Abstract: How can an interface change a happy face to a sad face? Engineers have happy faces when an interface works properly.Sad faces indicate failure somewhere. Because interfaces between microprocessors and ICs are simple—even easy—they are oftenignored until interface failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to interface tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.
深入理解計算機(jī)系統(tǒng)（computer system：a programmer s perpective)是一本非常經(jīng)典的教材，國內(nèi)外很多大學(xué)都采用此教材講授ICs課程（introduction to computer system) 本代碼是該書配套的一個實驗的實現(xiàn)，（代碼優(yōu)化，圖形學(xué)相關(guān)）得了滿分哦！
The Ralink 802.11n Chipset family provides solutions for
PCI, PCIe and USB interfaces with both 2.4 and 2.4/5GHz
suppport. Each chipset consists of two highly integrated ICs
(RFIC and BB/MAC IC) that fully comply with current draft
IEEE 802.11n and IEEE 802.11a/b/g standards.
The Inter IC bus or I2C bus is a simple bidirectional two wire bus designed primarily for general control
and data transfer communication between ICs.
Some of the features of the I2C bus are:
• Two signal lines, a serial data line (SDA) and a serial clock line (SCL), and ground are required. A
12V supply line (500mA max.) for powering the peripherals often may be present.
• Each device connected to the bus is software addressable by a unique address and simple
master/ slave relationships exist at all times masters can operate as master-transmitters or as
master-receivers.
• The I2C bus is a true multi-master bus including collision detection and arbitration to prevent data
corruption if two or more masters simultaneously initiate data transfer systems.
• Serial, 8-bit oriented, bidirectional data transfers can be made at up to 100 KBit/s in the standard
mode or up to 400 KBit/s in the fast mode.
A major societal challenge for the decades to come will be the delivery of effective
medical services while at the same time curbing the growing cost of healthcare.
It is expected that new concepts-particularly electronically assisted healthcare will
provide an answer. This will include new devices, new medical services as well
as networking. On the device side, impressive innovation has been made possible
by micro- and nanoelectronICs or CMOS Integrated Circuits. Even higher accuracy
and smaller form factor combined with reduced cost and increased convenience
of use are enabled by incorporation of CMOS IC design in the realization of biomedical
systems. The compact hearing aid devices and current pacemakers are
good examples of how CMOS ICs bring about these new functionalities and services
in the medical field. Apart from these existing applications, many researchers
are trying to develop new bio-medical solutions such as Artificial Retina, Deep
Brain Stimulation, and Wearable Healthcare Systems. These are possible by combining
the recent advances of bio-medical technology with low power CMOS IC
technology.
This paper reviews key factors to practical ESD
protection design for RF and analog/mixed-signal (AMS) ICs,
including general challenges emerging, ESD-RFIC interactions,
RF ESD design optimization and prediction, RF ESD design
characterization, ESD-RFIC co-design technique, etc. Practical
design examples are discussed. It means to provide a systematic
and practical design flow for whole-chip ESD protection design
optimization and prediction for RF/AMS ICs to ensure 1 st Si
design success.
