BGA布線指南 BGA CHip PLACEMENT AND ROUTING RULE BGA是PCB上常用的組件，通常CPU、NORTH BRIDGE、SOUTH BRIDGE、AGP CHip、CARD BUS CHip…等，大多是以bga的型式包裝，簡言之，80﹪的高頻信號及特殊信號將會由這類型的package內拉出。因此，如何處理BGA package的走線，對重要信號會有很大的影響。 通常環繞在BGA附近的小零件，依重要性為優先級可分為幾類： 1. by pass。 2. clock終端RC電路。 3. damping（以串接電阻、排組型式出現；例如memory BUS信號） 4. EMI RC電路（以dampin、C、pull height型式出現；例如USB信號）。 5. 其它特殊電路（依不同的CHip所加的特殊電路；例如CPU的感溫電路）。 6. 40mil以下小電源電路組（以C、L、R等型式出現；此種電路常出現在AGP CHip or含AGP功能之CHip附近，透過R、L分隔出不同的電源組）。 7. pull low R、C。 8. 一般小電路組（以R、C、Q、U等型式出現；無走線要求）。 9. pull height R、RP。 中文DOC，共5頁，圖文并茂
上傳時間： 2013-04-24
上傳用戶：cxy9698
信號與信息處理是信息科學中近幾年來發展最為迅速的學科之一,隨著片上系統(SOC,System On CHip)時代的到來,FPGA正處于革命性數字信號處理的前沿?；贔PGA的設計可以在系統可再編程及在系統調試,具有吞吐量高,能夠更好地防止授權復制、元器件和開發成本進一步降低、開發時間也大大縮短等優點。然而,FPGA器件是基于SRAM結構的編程工藝,掉電后編程信息立即丟失,每次加電時,配置數據都必須重新下載,并且器件支持多種配置方式,所以研究FPGA器件的配置方案在FPGA系統設計中具有極其重要的價值,這也給用于可編程邏輯器件編程的配置接口電路和實驗開發設備提出了更高的要求。 本論文基于IEEE1149.1標準和USB2.0技術,完成了FPGA配置接口電路及實驗開發板的設計與實現。作者在充分理解IEEE1149.1標準和USB技術原理的基礎上,針對Altcra公司專用的USB數據配置電纜USB-Blaster,對其內部工作原理及工作時序進行測試與詳細分析,完成了基于USB配置接口的FPGA芯片開發實驗電路的完整軟硬件設計及功能時序仿真。作者最后進行了軟硬件調試,完成測試與驗證,實現了對Altera系列PLD的配置功能及實驗開發板的功能。 本文討論的USB下載接口電路被驗證能在Altera的QuartusII開發環境下直接使用,無須在主機端另行設計通信軟件,其兼容性較現有設計有所提高。由于PLD(Programmable Logic Device)廠商對其知識產權嚴格保密,使得基于USB接口的配置電路應用受到很大限制,同時也加大了自行對其進行開發設計的難度。 與傳統的基于PC并口的下載接口電路相比,本設計的基于USB下載接口電路及FPGA實驗開發板具有更高的編程下載速率、支持熱插拔、體積小、便于攜帶、降低對PC硬件傷害,且具備其它下載接口電路不具備的SignalTapII嵌入式邏輯分析儀和調試NiosII嵌入式軟核處理器等明顯優勢。從成本來看,本設計的USB配置接口電路及FPGA實驗開發板與其同類產品相比有較強的競爭力。
上傳時間： 2013-06-07
上傳用戶：2525775
·詳細說明：Actions 炬力 MP3 播放器2071、2073系列主控芯片 參考電路圖，完整電路圖。-Actions the torch strength MP3 player 2,071, 2,073 series hosts control the CHip reference circuit diagram, complete circuit diagram.
上傳時間： 2013-04-24
上傳用戶：amwfhv
讀取STM32芯片內部唯一的標識，用于加密等區別其他芯片的操作，有完整注釋，測試通過-STM32 CHip to read a unique identifier for the encryption and other differences other CHip operation, with complete notes, test
上傳時間： 2013-05-24
上傳用戶：793212294
With more and more multi-frequency clocks being used in today's CHips, especially in the communications field, it is often necessary to switch the source of a clock line while the CHip is running.
上傳時間： 2013-10-10
上傳用戶：1214209695
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal CHip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
標簽： Circuit Analog Design Porta
上傳時間： 2013-10-24
上傳用戶：songnanhua
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at CHip interfaces andwhere interconnections on CHip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上傳時間： 2014-12-23
上傳用戶：han_zh
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (CHip-to-CHip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
半導體的產品很多，應用的場合非常廣泛，圖一是常見的幾種半導體元件外型。半導體元件一般是以接腳形式或外型來劃分類別，圖一中不同類別的英文縮寫名稱原文為 PDID：Plastic Dual Inline Package SOP：Small Outline Package SOJ：Small Outline J-Lead Package PLCC：Plastic Leaded CHip Carrier QFP：Quad Flat Package PGA：Pin Grid Array BGA：Ball Grid Array 雖然半導體元件的外型種類很多，在電路板上常用的組裝方式有二種，一種是插入電路板的銲孔或腳座，如PDIP、PGA，另一種是貼附在電路板表面的銲墊上，如SOP、SOJ、PLCC、QFP、BGA。 從半導體元件的外觀，只看到從包覆的膠體或陶瓷中伸出的接腳，而半導體元件真正的的核心，是包覆在膠體或陶瓷內一片非常小的晶片，透過伸出的接腳與外部做資訊傳輸。圖二是一片EPROM元件，從上方的玻璃窗可看到內部的晶片，圖三是以顯微鏡將內部的晶片放大，可以看到晶片以多條銲線連接四周的接腳，這些接腳向外延伸並穿出膠體，成為晶片與外界通訊的道路。請注意圖三中有一條銲線從中斷裂，那是使用不當引發過電流而燒毀，致使晶片失去功能，這也是一般晶片遭到損毀而失效的原因之一。 圖四是常見的LED，也就是發光二極體，其內部也是一顆晶片，圖五是以顯微鏡正視LED的頂端，可從透明的膠體中隱約的看到一片方型的晶片及一條金色的銲線，若以LED二支接腳的極性來做分別，晶片是貼附在負極的腳上，經由銲線連接正極的腳。當LED通過正向電流時，晶片會發光而使LED發亮，如圖六所示。 半導體元件的製作分成兩段的製造程序，前一段是先製造元件的核心─晶片，稱為晶圓製造；後一段是將晶中片加以封裝成最後產品，稱為IC封裝製程，又可細分成晶圓切割、黏晶、銲線、封膠、印字、剪切成型等加工步驟，在本章節中將簡介這兩段的製造程序。
上傳時間： 2014-01-20
上傳用戶：蒼山觀海
RT7273是一顆完全跟TPS65251 PIN TO PIN 替換料號,一路進三路出,輸出電流可以做到3A/2A/2A;如有需求請聯系我：021-54262182 EXT 114(Eric) QQ：1187337351
上傳時間： 2013-11-24
上傳用戶：fairy0212
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