As economy explodesand Packaging industry lfourishes，itisacriticalissue thatinternational
communityencountersthewasteofresourcesandenvironmentalpollution causedbyPackaging waste．
The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of theprinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component Packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel
Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to
enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements
include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O
configuration, 400 kHz clock frequency, and smaller Packaging. I/O expanders provide a
simple solution when additional I/O is needed for ACPI power switches, sensors,
push buttons, LEDs, fans, etc.
The PCA9534 is a 16-pin CMOS device that provide 8 bits of General Purpose parallel
Input/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed to
enhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvements
include higher drive capability, 5 V I/O tolerance, lower supply current, individual I/O
configuration, 400 kHz clock frequency, and smaller Packaging. I/O expanders provide a
simple solution when additional I/O is needed for ACPI power switches, sensors,
push buttons, LEDs, fans, etc.
The PCA9535 and PCA9535C are 24-pin CMOS devices that provide 16 bits of GeneralPurpose parallel Input/Output (GPIO) expansion for I2C-bus/SMBus applications and wasdeveloped to enhance the NXP Semiconductors family of I2C-bus I/O expanders. Theimprovements include higher drive capability, 5 V I/O tolerance, lower supply current,individual I/O configuration, and smaller Packaging. I/O expanders provide a simplesolution when additional I/O is needed for ACPI power switches, sensors, push buttons,LEDs, fans, etc.
The PCA9555 is a 24-pin CMOS device that provides 16 bits of General Purpose parallelInput/Output (GPIO) expansion for I2C-bus/SMBus applications and was developed toenhance the NXP Semiconductors family of I2C-bus I/O expanders. The improvementsinclude higher drive capability, 5 V I/O tolerance, lower supply current, individual I/Oconfiguration, and smaller Packaging. I/O expanders provide a simple solution whenadditional I/O is needed for ACPI power switches, sensors, push buttons, LEDs, fans, etc.The PCA9555 consists of two 8-bit Configuration (Input or Output selection); Input, Outputand Polarity Inversion (active HIGH or active LOW operation) registers. The systemmaster can enable the I/Os as either inputs or outputs by writing to the I/O configurationbits. The data for each Input or Output is kept in the corresponding Input or Outputregister. The polarity of the read register can be inverted with the Polarity Inversionregister. All registers can be read by the system master. Although pin-to-pin and I2C-busaddress compatible with the PCF8575, software changes are required due to theenhancements, and are discussed in Application Note AN469.
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
