The PW2601 is a charger front-end integrated circuit designed to provide protection to Li-ionbatteries from failures of charging circuitry. The device monitors the input voltage, battery voltageand the charging current to make sure all three parameters are operated in normal range. Thedevice will switch off internal MOSFET to disconnect IN to OUT to protect load when any of inputvoltage, output current exceeds the threshold. The Over temperature protection (OTP) functionmonitors chip temperature to protect the device. The PW2601 also can protect the system’sbattery from being over charged by monitors the battery voltage continuously. The deviceoperates like a linear regulator, maintaining a 5.1V output with input voltages up to the input overvoltage threshold.The PW2601 is available in DFN-2x2-8L Package. Standard products are Pb-free and Halogenfree
標簽： pw2601
上傳時間： 2022-02-11
上傳用戶：
The PW2312 is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal power MOSFETs. It offers a very compact solution to achieve a 1.5A peak output currentover a wide input supply range, with excellent load and line regulation.The PW2312 requires a minimal number of readily available, external components and is available ina space saving SOT23-6 Package.
標簽： pw2312
上傳時間： 2022-02-11
上傳用戶：qingfengchizhu
The PW2228A is a high efficiency single inductor Buck-Boost converter which can supply theload current up to 1.5A. It provides auto-transition between Buck and Boost Mode. The PW2228Aoperates at 2.4MHz switching frequency in CCM. DC/DC converter operates at Pulse-Skipping Modeat light load. The output voltage is programmable using an external resistor divider, or is fixed to3.3V internally. The load is disconnected from the VIN during shutdown.The PW2228A is available in TDFN3X3-10 Package.
標簽： pw2228a
上傳時間： 2022-02-11
上傳用戶：
The PW2163D is a high frequency, synchronous, rectified, step-down, switch-mode converter withinternal powerMOSFETs. It offers a very compact solution to provide a 3A continuous current over awide input supply range,with excellent load and line regulation.The PW2163D requires a minimal number of readily available, external components and is availablein a spacesaving SOT23-6 Package
標簽： pw2163d
上傳時間： 2022-02-11
上傳用戶：
The PW2162 is a fully integrated, high– efficiency 2A synchronous rectified step-down converter.The PW2162 operates at high efficiency over a wide output current load range. This device offerstwo operation modes, PWM control and PFM Mode switching control, which allows a high efficiencyover the wider range of the load. The PW2162 requires a minimum number of readily availablestandard external components and is available in an 6-pin SOT23 ROHS compliant Package.
標簽： pw2162
上傳時間： 2022-02-11
上傳用戶：d1997wayne
SCB10H series pressure elements are high performance absolute pressure sensors. The sensors are based on Murata's proven capacitive 3D-MEMS technology. They enable exceptional possibility for OEM customers to integrate pressure measurement function in an optimal way into their products. SCB10H series elements can be designed to match the application specific pressure range. It is a bare capacitive sensor element that enables optimized application specific Package and electronics design.
標簽： 傳感器
上傳時間： 2022-03-03
上傳用戶：
