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CPLD-PCI

  • Interface 8051 to Coolrunner CPLD(Xilinx App)

    Interface 8051 to Coolrunner CPLD(Xilinx App)

    標(biāo)簽: Coolrunner Interface Xilinx 8051

    上傳時(shí)間: 2013-09-05

    上傳用戶:bcjtao

  • 該工程文件實(shí)現(xiàn)ARM系統(tǒng)中CPLD的邏輯工作

    該工程文件實(shí)現(xiàn)ARM系統(tǒng)中CPLD的邏輯工作,起到外圍資源的邏輯地址譯碼功能

    標(biāo)簽: CPLD ARM 工程

    上傳時(shí)間: 2013-09-05

    上傳用戶:zcs023047

  • cpld的入門交流:CPLD的跑馬燈一個(gè)簡易型cpld試驗(yàn)電路用VHDL語言

    cpld的入門交流:CPLD的跑馬燈一個(gè)簡易型cpld試驗(yàn)電路用VHDL語言遍的

    標(biāo)簽: cpld CPLD VHDL 交流

    上傳時(shí)間: 2013-09-06

    上傳用戶:blacklee

  • 用VHDL語言在CPLD上實(shí)現(xiàn)串行通信

    用VHDL語言在CPLD上實(shí)現(xiàn)串行通信

    標(biāo)簽: VHDL CPLD 語言 串行通信

    上傳時(shí)間: 2013-09-06

    上傳用戶:q3290766

  • 這是可編程邏輯器件(CPLD)初學(xué)者的入門級文章

    這是可編程邏輯器件(CPLD)初學(xué)者的入門級文章,僅供參考。

    標(biāo)簽: CPLD 可編程邏輯器件 初學(xué)者 入門級

    上傳時(shí)間: 2013-09-06

    上傳用戶:dudu121

  • CPLD/FPGA數(shù)字系統(tǒng)設(shè)計(jì)電子書

    CPLD/FPGA是目前誚用最為廣泛的兩種可編程專用集成電路(ASIC),特別適合于產(chǎn)品的樣品開發(fā)與小批量生產(chǎn)。本書從現(xiàn)代電子系統(tǒng)設(shè)計(jì)的角度出發(fā),以全球著名的可編程邏輯器件供應(yīng)商Xilinx公司的產(chǎn)品為背景,系統(tǒng)全面地介紹該公司的CPLD/FPGA產(chǎn)品的結(jié)構(gòu)原理、性能特點(diǎn)、設(shè)計(jì)方法以及相應(yīng)的EDA工具軟件,重點(diǎn)介紹CPLD/FPGA在數(shù)字系統(tǒng)設(shè)計(jì)、數(shù)字通信與數(shù)字信號處理等領(lǐng)域中的應(yīng)用。\r\n 本書內(nèi)容新穎、技術(shù)先進(jìn)、由淺入深,既有關(guān)于大規(guī)模可編輯邏輯器件的系統(tǒng)論述,又有豐富的設(shè)計(jì)應(yīng)用實(shí)例。對于從事各類

    標(biāo)簽: CPLD FPGA 數(shù)字系統(tǒng)設(shè)計(jì) 電子書

    上傳時(shí)間: 2013-09-06

    上傳用戶:Maple

  • 用cpld實(shí)現(xiàn)曼徹斯特編碼

    用cpld實(shí)現(xiàn)曼徹斯特編碼\r\n用verilog HDL進(jìn)行曼徹斯特編碼,用于通信中

    標(biāo)簽: cpld 曼徹斯特編碼

    上傳時(shí)間: 2013-09-07

    上傳用戶:786334970

  • PCI ExpressTM Architecture

    PCI ExpressTM Architecture Add-in Card Compliance Checklist for the PCI Express Base 1.0a SpecificationThe PCI Special Interest Group disclaims all warranties and liability for the use of this document and the information contained herein and assumes no responsibility for any errors that may appear in this document, nor does the PCI Special Interest Group make a commitment to update the information contained herein.Contact the PCI Special Interest Group office to obtain the latest revision of this checklistQuestions regarding the ths document or membership in the PCI Special Interest Group may be forwarded tPCI Special Interest Group5440 SW Westgate Drive #217Portland, OR 97221Phone: 503-291-2569Fax: 503-297-1090 DISCLAIMERThis document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or sample.  The PCI SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this specification.  No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.

    標(biāo)簽: Architecture ExpressTM PCI

    上傳時(shí)間: 2013-11-03

    上傳用戶:gy592333

  • pci e PCB設(shè)計(jì)規(guī)范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標(biāo)簽: pci PCB 設(shè)計(jì)規(guī)范

    上傳時(shí)間: 2013-10-15

    上傳用戶:busterman

  • PCI Express電源解決方案

      PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.

    標(biāo)簽: Express PCI 電源解決方案

    上傳時(shí)間: 2013-11-17

    上傳用戶:squershop

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