CDMA 2000第三層協議標準 Upper Layer (Layer 3) Signaling Standard for cdma2000 Standards for Spread Spectrum Systems
標簽： Layer 2000 Signaling Standards
上傳時間： 2015-05-12
上傳用戶：tuilp1a
Program-controlled switching technology, introduced on the 7th and Signaling technology exchange program
標簽： technology Program-controlled introduced switching
上傳時間： 2014-01-14
上傳用戶：ruixue198909
In 揚erformance of multi-carrier DS CDMA Systems?we apply a multi-carrier Signaling technique to a direct-sequence CDMA system, where a data sequence multiplied by a spreading sequence modulates multiple carriers, rather than a single carrier. The receiver provides a correlator for each carrier, and the outputs of the correlators are combined with a maximal-ratio combiner. This type of Signaling has the desirable properties of exhibiting a narrowband interference suppression effect, along with robustness to fading, without requiring the use of either an explicit RAKE structure or an interference suppression filter.
標簽： multi-carrier erformance Signaling technique
上傳時間： 2017-07-31
上傳用戶：宋桃子
DSSS Signaling for Range Estimation
標簽： Estimation Signaling Range DSSS
上傳時間： 2017-08-11
上傳用戶：縹緲
數字射頻存儲器(Digital Radio FreqlJencyr：Memory DRFM)具有對射頻信號和微波信號的存儲、處理及傳輸能力，已成為現代雷達系統的重要部件。現代雷達普遍采用了諸如脈沖壓縮、相位編碼等更為復雜的信號處理技術，DRFM由于具有處理這些相干波形的能力，被越來越廣泛地應用于電子對抗領域作為射頻頻率源。目前，國內外對DRFM技術的研究還處于起步階段，DRFM部件在采樣率、采樣精度及存儲容量等方面，還不能滿足現代雷達信號處理的要求。 本文介紹了DRFM的量化類型、基本組成及其工作原理，在現有的研究基礎上提出了一種便于工程實現的設計方法，給出了基于現場可編程門陣列(Field Programmable Gate Array FPGA)實現的幅度量化DRFM設計方案。本方案的采樣率為1 GHz、采樣精度12位，具體實現是采用4個采樣率為250 MHz的ADC并行交替等效時間采樣以達到1 GHz的采樣率。單通道內采用數字正交采樣技術進行相干檢波，用于保存信號復包絡的所有信息。利用FPGA器件實現DRFM的控制器和多路采樣數據緩沖器，采用硬件描述語言(Very High Speed}lardware Description Language VHDL)實現了DRFM電路的FPGA設計和功能仿真、時序分析。方案中采用了大量的低壓差分信號(Low Voltage Differential Signaling LVDS)邏輯的芯片，從而大大降低了系統的功耗，提高了系統工作的可靠性。本文最后對采用的數字信號處理算法進行了仿真，仿真結果證明了設計方案的可行性。 本文提出的基于FPGA的多通道DRFM系統與基于專用FIFO存儲器的DRFM相比，具有更高的性能指標和優越性。
上傳時間： 2013-06-01
上傳用戶：lanwei
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides theelectrical interface between an asynchronous communication controller and the serial-port connector. Thiscombination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, orcompatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-Vsupply. In addition, the device includes an always-active noninverting output (ROUT2B), which allowsapplications using the ring indicator to transmit data while the device is powered down. The device operates atdata Signaling rates up to 250 kbit/s and a maximum of 30-V/ms driver output slew rate.
標簽： MULTICHANNEL 5.5 TO RS
上傳時間： 2013-10-19
上傳用戶：ddddddd
A Computer-On-Module, or COM, is a Module with all components necessary for a bootable host computer, packaged as a super component. A COM requires a Carrier Board to bring out I/O and to power up. COMs are used to build single board computer solutions and offer OEMs fast time-to-market with reduced development cost. Like integrated circuits, they provide OEMs with significant freedom in meeting form-fit-function requirements. For all these reasons the COM methodology has gained much popularity with OEMs in the embedded industry. COM Express® is an open industry standard for Computer-On-Modules. It is designed to be future proof and to provide a smooth transition path from legacy parallel interfaces to LVDS (Low Voltage Differential Signaling) interfaces. These include the PCI bus and parallel ATA on the one hand and PCI Express and Serial ATA on the other hand.
上傳時間： 2013-11-05
上傳用戶：Wwill
The Cyclone® III PCI development board provides a hardware platform for developing and prototyping low-power, high-performance, logic-intensive PCI-based designs. The board provides a high-density of the memory to facilitate the design and development of FPGA designs which need huge memory storage, and also includes Low-Voltage Differential Signaling (LVDS) interface of the High-Speed Terasic Connectors (HSTCs) for extra high-speed interface application.
標簽： development developing prototypi provides
上傳時間： 2017-01-29
上傳用戶：jjj0202
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support. For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the USB Signaling requirements. Today s gate arrays operate comfortably between 30 and 60 MHz. With USB 2.0 Signaling running at hundreds of MHz, the existing design methodology must change.
標簽： technology 2.0 USB designed
上傳時間： 2014-01-02
上傳用戶：二驅蚊器
High volume USB 2.0 devices will be designed using ASIC technology with embedded USB 2.0 support. For full-speed USB devices the operating frequency was low enough to allow data recovery to be handled in a vendors VHDL code, with the ASIC vendor providing only a simple level translator to meet the USB Signaling requirements. Today s gate arrays operate comfortably between 30 and 60 MHz. With USB 2.0 Signaling running at hundreds of MHz, the existing design methodology must change.
標簽： technology 2.0 USB designed
上傳時間： 2017-07-05
上傳用戶：zhoujunzhen
