《器件封裝用戶向導》賽靈思產品封裝資料
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic pa...
This application note shows how a Xilinx CoolRunnerTM-II CPLD can be used as a simplelogical switch that can quickly and reliably select be...
XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接 The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high per...
Calculation of the Differential Impedance of Tracks on FR4 substrates There is a discrepancy between calculated and measured values of impedance for d...
解壓密碼:www.elecfans.com 隨著微電子技術的迅速發展以及集成電路規模不斷提高,對電路性能的設計 要求越來越嚴格,這勢必對用于大規模集成電路設計的EDA 工具提出越來越高的 要求。自1972 年美國加利福尼亞大學柏克萊分校電機工程和計算機科學系開發 的用于集成電路性能分析的電...