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Printed

正確的混合信號設計印刷電路板(PCB)的接地

Abstract: This tutorial discusses proper Printed-circuit board (PCB) grounding for mixed-signal designs. Formost applications a simple method without cuts in the ground plane allows for successful PCB layouts withthis kind of IC. We begin this document with the basics: where the current flows. Later, we describe how toplace components and route signal traces to minimize problems with crosstalk. Finally, we move on toconsider power supply-currents and end by discussing how to extend what we have learned to circuits withmultiple mixed-signal ICs.

標簽： PCB 正印刷電路板混合信號

上傳時間： 2013-11-04

上傳用戶：pol123
VGA 8:1 multiplexer reference

This reference design (RD) features a fullyassembled and tested surface-mount Printed circuitboard (PCB). The RD board utilizes the MAX48851:2 or 2:1 multiplexer and other ICs to implement acomplete video graphics array (VGA) 8:1multiplexer.VGA input/output connections are provided to easilyinterface the MAX4885 RD board with VGAcompatibledevices. The RD board gives the optionto use a single 5V DC power supply (V+), or this RDboard can be powered from any one of the eight VGA sources.

標簽： multiplexer reference VGA

上傳時間： 2013-11-09

上傳用戶：ANRAN
PCB Design Considerations and Guidelines for 0.4mm and 0.5mm WLPs

Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the Printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.

標簽： Considerations Guidelines and Design

上傳時間： 2013-10-14

上傳用戶：ysystc699
多層印制板設計基本要領

【摘要】本文結合作者多年的印制板設計經驗，著重印制板的電氣性能，從印制板穩定性、可靠性方面，來討論多層印制板設計的基本要求。【關鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導線和裝配焊接電子元件用的焊盤組成，既具有導通各層線路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術）的不斷發展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產品更加智能化、小型化，因而推動了PCB工業技術的重大改革和進步。自1991年IBM公司首先成功開發出高密度多層板（SLC）以來，各國各大集團也相繼開發出各種各樣的高密度互連（HDI）微孔板。這些加工技術的迅猛發展，促使了PCB的設計已逐漸向多層、高密度布線的方向發展。多層印制板以其設計靈活、穩定可靠的電氣性能和優越的經濟性能，現已廣泛應用于電子產品的生產制造中。下面，作者以多年設計印制板的經驗，著重印制板的電氣性能，結合工藝要求，從印制板穩定性、可靠性方面，來談談多層制板設計的基本要領。

標簽： 多層印制板

上傳時間： 2013-11-19

上傳用戶：zczc
高性能覆銅板的發展趨勢及對環氧樹脂性能的新需求

討論、研究高性能覆銅板對它所用的環氧樹脂的性能要求，應是立足整個產業鏈的角度去觀察、分析。特別應從HDI多層板發展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發展特點，它的發展趨勢如何——這都是我們所要研究的高性能CCL發展趨勢和重點的基本依據。而HDI多層板的技術發展，又是由它的應用市場——終端電子產品的發展所驅動（見圖1）。圖1 在HDI多層板產業鏈中各類產品對下游產品的性能需求關系圖 1．HDI多層板發展特點對高性能覆銅板技術進步的影響1.1 HDI多層板的問世，對傳統PCB技術及其基板材料技術是一個嚴峻挑戰20世紀90年代初，出現新一代高密度互連（High Density Interconnection，簡稱為 HDI）印制電路板——積層法多層板（Build—Up Multiplayer Printed board，簡稱為 BUM）的最早開發成果。它的問世是全世界幾十年的印制電路板技術發展歷程中的重大事件。積層法多層板即HDI多層板，至今仍是發展HDI的PCB的最好、最普遍的產品形式。在HDI多層板之上，將最新PCB尖端技術體現得淋漓盡致。HDI多層板產品結構具有三大突出的特征：“微孔、細線、薄層化”。其中“微孔”是它的結構特點中核心與靈魂。因此，現又將這類HDI多層板稱作為“微孔板”。HDI多層板已經歷了十幾年的發展歷程，但它在技術上仍充滿著朝氣蓬勃的活力，在市場上仍有著前程廣闊的空間。

標簽： 性能發展趨勢覆銅板環氧樹脂

上傳時間： 2013-11-22

上傳用戶：gundan
pci e PCB設計規范

This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.

