The MAX17600–MAX17605 devices are high-speedMOSFET drivers capable of sinking /sourcing 4A peakcurrents. The devices have various inverting and noninvertingpart options that provide greater flexibility incontrolling the MOSFET. The devices have internal logiccircuitry that prevents shoot-through during output-statchanges. The logic inputs are protected against voltagespikes up to +14V, regardless of VDD voltage. Propagationdelay time is minimized and matched between the dualchannels. The devices have very fast switching time,combined with short propagation delays (12ns typ),making them ideal for high-frequency circuits. Thedevices operate from a +4V to +14V single powersupply and typically consume 1mA of supply current.The MAX17600/MAX17601 have standard TTLinput logic levels, while the MAX17603 /MAX17604/MAX17605 have CMOS-like high-noise margin (HNM)input logic levels. The MAX17600/MAX17603 are dualinverting input drivers, the MAX17601/MAX17604 aredual noninverting input drivers, and the MAX17602 /MAX17605 devices have one noninverting and oneinverting input. These devices are provided with enablepins (ENA, ENB) for better control of driver operation.
The LTM4600 DC/DC μModule regulator is a complete highpower density stepdown regulator for 10A continuous (14Apeak) loads. The device has two voltage options: 20VINmaximum for the LTM4600EV and 28VIN maximum for theLTM4600HVEV each housed in a small 15mm ¥ 15mm ¥2.8mm LGA surface mount package.
For a variety of reasons, it is desirable to charge batteriesas rapidly as possible. At the same time, overchargingmust be limited to prolong battery life. Such limitation ofovercharging depends on factors such as the choice ofcharge termination technique and the use of multi-rate/multi-stage charging schemes. The majority of batterycharger ICs available today lock the user into one fixedcharging regimen, with at best a limited number ofcustomization options to suit a variety of application needsor battery types. The LTC®1325 addresses these shortcomingsby providing the user with all the functionalblocks needed to implement a simple but highly flexiblebattery charger (see Figure 1) which not only addressesthe issue of charging batteries but also those of batteryconditioning and capacity monitoring.
The MSP-FET430PIF is a Parallel Port interface (does not include target board) that is used to program and debug MSP430 FET tools and test boards through the JTAG interface. This interface is included in our FET tools, but sold without the development board. This interface uses a Parallel PC Port to communicate to the Debugger Software (IAR Kickstart software included) running on the PC. The interface uses the standard 14 pin header to communicate to the MSP430 device using the standard JTAG protocol.
The flash memory can be erased and programmed in seconds with only a few keystrokes, and since the MSP430 flash is extremely low power, no external power supply is required. The tool has an integrated software environment and connects directly to the PC which greatly simplifies the set-up and use of the tool. The flash development tool supports development with all MSP430 flash parts.
Features
MSP430 debugging interface to connect a MSP430-Flash-device to a Parallel port on a PC
Supports JTAG debug protocol (NO support for Spy-Bi-Wire (2-wire JTAG) debug protocol, Spy-Bi-Wire (2-wire JTAG) is supported by MSP-FET430UIF)
Parallel Port cable and a 14-conductor target cable
Full documentation on CD ROM
Integrated IAR Kickstart user interface which includes:
Assembler
Linker
Limulator
Source-level debugger
Limited C-compiler
Technical specifications:
Backwardly compatable with existing FET tool boards.
CCAVR軟件有ISP功能，能過調用STK500完成的，只要設置好參數，在ICCAVR中就可以給芯片編程了，還可以讓程序一編譯完就自動下載到芯片中，相當方便。在Tools->environment options->ISP里設定STK500.exe的路徑。— 用于調用STK500程序。在Tools->In system programming 里Programmer Interface中選中STK500。— 選擇STK500下載方式。在Tools->In system programming 里把Auto Program After Compile 的小勾選上。— 編譯后自動編程。在Tools->In system programming 中還有一些設置項，大家可以根據需要進行相關設置。下面的圖片是操作過程。
MPLAB C30用戶指南(英文)
HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support
Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
The main oscillator allows either a crystal or single-ended input clock signal. Cost-sensitiveapplications typically use an external crystal with the on-chip oscillator circuit since it is the mostcost-effective solution. It is also possible to use the internal oscillator to clock the device after theboot process has completed.
