6小時學會labview,
labview Six Hour Course – Instructor Notes
This zip file contains material designed to give students a working knowledge of labview in a 6 hour timeframe. The contents are:
Instructor Notes.doc – this document.
labviewIntroduction-SixHour.ppt – a PowerPoint presentation containing screenshots and notes on the topics covered by the course.
Convert C to F (Ex1).vi – Exercise 1 solution VI.
Convert C to F (Ex2).vi – Exercise 2 solution subVI.
Thermometer-DAQ (Ex2).vi – Exercise 2 solution VI.
Temperature Monitor (Ex3).vi – Exercise 3 solution VI.
Thermometer (Ex4).vi – Exercise 4 solution subVI.
Convert C to F (Ex4).vi – Exercise 4 solution subVI.
Temperature Logger (Ex4).vi – Exercise 4 solution VI.
Multiplot Graph (Ex5).vi – Exercise 5 solution VI.
Square Root (Ex6).vi – Exercise 6 solution VI.
State Machine 1 (Ex7).vi – Exercise 7 solution VI.
The slides can be presented in two three hour labs, or six one hour lectures. Depending on the time and resources available in class, you can choose whether to assign the exercises as homework or to be done in class. If you decide to assign the exercises in class, it is best to assign them in order with the presentation. This way the students can create VI’s while the relevant information is still fresh. The notes associated with the exercise slide should be sufficient to guide the students to a solution. The solution files included are one possible solution, but by no means the only solution.
Agilent AN 154 S-Parameter Design Application Note S參數的設計與應用
The need for new high-frequency, solid-state circuitdesign techniques has been recognized both by microwaveengineers and circuit designers. These engineersare being asked to design solid state circuitsthat will operate at higher and higher frequencies.The development of microwave transistors andAgilent Technologies’ network analysis instrumentationsystems that permit complete network characterizationin the microwave frequency rangehave greatly assisted these engineers in their work.The Agilent Microwave Division’s lab staff hasdeveloped a high frequency circuit design seminarto assist their counterparts in R&D labs throughoutthe world. This seminar has been presentedin a number of locations in the United States andEurope.From the experience gained in presenting this originalseminar, we have developed a four-part videotape, S-Parameter Design Seminar. While the technologyof high frequency circuit design is everchanging, the concepts upon which this technologyhas been built are relatively invariant.The content of the S-Parameter Design Seminar isas follows:
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embeddedapplications. The ARM Cortex-M3 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC1850/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals. The ARMCortex-M3 CPU also includes an internal prefetch unit that supports speculativebranching.The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM data memory, a quad SPIFlash Interface (SPIFI), a State Configuration Timer (SCT) subsystem, two High-speedUSB controllers, Ethernet, LCD, an external memory controller, and multiple digital andanalog peripherals.
The LPC4350/30/20/10 are ARM Cortex-M4 based microcontrollers for embeddedapplications. The ARM Cortex-M4 is a next generation core that offers systemenhancements such as low power consumption, enhanced debug features, and a highlevel of support block integration.The LPC4350/30/20/10 operate at CPU frequencies of up to 150 MHz. The ARMCortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture withseparate local instruction and data buses as well as a third bus for peripherals, andincludes an internal prefetch unit that supports speculative branching. The ARMCortex-M4 supports single-cycle digital signal processing and SIMD instructions. Ahardware floating-point processor is integrated in the core.The LPC4350/30/20/10 include an ARM Cortex-M0 coprocessor, up to 264 kB of datamemory, advanced configurable peripherals such as the State Configurable Timer (SCT)and the Serial General Purpose I/O (SGPIO) interface, two High-speed USB controllers,Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals
本軟件是關于MAX338, MAX339的英文數據手冊：MAX338, MAX339 8通道/雙4通道、低泄漏、CMOS模擬多路復用器
The MAX338/MAX339 are monolithic, CMOS analog multiplexers (muxes). The 8-channel MAX338 is designed to connect one of eight inputs to a common output by control of a 3-bit binary address. The dual, 4-channel MAX339 is designed to connect one of four inputs to a common output by control of a 2-bit binary address. Both devices can be used as either a mux or a demux. On-resistance is 400Ω max, and the devices conduct current equally well in both directions.