標簽： pci PCB 設計規范

上傳時間： 2013-10-15

上傳用戶：busterman
使用新電源模塊改進表面貼裝可制造性

The latest generation of Texas Instruments (TI) boardmountedpower modules utilizes a pin interconnect technologythat improves surface-mount manufacturability.These modules are produced as a double-sided surfacemount(DSSMT) subassembly, yielding a case-less constructionwith subcomponents located on both sides of thePrinted circuit board (PCB). Products produced in theDSSMT outline use the latest high-efficiency topologiesand magnetic-component packaging. This providescustomers with a high-efficiency, ready-to-use switchingpower module in a compact, space-saving package. Bothnonisolated point-of-load (POL) switching regulators andthe isolated dc/dc converter modules are being producedin the DSSMT outline.TI’s plug-in power product line offers power modules inboth through-hole and surface-mount packages. The surfacemountmodules produced in the DSSMT outline use asolid copper interconnect with an integral solder ball fortheir

標簽： 電源模塊可制造性表面貼裝

上傳時間： 2013-10-10

上傳用戶：1184599859
USB Demonstration for DK3200 w

The μPSD32xx family, from ST, consists of Flash programmable system devices with a 8032 MicrocontrollerCore. Of these, the μPSD3234A and μPSD3254A are notable for having a complete implementationof the USB hardware directly on the chip, complying with the Universal Serial Bus Specification, Revision1.1.This application note describes a demonstration program that has been written for the DK3200 hardwaredemonstration kit (incorporating a μPSD3234A device). It gives the user an idea of how simple it is to workwith the device, using the HID class as a ready-made device driver for the USB connection.IN-APPLICATION-PROGRAMMING (IAP) AND IN-SYSTEM-PROGRAMMING (ISP)Since the μPSD contains two independent Flash memory arrays, the Micro Controller Unit (MCU) can executecode from one memory while erasing and programming the other. Product firmware updates in thefield can be reliably performed over any communication channel (such as CAN, Ethernet, UART, J1850)using this unique architecture. For In-Application-Programming (IAP), all code is updated through theMCU. The main advantage for the user is that the firmware can be updated remotely. The target applicationruns and takes care on its own program code and data memory.IAP is not the only method to program the firmware in μPSD devices. They can also be programmed usingIn-System-Programming (ISP). A IEEE1149.1-compliant JTAG interface is included on the μPSD. Withthis, the entire device can be rapidly programmed while soldered to the circuit board (Main Flash memory,Secondary Boot Flash memory, the PLD, and all configuration areas). This requires no MCU participation.The MCU is completely bypassed. So, the μPSD can be programmed or reprogrammed any time, anywhere, even when completely uncommitted.Both methods take place with the device in its normal hardware environment, soldered to a Printed circuitboard. The IAP method cannot be used without previous use of ISP, because IAP utilizes a small amountof resident code to receive the service commands, and to perform the desired operations.

標簽： Demonstration 3200 USB for

上傳時間： 2014-02-27

上傳用戶：zhangzhenyu
Reading and Writing iButtons v

Abstract: This application note explains the hardware of different types of 1-Wire® interfaces and software examples adapted to this hardware with a focus on serial ports. Depending on the types of iButtons required for a project and the type of computer to be used, the most economical interface is easily found. The hardware examples shown are basically two different types: 5V general interface and 12V RS-232 interface. Within the 5V group a common Printed circuit board could be used for all circuits described. The variations can be achieved by different populations of components. The same principal is used for the 12V RS-232 interface. The population determines if it is a Read all or a Read/Write all type of interface. There are other possible circuit implementations to create a 1-Wire interface. The circuits described in this application note cover many different configurations. For a custom application, one of the described options can be adapted to meet individual needs.

標簽： iButtons Reading Writing and

上傳時間： 2013-10-29

上傳用戶：long14578
基于Zigbee的無線傳輸電路的抗電磁干擾優化設計

電力設備熱點溫度與電流在線監測預警系統工作在大型變壓器旁，極易受電磁輻射干擾，針對該預警系統的子系統：無線傳輸部分進行了抗電磁干擾設計，采用Ansoft Designer軟件仿真分析了PCB（Printed Circuit Board）中電磁波對PCB電磁兼容性產生的影響，根據其得出的PCB的電流圖及近場分布圖，分析PCB的電磁兼容性，針對結果中的電磁輻射過高區域進行了重新設計，經Ansoft Designer驗證，重新設計后的PCB各項指數有所下降，電磁兼容性得到提高。

標簽： Zigbee 無線傳輸抗電磁干擾優化設計

上傳時間： 2013-11-11

上傳用戶：ggwz258