Abstract: Nonideal cable dispersive effects can affect system performance. This application note discusses the twomain loss effects related to cables (skin-effect and dielectric losses), and presents a simple method of Modeling thecable for use in standard SPICE simulators.
Abstract: This application note describes system-level characterization and Modeling techniques for radio frequency (RF) and microwavesubsystem components. It illustrates their use in a mixed-signal, mixed-mode system-level simulation. The simulation uses an RF transmitterwith digital predistortion (DPD) as an example system. Details of this complex system and performance data are presented.
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL Modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the Modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider Modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Program to simulate Rayleigh fading using a p-th order autoregressive model AR(p) according to
％ Baddour s work: "Autoregressive Modeling for fading channel simulation"
Demonstrates 1-D FDTD initial state formation. Please edit the FLAGS for demonstration of different cases. BASED ON "1-D Digital Waveguide Modeling for Improved Sound Synthesis".
This handbook presents a thorough overview in 45 chapters from more than 100 renowned experts in the field. It provides the tools to help overcome the problems of video storage, cataloging, and retrieval, by exploring content standardization and other content classification and analysis methods. The challenge of these complex problems make this book a must-have for video database practitioners in the fields of image and video processing, computer vision, multimedia systems, data mining, and many other diverse disciplines. Topics include video segmentation and summarization, archiving and retrieval, and Modeling and representation.
The creation of believable and endearing characters in computer
graphics presents a number of technical challenges, including the
Modeling, animation and rendering of complex shapes such as
heads, hands, and clothing.
