Low power operation of electronic apparatus has becomeincreasingly desirable. Medical, remote data acquisition,power monitoring and other applications are good candidatesfor battery driven, low power operation. Micropoweranalog circuits for transducer-based signal conditioningpresent a special class of problems. Although micropowerICs are available, the interconnection of these devices toform a functioning micropower circuit requires care. (SeeBox SECTIONs, “Some Guidelines for Micropower Designand an Example” and “Parasitic Effects of Test Equipmenton Micropower Circuits.”) In particular, trade-offs betweensignal levels and power dissipation become painful whenperformance in the 10-bit to 12-bit area is desirable.
上傳時間： 2013-10-22
上傳用戶：rocketrevenge
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main SECTIONs. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
提出一種基于凌陽單片機的步進電機加減速的控制方法。采用凌陽科技推出的16位結構工控單片機SPMC75F2413A為控制器，由Allegro公司生產的兩相步進電機專用驅動器件SLA7042M構成步進電機的驅動電路，在傳統的3段直線加減速控制算法基礎上增加至7段S形曲線加減速過程，控制步進電機的啟動和停止。實驗結果表明，該控制方法克服了直線加減速中不連續、易造成系統沖擊的問題，整個系統實現柔性控制，電機啟動、停止連續性能提高30%。 Abstract: The method of controlled stepping motor is referred based on SPMC75F2413A MCU， which adopts the 16 knots SPMC75F2413A MCU as the controller. The special-purpose actuation chip SLA7042M of two stepping motor produced by Allegro Corporation constituted to actuation electric circuit. The purpose of increasing to seven section of S shape curve based on the traditional three SECTIONs of straight line is to control the start and stop process of stepping motor. The experimental results show that the control method solves easy to pull-out and overshot problems. The overall system realizes flexible control， and the performance of motor start or stop continuity is increased 30%
上傳時間： 2013-12-08
上傳用戶：jiangfire
MPLAB C30用戶指南(英文) HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on SECTIONs, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
上傳時間： 2013-10-21
上傳用戶：13925096126
CMD 它是用來分配rom和ram空間用的,告訴鏈接程序怎樣計算地址和分配空間。不同的芯片就有不同大小的rom和ram.放用戶程序的地方也不盡相同。所以要根據芯片進行修改.分兩部分.MEMORY和SECTIONs。MEMORY{ PAGE 0 .......... PAGE 1.........} SECTIONs{SECTIONs{.vectors ..................reset ................................. }
上傳時間： 2013-10-19
上傳用戶：thuyenvinh
Nios II軟件構建工具入門 The Nios® II Software Build Tools (SBT) allows you to construct a wide variety of complex embedded software systems using a command-line interface. From this interface, you can execute Software Built Tools command utilities, and use scripts other tools) to combine the command utilities in many useful ways. This chapter introduces you to project creation with the SBT at the command line This chapter includes the following SECTIONs: ■ “Advantages of Command-Line Software Development” ■ “Outline of the Nios II SBT Command-Line Interface” ■ “Getting Started in the SBT Command Line” ■ “Software Build Tools Scripting Basics” on page 3–8
上傳時間： 2013-11-15
上傳用戶：nanxia
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main SECTIONs. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2014-01-24
上傳用戶：s363994250
The AN10 begins with a survey of methods for measuring op amp settling time. This commentary develops into circuits for measuring settling time to 0.0005%. Construction details and results are presented. Appended SECTIONs cover oscilloscope overload limitations and amplifier frequency compensation.
上傳時間： 2013-11-14
上傳用戶：JIMMYCB001
A collection of interface applications between various microprocessors/ controllers and the LTC1090 family of data acquisition systems. The note is divided into SECTIONs specific to each interface.
上傳時間： 2013-11-08
上傳用戶：sssnaxie
Copyright© 2004 Sergiu Dumitriu, Marta Gî rdea, Că tă lin Hriţ cu Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation with no Invariant SECTIONs, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled "GNU Free Documentation License" All brand names, product names, or trademarks belong to their respective holders.
標簽： Permission Copyright 259 Dumitriu
上傳時間： 2015-04-02
上傳用戶：jackgao