目前cPU+ Memory等系統集成的多芯片系統級封裝已經成為3DSiP（3 Dimension System in Package，三維系統級封裝）的主流，非常具有代表性和市場前景，SiP作為將不同種類的元件，通過不同技術，混載于同一封裝內的一種系統集成封裝形式，不僅可搭載不同類型的芯片，還可以實現系統的功能。然而，其封裝具有更高密度和更大的發熱密度和熱阻，對封裝技術具有更大的挑戰。因此，對SiP封裝的工藝流程和SiP封裝中的濕熱分布及它們對可靠性影響的研究有著十分重要的意義本課題是在數字電視（DTV）接收端子系統模塊設計的基礎上對CPU和DDR芯片進行芯片堆疊的SiP封裝。封裝形式選擇了適用于小型化的BGA封裝，結構上采用CPU和DDR兩芯片堆疊的3D結構，以引線鍵合的方式為互連，實現小型化系統級封裝。本文研究該SP封裝中芯片粘貼工藝及其可靠性，利用不導電膠將CPU和DDR芯片進行了堆疊貼片，分析總結了SiP封裝堆疊貼片工藝最為關鍵的是涂布材料不導電膠的體積和施加在芯片上作用力大小，對制成的樣品進行了高溫高濕試驗，分析濕氣對SiP封裝的可靠性的影響。論文利用有限元軟件 Abaqus對SiP封裝進行了建模，模型包括熱應力和濕氣擴散模型。模擬分析了封裝體在溫度循環條件下，受到的應力、應變、以及可能出現的失效形式：比較了相同的熱載荷條件下，改變塑封料、粘結層的材料屬性，如楊氏模量、熱膨脹系數以及芯片、粘結層的厚度等對封裝體應力應變的影響。并對封裝進行了濕氣吸附分析，研究了SiP封裝在85℃RH85%環境下吸濕5h、17h、55和168h后的相對濕度分布情況，還對SiP封裝在濕熱環境下可能產生的可靠性問題進行了實驗研究。在經過168小時濕氣預處理后，封裝外部的基板和模塑料基本上達到飽和。模擬結果表明濕應力同樣對封裝的可靠性會產生重要影響。實驗結果也證實了，SiP封裝在濕氣環境下引入的濕應力對可靠性有著重要影響。論文還利用有限元分析方法對超薄多芯片SiP封裝進行了建模，對其在溫度循環條件下的應力、應變以及可能的失效形式進行了分析。采用二水平正交試驗設計的方法研究四層芯片、四層粘結薄膜、塑封料等9個封裝組件的厚度變化對芯片上最大應力的影響，從而找到最主要的影響因子進行優化設計，最終得到更優化的四層芯片疊層SiP封裝結構。
標簽： sip封裝
上傳時間： 2022-04-08
上傳用戶：
S32K1xx Series Reference Manual 用戶手冊--2029頁 Supports S32K116, S32K118, S32K142, S32K144, S32K146, and S32K148S32K是一款符合AEC-Q100規范、基于32位ARM Cortex-M4F和Cortex-M0+內核的MCU，適用于通用汽車和高可靠性工業應用。The S32K1xx product series further extends the highly scalable portfolio of Arm? Cortex?-M0+/M4F MCUs in the automotive industry. It builds on the legacy of the KEA series, while introducing higher memory options alongside a richer peripheral set extending capability into a variety of automotive applications. With a 2.70–5.5 V supply and focus on automotive environment robustness, the S32K product series devices are well suited to a wide range of applications in electrically harsh environments, and are optimized for cost-sensitive applications offering low pin-count options. The S32K product series offers a broad range of memory, peripherals, and Package options. It shares common peripherals and pin counts, allowing developers to migrate easily within an MCU family or among the MCU families to take advantage of more memory or feature integration. This scalability allows developers to use the S32K product series as the standard for their end product platforms, maximizing hardware and software reuse and reducing time to market
標簽： S32K116 S32K118 S32K142 S32K144
上傳時間： 2022-04-16
上傳用戶：jason_vip1
Vivado設計分為Project Mode和Non-project Mode兩種模式，一般簡單設計中，我們常用的是Project Mode。在本手冊中，我們將以一個簡單的實驗案例，一步一步的完成Vivado的整個設計流程一、新建工程1、打開Vivado 2013.4開發工具，可通過桌面快捷方式或開始菜單中xilinx DesignTools-Vivado 2013.4下的Vivado 2013.4打開軟件，開啟后，軟件如下所示：2、單擊上述界面中Create New Project圖標，彈出新建工程向導，點擊Next.3、輸入工程名稱、選擇工程存儲路徑，并勾選Create project subdirectory選項，為工程在指定存儲路徑下建立獨立的文件夾。設置完成后，點擊Next注意：工程名稱和存儲路徑中不能出現中文和空格，建議工程名稱以字母、數字、下劃線來組成。4、選擇RTL Project一項，并勾選Do not specifty sources at this time，勾選該選項是為了跳過在新建工程的過程中添加設計源文件。點擊Next.IA5、根據使用的FPGA開發平臺，選擇對應的FPGA目標器件。（在本手冊中，以xilinx官方開發板KC705為例，Nexys4開發板請選擇Artix-7 XC7A100TCSG324-2的器件，即Family和Subfamily均為Artix-7，封裝形式（Package）為cSG324，速度等級（Speed grade）為-1，溫度等級（Temp Grade）為C）。點擊Next6、確認相關信息與設計所用的的FPGA器件信息是否一致，一致請點擊Finish，不一致，請返回上一步修改。二、設計文件輸入1、如下圖所示，點擊Flow Navigator下的Project Manager->Add Sources或中間Sources中的對話框打開設計文件導入添加對話框。2、選擇第二項Add or Create Design Sources，用來添加或新建Verilog或VHDL源文件，點擊Next
標簽： vivado
上傳時間： 2022-05-28
上傳用戶：默默
ICN6201/02 is a bridge chip which receives MIPI? DSI inputs and sends LVDS outputs. MIPI? DSI supports up to 4 lanes and each lane operates at 1Gbps maximum; the totally maximum input bandwidth is 4Gbps; and the MIPI defined ULPS(ultra-low-power state) is also supported. ICN6201 decodes MIPI? DSI 18bepp RGB666 and 24bpp RGB888 packets.The LVDS output 18 or 24 bits pixel with 25MHz to 154MHz, by VESA or JEIDA format.ICN6201/02 support video resolution up to FHD (1920x1080) and WUXGA (1920x1200).ICN6201 adopts QFN48 Package and ICN6202 adopts QFN40 Package
標簽： icn6202
上傳時間： 2022-06-10
上傳用戶：kingwide
