The main objective of this book is to present all the relevant informationrequired for RF and micro-wave power amplifier design includingwell-known and novel theoretical approaches and practical design techniquesas well as to suggest optimum design approaches effectively combininganalytical calculations and computer-aided design. This bookcan also be very useful for lecturing to promote the analytical way ofthinking with practical verification by making a bridge between theoryand practice of RF and microwave engineering. As it often happens, anew result is the well-forgotten old one. Therefore, the demonstrationof not only new results based on new technologies or circuit schematicsis given, but some sufficiently old ideas or approaches are also introduced,that could be very useful in modern practice or could contributeto appearance of new ideas or schematic techniques.
Abstract: This application note describes system-level characterization and modeling techniques for radio frequency (RF) and microwavesubsystem components. It illustrates their use in a mixed-signal, mixed-mode system-level simulation. The simulation uses an RF transmitterwith digital predistortion (DPD) as an example system. Details of this complex system and performance data are presented.
Abstract: This application note illustrates the flexibility of the MAX7060 ASK/FSK transmitter. While the currently available evaluationkit (EV kit) has been optimized for the device's use in a specific frequency band (i.e., 288MHz to 390MHz), this document addresseshow the EV kit circuitry can be modified for improved operation at 433.92MHz, a frequency commonly used in Europe. Twoalternative match and filter configurations are presented: one for optimizing drain efficiency, the other for achieving higher transmitpower. Features and capabilities of earlier Maxim industrial, scientific, and medical radio-frequency (ISM-RF) transmitters areprovided, allowing comparison of the MAX7060 to its predecessors. Several design guidelines and cautions for using the MAX7060are discussed.
同步技術(shù)是跳頻通信系統(tǒng)的關(guān)鍵技術(shù)之一，尤其是在快速跳頻通信系統(tǒng)中，常規(guī)跳頻通信通過(guò)同步字頭攜帶相關(guān)碼的方法來(lái)實(shí)現(xiàn)同步，但對(duì)于快跳頻來(lái)說(shuō)，由于是一跳或者多跳傳輸一個(gè)調(diào)制符號(hào)，難以攜帶相關(guān)碼。對(duì)此引入雙跳頻圖案方法，提出了一種適用于快速跳頻通信系統(tǒng)的同步方案。采用短碼攜帶同步信息，克服了快速跳頻難以攜帶相關(guān)碼的困難。分析了同步性能，仿真結(jié)果表明該方案同步時(shí)間短、虛警概率低、捕獲概率高，同步性能可靠。
Abstract:
Synchronization is one of the key techniques to frequency-hopping communication system， especially in the fast frequency hopping communication system. In conventional frequency hopping communication systems， synchronization can be achieved by synchronization-head which can be used to carry the synchronization information， but for the fast frequency hopping， Because modulation symbol is transmitted by per hop or multi-hop， it is difficult to carry the correlation code. For the limitation of fast frequency hopping in carrying correlation code， a fast frequency-hopping synchronization scheme with two hopping patterns is proposed. The synchronization information is carried by short code， which overcomes the difficulty of correlation code transmission in fast frequency-hopping. The performance of the scheme is analyzed， and simulation results show that the scheme has the advantages of shorter synchronization time， lower probability of false alarm， higher probability of capture and more reliable of synchronization.
解壓密碼：www.elecfans.com 隨著微電子技術(shù)的迅速發(fā)展以及集成電路規(guī)模不斷提高，對(duì)電路性能的設(shè)計(jì)
要求越來(lái)越嚴(yán)格，這勢(shì)必對(duì)用于大規(guī)模集成電路設(shè)計(jì)的EDA 工具提出越來(lái)越高的
要求。自1972 年美國(guó)加利福尼亞大學(xué)柏克萊分校電機(jī)工程和計(jì)算機(jī)科學(xué)系開發(fā)
的用于集成電路性能分析的電路模擬程序SPICE（Simulation Program with IC
Emphasis）誕生以來(lái)，為適應(yīng)現(xiàn)代微電子工業(yè)的發(fā)展，各種用于集成電路設(shè)計(jì)的
電路模擬分析工具不斷涌現(xiàn)。HSPICE 是Meta-Software 公司為集成電路設(shè)計(jì)中
的穩(wěn)態(tài)分析，瞬態(tài)分析和頻域分析等電路性能的模擬分析而開發(fā)的一個(gè)商業(yè)化通
用電路模擬程序，它在柏克萊的SPICE（1972 年推出），MicroSim公司的PSPICE
（1984 年推出）以及其它電路分析軟件的基礎(chǔ)上，又加入了一些新的功能，經(jīng)
過(guò)不斷的改進(jìn)，目前已被許多公司、大學(xué)和研究開發(fā)機(jī)構(gòu)廣泛應(yīng)用。HSPICE 可
與許多主要的EDA 設(shè)計(jì)工具，諸如Candence,Workview 等兼容，能提供許多重要
的針對(duì)集成電路性能的電路仿真和設(shè)計(jì)結(jié)果。采用HSPICE 軟件可以在直流到高
于100MHz 的微波頻率范圍內(nèi)對(duì)電路作精確的仿真、分析和優(yōu)化。在實(shí)際應(yīng)用中，
HSPICE能提供關(guān)鍵性的電路模擬和設(shè)計(jì)方案，并且應(yīng)用HSPICE進(jìn)行電路模擬時(shí)，
其電路規(guī)模僅取決于用戶計(jì)算機(jī)的實(shí)際存儲(chǔ)器容量。
The HSPICE Integrator Program enables qualified EDA vendors to integrate their products with the de facto standard HSPICE simulator, HSPICE RF simulator, and WaveView Analyzer™. In addition, qualified HSPICE Integrator Program members have access to HSPICE integrator application programming interfaces (APIs). Collaboration between HSPICE Integrator Program members will enable customers to achieve more thorough design verification in a shorter period of time from the improvements offered by inter-company EDA design solutions.
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
One of the most misunderstood constructs in the Verilog language is the nonblockingassignment. Even very experienced Verilog designers do not fully understand how nonblockingassignments are scheduled in an IEEE compliant Verilog simulator and do not understand whenand why nonblocking assignments should be used. This paper details how Verilog blocking andnonblocking assignments are scheduled, gives important coding guidelines to infer correctsynthesizable logic and details coding styles to avoid Verilog simulation race conditions
