan FPGA designs. The approachrecommended here takes advantage of unused resources in a design, thereby reducing the cost, part count, memory size,and BOARD space associated with the serial configuration circuitry. As a result, neither processor nor PROM needs to be fullydedicated to performing Spartan configuration.In particular, information is provided on how the idle processing time of an on-BOARD controller can be used to loadconfiguration data from an off-BOARD source. As a result, it is possible to upgrade a Spartan design in the field by sending thebitstream over a network.
上傳時間： 2013-11-01
上傳用戶：wojiaohs
Design techniques for electronic systems areconstantly changing. In industries at the heart of thedigital revolution, this change is especially acute.Functional integration, dramatic increases incomplexity, new standards and protocols, costconstraints, and increased time-to-market pressureshave bolstered both the design challenges and theopportunities to develop modern electronic systems.One trend driving these changes is the increasedintegration of core logic with previously discretefunctions to achieve higher performance and morecompact BOARD designs.
上傳時間： 2013-11-23
上傳用戶：kangqiaoyibie
This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible Interface (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display interface on the BOARD. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation BOARD
上傳時間： 2013-11-23
上傳用戶：shen_dafa
歡迎使用 PowerPCB 教程。本教程描述了 PADS-PowerPCB 的絕大部分功能和特點，以及使用的各個過程，這些功能包括： · 基本操作 · 建立元件(Component) · 建立板子邊框線(BOARD outline) · 輸入網表(Netlist) · 設置設計規則(Design Rule) · 元件(Part)的布局(Placement) · 手工和交互的布線 · SPECCTRA全自動布線器(Route Engine) · 覆銅(Copper Pour) · 建立分隔/混合平面層(Split/mixed Plane) · Microsoft的目標連接與嵌入(OLE)(Object Linking Embedding) · 可選擇的裝配選件(Assembly options) · 設計規則檢查(Design Rule Check) · 反向標注(Back Annotation) · 繪圖輸出(Plot Output) 使用本教程后，你可以學到印制電路板設計和制造的許多基本知識。
上傳時間： 2013-10-08
上傳用戶：x18010875091
