印刷電路板（PCB）設(shè)計(jì)解決方案市場(chǎng)和技術(shù)領(lǐng)軍企業(yè)Mentor Graphics（Mentor Graphics）宣布推出HyperLynx® PI（電源完整性）產(chǎn)品，滿足業(yè)內(nèi)高端設(shè)計(jì)者對(duì)于高性能電子產(chǎn)品的需求。HyperLynx PI產(chǎn)品不僅提供簡(jiǎn)單易學(xué)、操作便捷，又精確的分析，讓團(tuán)隊(duì)成員能夠設(shè)計(jì)可行的電源供應(yīng)系統(tǒng)；同時(shí)縮短設(shè)計(jì)周期，減少原型生成、重復(fù)制造，也相應(yīng)降低產(chǎn)品成本。隨著當(dāng)今各種高性能/高密度/高腳數(shù)集成電路的出現(xiàn)，傳輸系統(tǒng)的設(shè)計(jì)越來(lái)越需要工程師與布局設(shè)計(jì)人員的緊密合作，以確保能夠透過(guò)眾多PCB電源與接地結(jié)構(gòu)，為IC提供純凈、充足的電力。配合先前推出的HyperLynx信號(hào)完整性（Si）分析和確認(rèn)產(chǎn)品組件，Mentor Graphics目前為用戶提供的高性能電子產(chǎn)品設(shè)計(jì)堪稱(chēng)業(yè)內(nèi)最全面最具實(shí)用性的解決方案。“我們擁有非常高端的用戶，受到高性能集成電路多重電壓等級(jí)和電源要求的驅(qū)使，需要在一個(gè)單一的PCB中設(shè)計(jì)30余套電力供應(yīng)結(jié)構(gòu)。”Mentor Graphics副總裁兼系統(tǒng)設(shè)計(jì)事業(yè)部總經(jīng)理Henry Potts表示。“上述結(jié)構(gòu)的設(shè)計(jì)需要快速而準(zhǔn) 確的直流壓降(DC Power Drop)和電源雜訊(Power Noise)分析。擁有了精確的分析信息，電源與接地層結(jié)構(gòu)和解藕電容數(shù)(de-coupling capacitor number)以及位置都可以決定，得以避免過(guò)于保守的設(shè)計(jì)和高昂的產(chǎn)品成本。”
上傳時(shí)間： 2013-10-31
上傳用戶：ljd123456
現(xiàn)代的電子設(shè)計(jì)和芯片制造技術(shù)正在飛速發(fā)展，電子產(chǎn)品的復(fù)雜度、時(shí)鐘和總線頻率等等都呈快速上升趨勢(shì)，但系統(tǒng)的電壓卻不斷在減小，所有的這一切加上產(chǎn)品投放市場(chǎng)的時(shí)間要求給設(shè)計(jì)師帶來(lái)了前所未有的巨大壓力。要想保證產(chǎn)品的一次性成功就必須能預(yù)見(jiàn)設(shè)計(jì)中可能出現(xiàn)的各種問(wèn)題，并及時(shí)給出合理的解決方案，對(duì)于高速的數(shù)字電路來(lái)說(shuō)，最令人頭大的莫過(guò)于如何確保瞬時(shí)跳變的數(shù)字信號(hào)通過(guò)較長(zhǎng)的一段傳輸線，還能完整地被接收，并保證良好的電磁兼容性，這就是目前頗受關(guān)注的信號(hào)完整性（Si）問(wèn)題。本章就是圍繞信號(hào)完整性的問(wèn)題，讓大家對(duì)高速電路有個(gè)基本的認(rèn)識(shí)，并介紹一些相關(guān)的基本概念。 第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1066.2 源同步時(shí)序系統(tǒng).......................................................................................1086.2.1 源同步系統(tǒng)的基本結(jié)構(gòu)...................................................................1096.2.2 源同步時(shí)序要求...............................................................................110第七章 IBIS 模型................................................................................................1137.1 IBIS 模型的由來(lái)...................................................................................... 1137.2 IBIS 與SPICE 的比較.............................................................................. 1137.3 IBIS 模型的構(gòu)成...................................................................................... 1157.4 建立IBIS 模型......................................................................................... 1187.4 使用IBIS 模型......................................................................................... 1197.5 IBIS 相關(guān)工具及鏈接..............................................................................120第八章 高速設(shè)計(jì)理論在實(shí)際中的運(yùn)用.............................................................1228.1 疊層設(shè)計(jì)方案...........................................................................................1228.2 過(guò)孔對(duì)信號(hào)傳輸?shù)挠绊?..........................................................................1278.3 一般布局規(guī)則...........................................................................................1298.4 接地技術(shù)...................................................................................................1308.5 PCB 走線策略............................................................................................134
標(biāo)簽： 信號(hào)完整性
上傳時(shí)間： 2013-11-01
上傳用戶：xitai
