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InterfACe

InterfACe是面向對象編程語言中接口操作的關鍵字,功能是把所需成員組合起來,用來封裝一定功能的集合。它好比一個模板,在其中定義了對象必須實現的成員,通過類或結構來實現它。接口不能直接實例化,即ICountic=newiCount()是錯的。接口不能包含成員的任何代碼,只定義成員本身。接口成員的具體代碼由實現接口的類提供。接口使用InterfACe關鍵字進行聲明。
  • XAPP740利用AXI互聯設計高性能視頻系統

    This application note covers the design considerations of a system using the performance features of the LogiCORE™ IP Advanced eXtensible InterfACe (AXI) Interconnect core. The design focuses on high system throughput through the AXI Interconnect core with F MAX  and area optimizations in certain portions of the design. The design uses five AXI video direct memory access (VDMA) engines to simultaneously move 10 streams (five transmit video streams and five receive video streams), each in 1920 x 1080p format, 60 Hz refresh rate, and up to 32 data bits per pixel. Each VDMA is driven from a video test pattern generator (TPG) with a video timing controller (VTC) block to set up the necessary video timing signals. Data read by each AXI VDMA is sent to a common on-screen display (OSD) core capable of multiplexing or overlaying multiple video streams to a single output video stream. The output of the OSD core drives the DVI video display InterfACe on the board. Performance monitor blocks are added to capture performance data. All 10 video streams moved by the AXI VDMA blocks are buffered through a shared DDR3 SDRAM memory and are controlled by a MicroBlaze™ processor. The reference system is targeted for the Virtex-6 XC6VLX240TFF1156-1 FPGA on the Xilinx® ML605 Rev D evaluation board

    標簽: XAPP 740 AXI 互聯

    上傳時間: 2013-11-23

    上傳用戶:shen_dafa

  • XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接

    XAPP520將符合2.5V和3.3V I/O標準的7系列FPGA高性能I/O Bank進行連接  The I/Os in Xilinx® 7 series FPGAs are classified as either high range (HR) or high performance (HP) banks. HR I/O banks can be operated from 1.2V to 3.3V, whereas HP I/O banks are optimized for operation between 1.2V and 1.8V. In circumstances that require an HP 1.8V I/O bank to InterfACe with 2.5V or 3.3V logic, a range of options can be deployed. This application note describes methodologies for interfacing 7 series HP I/O banks with 2.5V and 3.3V systems

    標簽: XAPP FPGA Bank 520

    上傳時間: 2013-11-06

    上傳用戶:wentianyou

  • 基于Xilinx FPGA的雙輸出DC/DC轉換器解決方案

      Xilinx FPGAs require at least two power supplies: VCCINTfor core circuitry and VCCO for I/O InterfACe. For the latestXilinx FPGAs, including Virtex-II Pro, Virtex-II and Spartan-3, a third auxiliary supply, VCCAUX may be needed. Inmost cases, VCCAUX can share a power supply with VCCO.The core voltages, VCCINT, for most Xilinx FPGAs, rangefrom 1.2V to 2.5V. Some mature products have 3V, 3.3Vor 5V core voltages. Table 1 shows the core voltagerequirement for most of the FPGA device families. TypicalI/O voltages (VCCO) vary from 1.2V to 3.3V. The auxiliaryvoltage VCCAUX is 2.5V for Virtex-II Pro and Spartan-3, andis 3.3V for Virtex-II.

    標簽: Xilinx FPGA DC 輸出

    上傳時間: 2013-10-22

    上傳用戶:aeiouetla

  • 多層印制板設計基本要領

    【摘要】本文結合作者多年的印制板設計經驗,著重印制板的電氣性能,從印制板穩定性、可靠性方面,來討論多層印制板設計的基本要求。【關鍵詞】印制電路板;表面貼裝器件;高密度互連;通孔【Key words】Printed Circuit Board;Surface Mounting Device;High Density InterfACe;Via一.概述印制板(PCB-Printed Circuit Board)也叫印制電路板、印刷電路板。多層印制板,就是指兩層以上的印制板,它是由幾層絕緣基板上的連接導線和裝配焊接電子元件用的焊盤組成,既具有導通各層線路,又具有相互間絕緣的作用。隨著SMT(表面安裝技術)的不斷發展,以及新一代SMD(表面安裝器件)的不斷推出,如QFP、QFN、CSP、BGA(特別是MBGA),使電子產品更加智能化、小型化,因而推動了PCB工業技術的重大改革和進步。自1991年IBM公司首先成功開發出高密度多層板(SLC)以來,各國各大集團也相繼開發出各種各樣的高密度互連(HDI)微孔板。這些加工技術的迅猛發展,促使了PCB的設計已逐漸向多層、高密度布線的方向發展。多層印制板以其設計靈活、穩定可靠的電氣性能和優越的經濟性能,現已廣泛應用于電子產品的生產制造中。下面,作者以多年設計印制板的經驗,著重印制板的電氣性能,結合工藝要求,從印制板穩定性、可靠性方面,來談談多層制板設計的基本要領。

