The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder Ball fortheir
Suck Wrappers are a set of UNIX script files that sets up inn, an NNTP server, on a local machine so that suck can communicate with a News server supplied by an ISP . It also installs a set of wrapper scripts (based on the sample scripts provided with the suck tar Ball) that call suck with the correct settings to communicate with an ISP on a linux machine. (Tested on Redhat 7.2 and 9).
These instances, whenmapped to an N-dimensional space, represent a core set that can be
used to construct an approximation to theminimumenclosing Ball. Solving the SVMlearning
problem on these core sets can produce a good approximation solution in very fast speed.
For example, the core-vector machine [81] thus produced can learn an SVM for millions of
data in seconds.
