Signal and system with matlab computing and simulink Modeling is a good book for communication student and engineer due to the methods and tools mentioned in the book
This book is intended to be a complete and useful reference to the unified Modeling language (UML) for the developer,architect,project manager,sysetem engineer,programmer,analyst,contracting officer,customer,and anyone else who needs to specify,design,build,or understand complex software system.
This paper covers the keynote address delivered by the
Chairman of the COST Action 285 at the Symposium. It outlines the
studies undertaken by the members of the Action with the objective of
enhancing existing Modeling and simulation tools and to develop new ones
for research in emerging multiservice telecommunication networks. The
paper shows how the scope of COST Action 285 has been enriched by the
contributions made at the Symposium.
In writing this text my intention was to collect together in a single place
practical predictive Modeling techniques, ideas and strategies that have been
proven to work but which are rarely taught in business schools, data science
courses or contained in any other single text.
·SystemVerilog is a rich set of extensions to the IEEE 1364-2001 Verilog Hardware Description Language (Verilog HDL). These extensions address two major aspects of HDL-based design. First, Modeling ver
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL Modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
Methods for designing a maintenance simulation training system for certain kind of radio are introduced. Fault Modeling method is used to establish the fault database. The system sets up some typical failures， follow the prompts trainers can locate the fault source and confirm the type to accomplish corresponding fault maintenance training. A training evaluation means is given to examining and evaluating the training performance. The system intuitively and vividly shows the fault maintenance process， it can not only be used in teaching， but also in daily maintenance training to efficiently improve the maintenance operation level. Graphical programming language LabVIEW is used to develop the system platform.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the Modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider Modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
