This program requires the DSP2833x header files.
//
// As supplied, this project is configured for "boot to SARAM"
// operation. The 2833x Boot Mode table is shown below.
// For information on configuring the boot mode of an eZdsp,
// please Refer to the documentation included with the eZdsp,
C8051F340/1/2/3/4/5/6/7 devices are fully integrated mixed-signal System-on-a-Chip MCUs. Highlighted
features are listed below. Refer to Table 1.1 for specific product feature selection
This product has been retired and is not recommended for new designs. For new designs, S25FL040A supersedes
S25FL004A. Please Refer to the S25FL040A for specifications andordering information. Availability of this document is
retained for Reference and historical purposes only
This product has been retired and is not recommended for new designs. For new designs, S25FL040A supersedes
S25FL004A. Please Refer to the S25FL040A for specifications andordering information. Availability of this document is
retained for Reference and historical purposes only
How will future generations Refer to our times? Will it be known as one
of space exploration, genetics, atomic energy or computing? Possibly,
but I think it is more likely to be ‘The age of communications’. Not since
printed books and newspapers were first introduced has there been
such an explosion of communication. None of this technology could
function without modern cables and, just as important, competent
installers.
The last decade proved to be hugely successful for the mobile communications industry,
characterised by continued and rapid growth in demand, spurred on by new technological
advances and innovative marketing techniques. Of course, when we Refer to mobile commu-
nications, we tend to implicitly Refer to cellular systems, such as GSM. The plight of the
mobile-satellite industry over the last decade, although eventful, has, at times, been more akin
to an out of control roller coaster ride.
Microengineering and Microelectromechanical systems (MEMS) have very few
watertight definitions regarding their subjects and technologies. Microengineering
can be described as the techniques, technologies, and practices involved in the
realization of structures and devices with dimensions on the order of micrometers.
MEMS often Refer to mechanical devices with dimensions on the order of
micrometers fabricated using techniques originating in the integrated circuit (IC)
industry, with emphasis on silicon-based structures and integrated microelectronic
circuitry. However, the term is now used to Refer to a much wider range of
microengineered devices and technologies.
CPCI_E標準規范 CompactPCI? Express SpecificationThe documents in this section may be useful for Reference when reading the specification. The revision listed for each document is the latest revision at the time this specification was published. Newer revisions of these documents may exist, so Refer to the newest revision. Many of these documents are Referenced throughout this specification. Refer to the newest revision of the document unless a specific revision is Referenced. ? PCI Express Base Specification 3.0. PCI Special Interest Group (PCI-SIG). ? PCI Express Card Electromechanical (CEM) Specification 3.0. PCI Special Interest Group (PCI-SIG). ? PCI Express to PCI/PCI-X Bridge Specification, Rev. 1.0. PCI Special Interest Group (PCI-SIG). ? PCI Express Jitter White Paper. PCI Special Interest Group (PCI-SIG). ? PCIe Rj Dj BER White Paper. PCI Special Interest Group (PCI-SIG). ? PHY Electrical Test Specification for PCI Express Architecture. PCI Special Interest Group (PCI SIG). ? System Management Bus (SMBus) Specification, Version 2.0. Smart Battery System Implementer’