These muxes feature extremely low off leakages (less than 20pA at +25°C), and extremely low on-channel leakages (less than 50pA at +25°C). The new design offers guaranteed low charge injection (1.5pC typ) and electrostatic discharge (ESD) protection greater than 2000V, per method 3015.7. These improved muxes are pin-compatible upgrades for the industry-standard DG508A and DG509A. For similar Maxim devices with lower leakage and charge injection but higher on-resistance, see the MAX328 and MAX329.
12864液晶時鐘顯示程序
LCD 地址變量
;**************變量的定義*****************
RS BIT P2.0 ;LCD數據/命令選擇端(H/L)
RW BIT P2.1 ;LCD讀/寫選擇端(H/L)
EP BIT P2.2 ;LCD使能控制
PSB EQU P2.3
RST EQU P2.5
PRE BIT P1.4 ;調整鍵(K1)
ADJ BIT P1.5 ;調整鍵(K2)
COMDAT EQU P0
LED EQU P0.3
YEAR DATA 18H ;年,月,日變量
MONTH DATA 19H
DATE DATA 1AH
WEEK DATA 1BH
HOUR DATA 1CH ;時,分,秒,百分之一秒變量
MIN DATA 1DH
SEC DATA 1EH
SEC100 DATA 1FH
STATE DATA 23H
LEAP BIT STATE.1 ;是否閏年標志1--閏年，0--平年
KEY_S DATA 24H ;當前掃描鍵值
KEY_V DATA 25H ;上次掃描鍵值
DIS_BUF_U0 DATA 26H ;LCD第一排顯示緩沖區
DIS_BUF_U1 DATA 27H
DIS_BUF_U2 DATA 28H
DIS_BUF_U3 DATA 29H
DIS_BUF_U4 DATA 2AH
DIS_BUF_U5 DATA 2BH
DIS_BUF_U6 DATA 2CH
DIS_BUF_U7 DATA 2DH
DIS_BUF_U8 DATA 2EH
DIS_BUF_U9 DATA 2FH
DIS_BUF_U10 DATA 30H
DIS_BUF_U11 DATA 31H
DIS_BUF_U12 DATA 32H
DIS_BUF_U13 DATA 33H
DIS_BUF_U14 DATA 34H
DIS_BUF_U15 DATA 35H
DIS_BUF_L0 DATA 36H ;LCD第三排顯示緩沖區
DIS_BUF_L1 DATA 37H
DIS_BUF_L2 DATA 38H
DIS_BUF_L3 DATA 39H
DIS_BUF_L4 DATA 3AH
DIS_BUF_L5 DATA 3BH
DIS_BUF_L6 DATA 3CH
DIS_BUF_L7 DATA 3DH
DIS_BUF_L8 DATA 3EH
DIS_BUF_L9 DATA 3FH
DIS_BUF_L10 DATA 40H
DIS_BUF_L11 DATA 41H
DIS_BUF_L12 DATA 42H
DIS_BUF_L13 DATA 43H
DIS_BUF_L14 DATA 44H
DIS_BUF_L15 DATA 45H
FLAG DATA 46H ;1-年，2-月，3-日，4-時，5-分，6-秒，7-退出調整。
DIS_H DATA 47H
DIS_M DATA 48H
DIS_S DATA 49H
Explain how to open the Waveform Viewer for Verification
? State how to insert nodes into the Waveform Viewer
? Tell how to assign Stimulus with the Stimulator Selector
This Application Note covers the basics of how to use Verilog as applied to ComplexProgrammable Logic Devices. Various combinational logic circuit examples, such asmultiplexers, decoders, encoders, comparators and adders are provided. Synchronous logiccircuit examples, such as counters and state machines are also provided.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
