16 relay output channels and 16 isolated digital input channels
LED indicators to show activated relays
Jumper selectable Form A/Form B-type relay output channel
Output status read-back
Keep relay output values when hot system reset
High-voltage isolation on input channels(2,500 VDC)
Hi ESD protection(2,00VDC)
High over-voltage protection(70VDC)
Wide input range(10~50VDC)
Interrupt handling capability
High-Density DB-62 connector
Board ID
The Cyclone® III PCI development board provides a hardware platform for developing and
prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a
High-Density of the memory to facilitate the design and development of FPGA designs which need
huge memory storage, and also includes Low-Voltage Differential Signaling (LVDS) interface of
the High-Speed Terasic Connectors (HSTCs) for extra high-speed interface application.
Behavioral models are used in games and computer graphics for
realistic simulation of massive crowds. In this paper, we present a
GPU based implementation of Reynolds [1987] algorithm for simulating
flocks of birds and propose an extension to consider environment
self occlusion. We performed several experiments and
the results showed that the proposed approach runs up to three
times faster than the original algorithm when simulating high density
crowds, without compromising significantly the original crowd
behavior.
The CommScope InstaPATCH? 360 and ReadyPATCH? solutions utilize a
standards-compliant multi-fiber connector to provide high density termination
capability. The connector is called an MPO (Multi-fiber Push On) connector by
the standards. In many cases, multi-fiber connector products are referred to as
MTP connectors. This document is intended to clarify the difference between the two terms – MPO and MTP.
貼片鋁電解電容封裝庫
SMD Aluminum Electrolytic Capacitors VE
Features
? 3 ~ 16φ, 85℃, 2,000 hours assured
? Chip type large capacitance capacitors
? Designed for surface mounting on high density PC board.
? RoHS Compliance
With billions of ‘people and things’ becoming increasingly connected, the need to combine the potential
of unlicensed and licensed wireless services has become an imperative for the operators, cities, high
density venues and players focused on key market opportunities such as IoT, big data and 5G. The WBA
has developed Vision 2020 to harness its experience of creating seamlessly interconnected wireless
services in new and emerging areas.
The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-
level metal interconnects for High-Density Integrated Circuits (IC), is also readily adaptable as an enabling technology
in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not
only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film
issues generated by severe topography, but also enables far greater flexibility with process complexity and associated
designs. T
