In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
One of the most misunderstood constructs in the Verilog language is the nonblockingassignment. Even very experienced Verilog designers do not fully understand how nonblockingassignments are scheduled in an IEEE compliant Verilog simulator and do not understand whenand why nonblocking assignments should be used. This paper details how Verilog blocking andnonblocking assignments are scheduled, gives important coding guidelines to infer correctsynthesizable logic and details coding styles to avoid Verilog simulation race conditions
Methods for designing a maintenance simulation training system for certain kind of radio are introduced. Fault modeling method is used to establish the fault database. The system sets up some typical failures， follow the prompts trainers can locate the fault source and confirm the type to accomplish corresponding fault maintenance training. A training evaluation means is given to examining and evaluating the training performance. The system intuitively and vividly shows the fault maintenance process， it can not only be used in teaching， but also in daily maintenance training to efficiently improve the maintenance operation level. Graphical programming language LabVIEW is used to develop the system platform.
This application note is an overview discussion of theLinear Technology SPICE macromodel library. It assumeslittle if any prior knowledge of this software library or itshistory. However, it does assume familiarity with both theanalog simulation program SPICE (or one of its manyderivatives), and modern day op amps, including bipolar,JFET, and MOSFET amplifier technologies
分析了調幅信號和載波信號之間的相位差與調制信號的極性的對應關系,得出了相敏檢波電路輸出電壓的極性與調制信號的極性有對應關系的結論。為了驗證相敏檢波電路的這一特性,給出3 個電路方案,分別選用理想元件和實際元件,采用Multisim 對其進行仿真實驗,直觀形象地演示了相敏檢波電路的鑒相特性,是傳統的實際操作實驗所不可比擬的。關鍵詞:相敏檢波;鑒相特性;Multisim;電路仿真
Abstract : The corresponding relation between modulation signal polarity and difference phases of amplitudemodulated signal and the carrier signal ,the polarity of phase2sensitive detecting circuit output voltage and the polarity of modulation signal are correspondent . In order to verify this characteristic ,three elect ric circuit s plans are produced ,idea element s and actual element s are selected respectively. Using Multisim to carry on a simulation experiment ,and then demonst rating the phase detecting characteristic of the phase sensitive circuit vividly and directly. Which is t raditional practical experience cannot be com pared.Keywords :phase sensitive detection ;phase2detecting characteristic ;Multisim;circuit simulation
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