第一部分 信號(hào)完整性知識(shí)基礎(chǔ).................................................................................5第一章 高速數(shù)字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來(lái)的問(wèn)題及設(shè)計(jì)流程剖析...............................................................61.3 相關(guān)的一些基本概念...................................................................................8第二章 傳輸線理論...............................................................................................122.1 分布式系統(tǒng)和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報(bào)方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質(zhì).................................................................................142.3.2 特征阻抗相關(guān)計(jì)算.............................................................................152.3.3 特性阻抗對(duì)信號(hào)完整性的影響.........................................................172.4 傳輸線電報(bào)方程及推導(dǎo).............................................................................182.5 趨膚效應(yīng)和集束效應(yīng).................................................................................232.6 信號(hào)的反射.................................................................................................252.6.1 反射機(jī)理和電報(bào)方程.........................................................................252.6.2 反射導(dǎo)致信號(hào)的失真問(wèn)題.................................................................302.6.2.1 過(guò)沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負(fù)載的匹配.................................................................................41第三章 串?dāng)_的分析...............................................................................................423.1 串?dāng)_的基本概念.........................................................................................423.2 前向串?dāng)_和后向串?dāng)_.................................................................................433.3 后向串?dāng)_的反射.........................................................................................463.4 后向串?dāng)_的飽和.........................................................................................463.5 共模和差模電流對(duì)串?dāng)_的影響.................................................................483.6 連接器的串?dāng)_問(wèn)題.....................................................................................513.7 串?dāng)_的具體計(jì)算.........................................................................................543.8 避免串?dāng)_的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產(chǎn)生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號(hào)的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場(chǎng)屏蔽.........................................................................................654.3.1.2 磁場(chǎng)屏蔽.........................................................................................674.3.1.3 電磁場(chǎng)屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設(shè)計(jì)中的EMI.......................................................................................754.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................764.4.2 疊層設(shè)計(jì)抑制EMI ..............................................................................774.4.3 電容和接地過(guò)孔對(duì)回流的作用.........................................................784.4.4 布局和走線規(guī)則.................................................................................79第五章 電源完整性理論基礎(chǔ)...