    標簽: 多層 印制板

    上傳時間: 2013-10-08

    上傳用戶:zhishenglu

  • Virtex-5 GTP Transceiver Wizar

    The LogiCORE™ GTP Wizard automates the task of creating HDL wrappers to configure the high-speed serial GTP transceivers in Virtex™-5 LXT and SXT devices. The menu-driven InterfACe allows one or more GTP transceivers to be configured using pre-definedtemplates for popular industry standards, or from scratch, to support a wide variety of custom protocols.The Wizard produces a wrapper, an example design, and a testbench for rapid integration and verification of the serial InterfACe with your custom function Features• Creates customized HDL wrappers to configureVirtex-5 RocketIO™ GTP transceivers• Users can configure Virtex-5 GTP transceivers toconform to industry standard protocols usingpredefined templates, or tailor the templates forcustom protocols• Included protocol templates provide support for thefollowing specifications: Aurora, CPRI, FibreChannel 1x, Gigabit Ethernet, HD-SDI, OBSAI,OC3, OC12, OC48, PCI Express® (PCIe®), SATA,SATA II, and XAUI• Automatically configures analog settings• Each custom wrapper includes example design, testbench; and both implementation and simulation scripts

    標簽: Transceiver Virtex Wizar GTP

    上傳時間: 2013-10-20

    上傳用戶:dave520l

  • 8259 VHDL代碼

    a8259 可編程中斷控制 altera提供 The a8259 is designed to simplify the implementation of the interrupt InterfACe  in 8088 and 8086  based microcomputer systems. The device is known as a programmable interrupt controller.  The a8259 receives and prioritizes up to 8 interrupts,  and in the cascade mode, this can be expanded up to  64 interrupts. An asynchronous reset and a clock input have been added to improve operation and reliability.

    標簽: 8259 VHDL 代碼

    上傳時間: 2015-01-02

    上傳用戶:panpanpan

  • HDMI一致性測試

      The high defi nition multimedia InterfACe (HDMI) is fastbecoming the de facto standard for passing digitalaudio and video data in home entertainment systems.This standard includes an I2C type bus called a displaydata channel (DDC) that is used to pass extended digitalInterfACe data (EDID) from the sinkdevice (such as adigital TV) to the source device (such as a digital A/Vreceiver). EDID includes vital information on the digitaldata formats that the sink device can accept. The HDMIspecifi cation requires that devices have less than 50pFof input capacitance on their DDC bus lines, which canbe very diffi cult to meet. The LTC®4300A’s capacitancebuffering feature allows devices to pass the HDMI DDCinput capacitance compliance test with ease.

    標簽: HDMI 測試

    上傳時間: 2013-11-21

    上傳用戶:tian126vip

  • 全功能SPI接口的設計與實現

    SPI(Serial Peripheral InterfACe,串行外圍接口)是Motorola公司提出的外圍接口協議,它采用一個串行、同步、全雙工的通信方式,解決了微處理器和外設之間的串行通信問題,并且可以和多個外設直接通信,具有配置靈活,結構簡單等優點。根據全功能SPI總線的特點,設計的SPI接口可以最大發送和接收16位數據;在主模式和從模式下SPI模塊的時鐘頻率最大可以達到系統時鐘的1/4,并且在主模式下可以提供具有四種不同相位和極性的時鐘供從模塊選擇;可以同時進行發送和接收操作,擁有中斷標志位和溢出中斷標志位。

    標簽: SPI 接口的設計

    上傳時間: 2013-11-11

    上傳用戶:himbly

  • 談集成電路的通用接口

    Abstract: How can an InterfACe change a happy face to a sad face? Engineers have happy faces when an InterfACe works properly.Sad faces indicate failure somewhere. Because InterfACes between microprocessors and ICs are simple—even easy—they are oftenignored until InterfACe failure causes sad faces all around. In this article, we discuss a common SPI error that can be almostimpossible to find in a large system. Links to InterfACe tutorial information are provided for complete information. Noise as a systemissue and ICs to minimize its effects are also described.

    標簽: 集成電路 通用接口

    上傳時間: 2013-11-18

    上傳用戶:zgz317

  • AN26與LTC1090的接口設計

    A collection of InterfACe applications between various microprocessors/ controllers and the LTC1090 family of data acquisition systems. The note is divided into sections specific to each InterfACe.

    標簽: 1090 LTC AN 26

    上傳時間: 2013-11-08

    上傳用戶:sssnaxie

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