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Backend

  • Complete Hotel Management System Backend Oracle

    Complete Hotel Management System Backend Oracle

    標簽: Management Complete Backend System

    上傳時間: 2017-07-02

    上傳用戶:ryb

  • Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write

    Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write natural Java objects and some simple configuration files, and Hibernate automates all the interaction between your objects and the database. You don t even need to know the database is there, and you can change from one database to another simply by changing a few statements in a configuration file. If you ve needed to add a database Backend to your application, don t put it off. It s much more fun than it used to be, and Hibernate: A Developer s Notebook shows you why.

    標簽: Hibernate persistence Developer you

    上傳時間: 2016-04-07

    上傳用戶:123啊

  • Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write

    Hibernate: A Developer s Notebook shows you how to use Hibernate to automate persistence: you write natural Java objects and some simple configuration files, and Hibernate automates all the interaction between your objects and the database. You don t even need to know the database is there, and you can change from one database to another simply by changing a few statements in a configuration file. If you ve needed to add a database Backend to your application, don t put it off. It s much more fun than it used to be, and Hibernate: A Developer s Notebook shows you why.

    標簽: Hibernate persistence Developer you

    上傳時間: 2017-08-17

    上傳用戶:曹云鵬

  • LoRaWAN Backend Interfaces 1.0 Specification 規范

    LoraWAN后臺架構,網絡協議和設計規范

    標簽: LoRaWAN

    上傳時間: 2021-11-28

    上傳用戶:kingwide

  • 超薄芯片Backend工藝分析及失效研究

    本文主要超薄芯片的背面金屬化中的一些問題,闡述了兩種主要的背面金屬化工藝的建立,并解決了這兩個工藝中關鍵問題,使得工藝獲得好的成品率,提高了產品的可靠性,實現了大規模量產。流程(一)介紹了一種通過技術轉移在上海先進半導體制造有限公司(ASMC)開發的一種特殊工藝,工藝采用特殊背面去應力工藝,通過機械應力和背銀沾污的控制,將背面金屬和硅片的黏附力和金硅接觸電阻大大改善。論文同時闡述了一種自創的檢驗黏附力的方法,通過這種方法的監控,大幅度提高了產品良率,本論文的研究課題來源于企業的大規模生產實踐,對于同類的低壓低導通電阻VDMOS產品有實用的參考意義。流程(二)討論了在半導體器件中應用最為廣泛的金-硅合金工藝的失效模式及其解決辦法。并介紹了我公司獨創的刻蝕-淀積-合金以及應力控制同時完成的方案。通過這種技術,使得金硅合金質量得到大步的提升,并同時大大減少了背金工藝中的碎片問題,為企業獲得了很好的效益。

    標簽: 超薄芯片 Backend工藝

    上傳時間: 2022-06-26

    上傳用戶:1208020161

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