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設(shè)計(jì).............................................................................................855.3 同步開(kāi)關(guān)噪聲分析.....................................................................................875.3.1 芯片內(nèi)部開(kāi)關(guān)噪聲.............................................................................885.3.2 芯片外部開(kāi)關(guān)噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應(yīng)用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質(zhì)和封裝影響.....................................................................955.4.3 電容并聯(lián)特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章 系統(tǒng)時(shí)序.................................................................................................1006.1 普通時(shí)序系統(tǒng)...........................................................................................1006.1.1 時(shí)序參數(shù)的確定...............................................................................1016.1.2 時(shí)序約束條件...................................................................................1063.2 高速設(shè)計(jì)的問(wèn)題.......................................................................................2093.3 SPECCTRAQuest Si Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint Manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統(tǒng)......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動(dòng)布線器.......................................................2303.4 高速設(shè)計(jì)的大致流程...............................................................................2303.4.1 拓?fù)浣Y(jié)構(gòu)的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓?fù)淠０弪?qū)動(dòng)設(shè)計(jì)...................................................................2313.4.4 時(shí)序驅(qū)動(dòng)布局...................................................................................2323.4.5 以約束條件驅(qū)動(dòng)設(shè)計(jì).......................................................................2323.4.6 設(shè)計(jì)后分析.......................................................................................233第四章 SPECCTRAQUEST SiGNAL EXPLORER 的進(jìn)階運(yùn)用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓?fù)浣Y(jié)構(gòu)探索...........................................................................2344.3 全面的信號(hào)完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設(shè)計(jì)前和設(shè)計(jì)的拓?fù)浣Y(jié)構(gòu)提取.......................................................2354.6 仿真設(shè)置顧問(wèn)...........................................................................................2354.7 改變?cè)O(shè)計(jì)的管理.......................................................................................2354.8 關(guān)鍵技術(shù)特點(diǎn)...........................................................................................2364.8.1 拓?fù)浣Y(jié)構(gòu)探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process AnalySis) .236第五章 部分特殊的運(yùn)用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號(hào)的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章 使用LINESiM 進(jìn)行前仿真.......................................................................2511.1 用LineSim 進(jìn)行仿真工作的基本方法...................................................2511.2 處理信號(hào)完整性原理圖的具體問(wèn)題.......................................................2591.3 在LineSim 中如何對(duì)傳輸線進(jìn)行設(shè)置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進(jìn)行串?dāng)_仿真...................................................................268第二章 使用BOARDSiM 進(jìn)行后仿真......................................................................2732.1 用BOARDSiM 進(jìn)行后仿真工作的基本方法...................................................2732.2 BoardSim 的進(jìn)一步介紹..........................................................................2922.3 BoardSim 中的串?dāng)_仿真..........................................................................309
