The phenomenon of electrostatic discharge (ESD) has been known for a long time, but
recently a growing interest has been observed in ESD in radio frequency (RF) technology
and ESD issues in RF applications.
Electrostatic discharge (ESD) phenomena have been known to mankind since the Greek
Empire when Thales of Miletus, one of the Seven Sages of Greece, noticed the attraction of
strands of hay to amber, leading to the coining of the word “electron.” Electrical discharge
and the guiding of electrical discharge (e.g., lightning) was of interest to Benjamin Franklin
in the 1700s, with the invention of the lightning rod. The lightning rod was mankind’s first
effort to guide the electrical discharge current of a lightning strike in a direction that would
not harm structures.
Dear Reader, this book project brings to you a unique study tool for ESD
protection solutions used in analog-integrated circuit (IC) design. Quick-start
learning is combined with in-depth understanding for the whole spectrum of cross-
disciplinary knowledge required to excel in the ESD field. The chapters cover
technical material from elementary semiconductor structure and device levels up
to complex analog circuit design examples and case studies.
The challenges associated with the design and implementation of Electro-
static Discharge (ESD) protection CIRCUITS become increasingly complex as
technology is scaled well into nano-metric regime. One must understand the
behavior of semiconductor devices under very high current densities, high
temperature transients in order to surmount the nano-meter ESD challenge.
As a consequence, the quest for suitable ESD solution in a given technology
must start from the device level. Traditional approaches of ESD design may
not be adequate as the ESD damages occur at successively lower voltages in
nano-metric dimensions.
This book on electrostatic discharge phenomena is essentially a translation and
update ofa Swedish edition from 1992.
The book is intended for people working with electronic CIRCUITS and
equipments, in application and development. All personnel should be aware of the
ESD-hazards, especially those responsible for quality. ESD-prevention is a part of
TQM (Total Quality Management). The book is also usable for courses on the
subject.
Since electronic equipment was first developed, static electricity has been a
source of problems for users and designers. In the last few years, however,
electrostatic discharge (ESD) has become a source of major problems. This
has occurred because newer electronic devices, such as integrated CIRCUITS,
are much more susceptible to ESD problems than previous devices, such as
vacuum tubes. Another trend compounding this ESD susceptibility problem
is the spread of sophisticated equipment into home and office environments
where ESD is quite common.
In the field of electricity, electrostatics, and circuit theory, there are many discoveries and
accomplishments that have lead to the foundation of the field of electrostatic discharge
(ESD) phenomenon. Below is a chronological list of key events that moved the field of
electrostatics forward:
ESD is a crucial factor for integrated CIRCUITS and influences their quality and reliability.
Today increasingly sensitive processes with deep sub micron structures are developed. The
integration of more and more functionality on a single chip and saving of chip area is
required. Integrated CIRCUITS become more susceptible to ESD/EOS related damages.
However, the requirements on ESD robustness especially for automotive applications are
increasing. ESD failures are very often the reason for redesigns. Much research has been
conducted by semiconductor manufacturers on ESD robust design.
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-
level metal interconnects for high-density Integrated CIRCUITS (IC), is also readily adaptable as an enabling technology
in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not
only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film
issues generated by severe topography, but also enables far greater flexibility with process complexity and associated
designs. T
The first edition of the book was one of the elements of my habilitation (a quali-
fication above a Ph.D., which is a necessary step for obtaining the title of a
professor in Poland and other European countries), and as a result it was subse-
quently very carefully reviewed by four reviewers. The habilitation was a success.
Using the insightful comments from my reviewers, I have improved the current
version and eliminated some typographic errors that were initially overlooked.
