Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf
Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf...
Simulating Nuclear Events in a TCAD Model of a High-Density SEU Hardened SRAM Technology.pdf...
This application note is intended for system designers who require a hardware implementation overview of the development board features such as the p...
【摘要】本文結合作者多年的印制板設計經驗,著重印制板的電氣性能,從印制板穩定性、可靠性方面,來討論多層印制板設計的基本要求。【關鍵詞】印制電路板;表面貼裝器件;高密度互連;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High ...
討論、研究高性能覆銅板對它所用的環氧樹脂的性能要求,應是立足整個產業鏈的角度去觀察、分析。特別應從HDI多層板發展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發展特點,它的發展趨勢如何——這都是我們所要研究的高性能CCL發展趨勢和重點的基本依據。而HDI多層板的技術發展,又是由它的...
LLCR Pin Socket Testing with the Model 3732 High Density Matrix Card Computer processors (CPUs) today have come a long way from the computer processor...