The LM20, LM45, LM50, LM60, LM61, and LM62 are analog output temperature sensors. They have various output voltage slopes (6.25mV/°C to 17mV/°C) and power supply voltage ranges (2.4V to 10V).The LM20 is the smallest, lowest power consumption analog output temperature sensor National Semiconductor has released. The LM70 and LM74 are MICROWIRE/SPI compatible digital temperature sensors. The LM70 has a resolution of 0.125°C while the LM74 has a resolution of 0.625°C. The LM74 is the most accurate of the two with an accuracy better than ±1.25°C. The LM75 is National’s first digital output temperature sensor, released several years ago.
Construction Strategy of ESD Protection CircuitAbstract： The principles used to construct ESD protection on circuits and the basic conceptions of ESD protection design are presented.Key words：ESD protection/On circuit, ESD design window, ESD current path1 引言靜電放電（ESD，Electrostatic Discharge）給電子器件環(huán)境會(huì)帶來(lái)破壞性的后果。它是造成集成電路失效的主要原因之一。隨著集成電路工藝不斷發(fā)展，互補(bǔ)金屬氧化物半導(dǎo)體（CMOS，Complementary Metal-Oxide Semiconductor）的特征尺寸不斷縮小，金屬氧化物半導(dǎo)體(MOS, Metal-Oxide Semiconductor)的柵氧厚度越來(lái)越薄，MOS 管能承受的電流和電壓也越來(lái)越小，因此要進(jìn)一步優(yōu)化電路的抗ESD 性能，需要從全芯片ESD 保護(hù)結(jié)構(gòu)的設(shè)計(jì)來(lái)進(jìn)行考慮。
A light-emitting diode (LED) is a Semiconductor device that emits narrow-spectrum incoherent light when forward-biased.The color of the emitted light depends on the chemical composition of the Semiconductor material used, and can benear-ultraviolet, visible or infrared. LEDs are more prevalent today than ever before, replacing traditional incandescent andfluorescent bulbs in many lighting applications. Incandescents use a heated filament, are subject to breakage and burnoutand operate at a luminous efficiency of 2% to 4%. Fluorescents are more efficient, at 7% to 12%, but require highdrive voltage and contain mercury, a toxic substance that may be eventually banned in certain countries. LEDs, however,produce light directly through electroluminescence, operate at low voltage and can deliver over 20% luminous efficiency.
NXP Semiconductor designed the LPC2400 microcontrollers around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded Trace. The LPC2400 microcontrollers have 512 kB of on-chip high-speedFlash memory. This Flash memory includes a special 128-bit wide memory interface andaccelerator architecture that enables the CPU to execute sequential instructions fromFlash memory at the maximum 72 MHz system clock rate. This feature is available onlyon the LPC2000 ARM Microcontroller family of products. The LPC2400 can execute both32-bit ARM and 16-bit Thumb instructions. Support for the two Instruction Sets meansEngineers can choose to optimize their application for either performance or code size atthe sub-routine level. When the core executes instructions in Thumb state it can reducecode size by more than 30 % with only a small loss in performance while executinginstructions in ARM state maximizes core performance.
Although Stellaris microcontrollers have generous internal SRAM capabilities, certain applicationsmay have data storage requirements that exceed the 8 KB limit of the Stellaris LM3S8xx seriesdevices. Since microcontrollers do not have an external parallel data-bus, serial memory optionsmust be considered. Until recently, the ubiquitous serial EEPROM/flash device was the only serialmemory solution. The major limitations of EEPROM and flash technology are slow write speed, slowerase times, and limited write/erase endurance.Recently, serial SRAM devices have become available as a solution for high-speed dataapplications. The N256S08xxHDA series of devices, from AMI Semiconductor, offer 32 K x 8 bits oflow-power data storage, a fast Serial Peripheral Interface (SPI) serial bus, and unlimited write cycles.The parts are available in 8-pin SOIC and compact TSSOP packages.
