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IN-CIRCUIT-DEBUGGER

  • 光電轉(zhuǎn)換電路設(shè)計(jì)

    OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.

    標(biāo)簽: 光電轉(zhuǎn)換 電路設(shè)計(jì)

    上傳時(shí)間: 2013-10-27

    上傳用戶:落花無痕

  • 模擬電路設(shè)計(jì)CMOS Analog Circuit Desi

    I.1 IntroductionI.2 Analog Integrated Circuit DesignI.3 Technology OverviewI.4 NotationI.5 Analog Circuit Analysis Techniques

    標(biāo)簽: Circuit Analog CMOS Desi

    上傳時(shí)間: 2013-10-29

    上傳用戶:jokey075

  • 射頻集成電路設(shè)計(jì)John Rogers(Radio Freq

    Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.

    標(biāo)簽: Rogers Radio John Freq

    上傳時(shí)間: 2014-12-23

    上傳用戶:han_zh

  • Creating Safe State Machines(Mentor)

      Finite state machines are widely used in digital circuit designs. Generally, when designing a state machine using an HDL, the synthesis tools will optimize away all states that cannot be reached and generate a highly optimized circuit. Sometimes, however, the optimization is not acceptable. For example, if the circuit powers up in an invalid state, or the circuit is in an extreme working environment and a glitch sends it into an undesired state, the circuit may never get back to its normal operating condition.

    標(biāo)簽: Creating Machines Mentor State

    上傳時(shí)間: 2013-10-08

    上傳用戶:wangzhen1990

  • PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

    Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

    標(biāo)簽: Considerations Guidelines and Design

    上傳時(shí)間: 2013-10-14

    上傳用戶:ysystc699

  • 提升PCB設(shè)計(jì)能力的一本好書The Circuit Designers Companion

    The Circuit Designer’s Companion Second edition Tim Williams

    標(biāo)簽: Designers Companion Circuit PCB

    上傳時(shí)間: 2013-11-04

    上傳用戶:fredguo

  • 開關(guān)電源EMI設(shè)計(jì)(英文版)

    Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.

    標(biāo)簽: EMI 開關(guān)電源 英文

    上傳時(shí)間: 2013-11-10

    上傳用戶:1595690

  • pci e PCB設(shè)計(jì)規(guī)范

    This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.  

    標(biāo)簽: pci PCB 設(shè)計(jì)規(guī)范

    上傳時(shí)間: 2013-10-15

    上傳用戶:busterman

  • Solutions for LED Driver Overvoltage Protection

    Boost LED drivers are often used to drive LEDs in series. If an LED fails while open,overvoltage protection (OVP) is necessary to avoid the damage to a boost integrated circuit (IC) or output capacitor. This application report presents the solutions to increase the TPS61043 LED driver OVP threshold.

    標(biāo)簽: Overvoltage Protection Solutions Driver

    上傳時(shí)間: 2013-10-14

    上傳用戶:jiangfire

  • 簡(jiǎn)單、高效USB電源管理IC解決方案

      Linear Technology offers a variety of devices that simplifyconverting power from a USB cable, but the LTC®3455represents the highest level of functional integration yet. The LTC3455 seamlessly manages power flowbetween an AC adapter, USB cable and Li-ion battery,while complying with USB power standards, all from a4mm × 4mm QFN package. In addtion, two high efficiencysynchronous buck converters generate low voltage railswhich most USB-powered peripherals require. TheLTC3455 also provides power-on reset signals for themicroprocessor, a Hot SwapTM output for poweringmemory cards as well as an uncommitted gain blocksuitable for use as a low-battery comparator or an LDOcontroller. The PCB real estate required for the entire USBpower control circuit and two DC/DC converters is only225mm2.

    標(biāo)簽: USB 電源管理IC 方案

    上傳時(shí)間: 2013-11-02

    上傳用戶:名爵少年

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