An OVERVIEW of Smart Card Security.
The smart card, an intelligent token, is a credit card sized plastic card embedded with an integrated circuit chip. It provides not only memory capacity, but computational capability as well. The self-containment of smart card makes it resistant to attack as it does not need to depend upon potentially vulnerable external resources. Because of this characteristic, smart cards are often used in different applications which require strong security protection and authentication.
This application note is intended for system designers who require a hardware
implementation OVERVIEW of the development board features such as the power supply, the
clock management, the reset control, the boot mode settings and the debug management. It
shows how to use the High-density and Medium-density STM32F10xxx product families and
describes the minimum hardware resources required to develop an STM32F10xxx
application.
Abstract: This application note presents an OVERVIEW of the operational characteristics of accurate I²C real-time clocks (RTCs),including the DS3231, DS3231M, and DS3232. It focuses on general application guidelines that facilitate use of device resources forpower management, I²C communication circuit configurations, and I²C characteristics relative to device power-up sequences andinitializations. Additional discussions on decoupling are provided to support developing strategies for mitigating power-supply pushingof device frequency.
This application note is an OVERVIEW discussion of theLinear Technology SPICE macromodel library. It assumeslittle if any prior knowledge of this software library or itshistory. However, it does assume familiarity with both theanalog simulation program SPICE (or one of its manyderivatives), and modern day op amps, including bipolar,JFET, and MOSFET amplifier technologies
This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an OVERVIEW of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
We provide complete power solutions with a full lineup of power managementproducts. This brochure provides an OVERVIEW of our high performance DC/DC switching regulatorcontrollers for applications including datacom, telecom, industrial, automotive, medical, avionicsand control systems. We make power design easier with our industry-leading field applicationengineering support; a broad selection of demonstration boards with schematics, layout filesand parts lists; SwitcherCAD® software for simulation, application notes and comprehensivetechnical documentation.
MPLAB C30用戶指南(英文)
HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support
Document LayoutThe document layout is as follows:• Chapter 1: Compiler OVERVIEW – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
