Algorithms for programmers
This draft is Intended to turn into a book about selected algorithms. The audience in mind are programmers
who are interested in the treated algorithms and actually want to have/create working and
reasonably optimized code.
Free Promotional Sample: for J2EE This e-book is Intended for the exclusive use of,and distribution among, members of the developer community. Only registered members of the
This book is Intended as a thorough introduction to both PCI and PCI-X. Is as a “companion” to the specifications. If you’re designing boards or systems using offthe-shelf PCI interface silicon, this book together with the silicon vendor’s data sheets should be sufficient for your needs. On the other hand, if your goal is to design PCI silicon, motherboards or backplanes, you will undoubtedly need to reference the specifications for additional detail.
This book is Intended to be a complete and useful reference to the unified modeling language (UML) for the developer,architect,project manager,sysetem engineer,programmer,analyst,contracting officer,customer,and anyone else who needs to specify,design,build,or understand complex software system.
This application note is Intended for system designers who require a hardware
implementation overview of the development board features such as the power supply, the
clock management, the reset control, the boot mode settings and the debug management. It
shows how to use the High-density and Medium-density STM32F10xxx product families and
describes the minimum hardware resources required to develop an STM32F10xxx
application.
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is Intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are Intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is Intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
PCI ExpressTM is the third generation of PCI (PeripheralComponent Interconnect) technology used to connect I/Operhipheral devices in computer systems. It is Intended asa general purpose I/O device interconnect that meets theneeds of a wide variety of computing platforms such asdesktop, mobile, server and communications. It alsospecifies the electrical and mechanical attributes of thebackplane, connectors and removable cards in thesesystems.
The LTM8020, LTM8021, LTM8022 and LTM8023 μModule®regulators are complete easy-to-use encapsulated stepdownDC/DC regulators Intended to take the pain and aggravationout of implementing a switching power supplyonto a system board. With a μModule regulator, you onlyneed an input cap, output cap and one or two resistorsto complete the design. As one might imagine, this highlevel of integration greatly simplifi es the task of printedcircuit board design, reducing the effort to four categories:component footprint generation, component placement,routing the nets, and thermal vias.