標(biāo)簽： PCB 內(nèi)存 仿真技術(shù)
上傳時(shí)間： 2013-11-07
上傳用戶：aa7821634
基于量子流體動(dòng)力學(xué)模型，自主編制程序開(kāi)發(fā)了半導(dǎo)體器件仿真軟件。其中包括快速、準(zhǔn)確數(shù)值離散方法和準(zhǔn)確的物理模型。基于對(duì)同一個(gè)Si雙極晶體管的模擬，與商用軟件有近似的仿真結(jié)果。表明量子流體動(dòng)力學(xué)模型具有可行性，同時(shí)也表明數(shù)值算法和物理模型的正確性。
標(biāo)簽： 量子 流體 動(dòng)力學(xué)模型 半導(dǎo)體器件
上傳時(shí)間： 2013-10-08
上傳用戶：fanxiaoqie
仿真1：首先把網(wǎng)絡(luò)溫度參數(shù)T固定在100，按工作規(guī)則共進(jìn)行1000次狀態(tài)更新,把這1000次狀態(tài)轉(zhuǎn)移中網(wǎng)絡(luò)中的各個(gè)狀態(tài)出現(xiàn)的次數(shù)Si（i＝1，2，…，16）記錄下來(lái) 按下式計(jì)算各個(gè)狀態(tài)出現(xiàn)的實(shí)際頻率： Pi=Si/∑i=1,NSi=Si/M 同時(shí)按照Bo1tzmann分布計(jì)算網(wǎng)絡(luò)各個(gè)狀態(tài)出現(xiàn)概率的理論值： Q（Ei）=（1/Z）exp（-Ei/T） 仿真2：實(shí)施降溫方案，重新計(jì)算 采用快速降溫方案：T（t）= T0/（1+t） T從1000降到0.01，按工作規(guī)則更新網(wǎng)絡(luò)狀態(tài) 當(dāng)T=0.01時(shí)結(jié)束降溫，再讓T保持在0.01進(jìn)行1000次狀態(tài)轉(zhuǎn)移，比較兩種概率
標(biāo)簽： 100 仿真 網(wǎng)絡(luò)溫度 參數(shù)
上傳時(shí)間： 2014-01-20
上傳用戶：獨(dú)孤求源
模擬退火算法 模擬退火算法(Simulated Annealing,簡(jiǎn)稱(chēng)SA算法)是模擬加熱熔化的金屬的退火過(guò)程，來(lái)尋找全局最優(yōu)解的有效方法之一。 模擬退火的基本思想和步驟如下： 設(shè)S＝{s1,s2,…,sn}為所有可能的狀態(tài)所構(gòu)成的集合， f：S—R為非負(fù)代價(jià)函數(shù)，即優(yōu)化問(wèn)題抽象如下： 尋找s*∈S，使得f(s*)＝min f(Si) 任意Si∈S （1）給定一較高初始溫度T，隨機(jī)產(chǎn)生初始狀態(tài)S （2）按一定方式，對(duì)當(dāng)前狀態(tài)作隨機(jī)擾動(dòng)，產(chǎn)生一個(gè)新的狀態(tài)S’ S’＝S＋Sign(η).δ 其中δ為給定的步長(zhǎng)， η為[－1,1]的隨機(jī)數(shù)
標(biāo)簽： Simulated Annealing 模擬退火算法 模擬
上傳時(shí)間： 2014-01-02
上傳用戶：gengxiaochao
Draak is a multi-language, macro compiler, meaning all syntax and code generation is defined in a Single file. Draak is a Single binary that is able to compile any context free language (like C, Pascal, Java) for any platform with only 1 file. Draak Compiler是一個(gè)多語(yǔ)言，宏編譯器，可以在一個(gè)單獨(dú)的文件中定義所有的語(yǔ)法和代碼生成。Draak 是一個(gè)單獨(dú)的二進(jìn)制文件，可以在任意平臺(tái)上只使用一個(gè)文件來(lái)編譯任何上下文無(wú)關(guān)的語(yǔ)言（類(lèi)似 C, Pascal, Java）。
標(biāo)簽： multi-language generation compiler defined
上傳時(shí)間： 2013-12-30
上傳用戶：a673761058
DES(Data Encrypton Standard) 算法的實(shí)現(xiàn)網(wǎng)上已經(jīng)有很多，本人在此講述的是在DES算法加密過(guò)程中如何查看16迭代過(guò)程中生成的Ki,Li,Ri,Fi,Si等，這樣可以當(dāng)做一個(gè)DES加密對(duì)照器，這樣可以方便的發(fā)現(xiàn)你在加密過(guò)程中出現(xiàn)的錯(cuò)誤!
標(biāo)簽： Encrypton Standard Data DES
上傳時(shí)間： 2015-06-22
上傳用戶：zhangliming420
This application report describes the use of Timer_A3 to decode RC5 and SiRC TV IR remote control Signals. The decoder described in this report is interrupt-driven and operates a background function uSing specific features the Timer_A3. Only a small portion of the MSP430 CPU?s nonreal-time resources is used. Specific hardware bit-latching capabilities of the Timer_A3 module are used for real-time decoding of the IR data Signal, independent and asynchronous to the CPU. CPU activity and power consumption are kept to an absolute minimum level. The Timer_A3 decoder implementation also allows other tasks to occur Simultaneously if required. The solutions provided are written specifically for MSP430x11x(1) and MSP430x12x derivatives, but can be adapted to any other MSP430 incorporating Timer_A3. 電視遙控器設(shè)計(jì)基於MSP430
標(biāo)簽： application describes Timer_A control
上傳時(shí)間： 2014-01-01
上傳用戶：qq21508895
可以分析出TS流文件的軟件，有興趣的可以下來(lái)玩玩。對(duì)初學(xué)PSi/Si標(biāo)準(zhǔn)的朋友很有用
上傳時(shí)間： 2014-11-18
上傳用戶：xjz632
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