Eclipse Rich Client Platform Designing Coding and Packaging Java Applications的源代碼
標簽： Applications Designing Packaging Platform
上傳時間： 2015-05-12
上傳用戶：change0329
Eclipse Rich Client Platform Designing Coding and Packaging Java Applications.chm Elipse RCP 開發指南
標簽： Applications Designing Packaging Platform
上傳時間： 2013-12-30
上傳用戶：xieguodong1234
As economy explodesand Packaging industry lfourishes，itisacriticalissue thatinternational communityencountersthewasteofresourcesandenvironmentalpollution causedbyPackaging waste．
標簽： explodesand lfourishes Packaging industry
上傳時間： 2017-01-01
上傳用戶：xg262122
模擬集成電路的設計與其說是一門技術，還不如說是一門藝術。它比數字集成電路設計需要更嚴格的分析和更豐富的直覺。嚴謹堅實的理論無疑是嚴格分析能力的基石，而設計者的實踐經驗無疑是誕生豐富直覺的源泉。這也正足初學者對學習模擬集成電路設計感到困惑并難以駕馭的根本原因。.美國加州大學洛杉機分校(UCLA)Razavi教授憑借著他在美國多所著名大學執教多年的豐富教學經驗和在世界知名頂級公司(AT&T，Bell Lab，HP)卓著的研究經歷為我們提供了這本優秀的教材。本書自2000午出版以來得到了國內外讀者的好評和青睞，被許多國際知名大學選為教科書。同時，由于原著者在世界知名頂級公司的豐富研究經歷，使本書也非常適合作為CMOS模擬集成電路設計或相關領域的研究人員和工程技術人員的參考書。... 本書介紹模擬CMOS集成電路的分析與設計。從直觀和嚴密的角度闡述了各種模擬電路的基本原理和概念，同時還闡述了在SOC中模擬電路設計遇到的新問題及電路技術的新發展。本書由淺入深，理論與實際結合，提供了大量現代工業中的設計實例。全書共18章。前10章介紹各種基本模塊和運放及其頻率響應和噪聲。第11章至第13章介紹帶隙基準、開關電容電路以及電路的非線性和失配的影響，第14、15章介紹振蕩器和鎖相環。第16章至18章介紹MOS器件的高階效應及其模型、CMOS制造工藝和混合信號電路的版圖與封裝。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device Models 17 CMOS Processing Technology 18 Layout and Packaging
上傳時間： 2014-12-23
上傳用戶：杜瑩12345
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component Packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
上傳時間： 2013-10-10
上傳用戶：1184599859
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, 400 kHz clock frequency, and smaller Packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.
上傳時間： 2013-11-17
上傳用戶：vodssv
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O configuration, 400 kHz clock frequency, and smaller Packaging. I/O expanders provide a simple solution when additional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.
上傳時間： 2013-10-10
上傳用戶：inwins
The PCA9535 and PCA9535C are 24-pin CMOS devices that provide 16 bits of GeneralPurpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and wasdeveloped to enhance the NXP Semiconductors family of I2C-bus I/O expanders. Theimprovements include higher drive capability, 5 V I/O tolerance, lower supply current,individual I/O configuration, and smaller Packaging. I/O expanders provide a simplesolution when additional I/O is needed for ACPI power switches, sensors, push buttons,LEDs, fans, etc.
上傳時間： 2013-10-21
上傳用戶：愛死愛死
The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallelInput/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed toenhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvementsinclude higher drive capability, 5 V I/O tolerance, lower supply current, individual I/Oconfiguration, and smaller Packaging. I/O expanders provide a simple solution whenadditional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Outputand Polarity Inversion (active HIGH or active LOW operation) registers. The systemmaster can enable the I/Os as either inputs or outputs by writing to the I/O configurationbits. The data for each Input or Output is kept in the corresponding Input or Outputregister. The polarity of the read register can be inverted with the Polarity Inversionregister. All registers can be read by the system master. Although pin-to-pin and I2C-busaddress compatible with the PCF8575, software changes are required due to theenhancements, and are discussed in Application Note AN469.
上傳時間： 2013-11-13
上傳用戶：fredguo
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
