Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
The exacting technological demands created byincreasing bandwidth requirements have given riseto significant advances in FPGA technology thatenable engineers to successfully incorporate highspeedI/O interfaces in their designs. One aspect ofdesign that plays an increasingly important role isthat of the FPGA package. As the interfaces get fasterand wider, choosing the right package has becomeone of the key considerations for the systemdesigner.
上傳時間： 2013-10-22
上傳用戶：1234xhb
Xilinx Next Generation 28 nm FPGA Technology Overview Xilinx has chosen 28 nm high-κ metal gate (HKMG) highperformance,low-power process technology and combined it with a new unified ASMBL™ architecture to create a new generation of FPGAs that offer lower power and higher performance. These devices enable unprecedented levels of integration and bandwidth and provide system architects and designers a fully programmable alternative to ASSPs and ASICs.
上傳時間： 2014-12-28
上傳用戶：zhang97080564
針對嵌入式機器視覺系統向獨立化、智能化發展的要求，介紹了一種嵌入式視覺系統--智能相機?；趯χ悄芟鄼C體系結構、組成模塊和圖像采集、傳輸和處理技術的分析，對國內外的幾款智能相機進行比較。綜合技術發展現狀，提出基于FPGA+DSP模式的硬件平臺，并提出智能相機的發展方向。分析結果表明，該系統設計可以實現脫離PC運行，完成圖像獲取與分析，并作出相應輸出。 Abstract: This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP models and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
上傳時間： 2013-10-24
上傳用戶：bvdragon
Abstract: The application note addresses how G3-PLC, a powerline communications protocol approvedby the International Telecommunications Union (ITU), enables mesh networking in advanced metering
上傳時間： 2013-11-17
上傳用戶：erkuizhang
2012年中國（北京）國際物聯網展覽會 2012中國（北京）國際信息網絡及技術設備展覽會 China Beijing International information network & technology equipment exhibition 時間：2012年12月07日－09日 地點：中國國際展覽中心
上傳時間： 2013-10-21
上傳用戶：comer1123
In today’s world of modular networking and telecommunications design, it is becomingincreasingly difficult to keep alignment with the many different and often changing interfaces,both inter-board and intra-board. Each manufacturer has their own spin on the way in whichdevices are connected. To satisfy the needs of our customers, we must be able to support alltheir interface requirements. For us to be able to make products for many customers, we mustadopt a modular approach to the design. This modularity is the one issue that drives the majorproblem of shifting our bits from one modular interface to another.
上傳時間： 2013-11-25
上傳用戶：suicone
FTTx network architectureThe core technology of optical chips in the FTTx transceiversThe core technology of optical transceiver in FTTxThe trend of Next-generation optical transceiver Technology for FTTx
上傳時間： 2013-10-20
上傳用戶：yoleeson
核心板配置 核心板配置癿FPGA芯片是Cyclone II系列癿EP2C8Q208C，具有8256個LEs，36個M4K RAM blocks (4Kbits plus 512 parity bits)，同時具有165,888bit癿RAM，支持18個Embedded multipliers和2個PLL，資源配備十分豐富。實驗證明，返款芯片在嵌入NIOS II軟核將黑釐開収板癿所有外謳全部跑起來，僅占全部資源癿70-80% ; 核心板同時配備了64Mbit癿SDRAM，對亍運行NIOS軟核提供了有力癿保障，返款芯片為時鐘頻率有143MHz，實驗證明，NIOS II軟核主頻可以平穩運行120MHz，速度迓是相當忚癿; 16Mbit癿配置芯片也為返款核心板增色丌少，丌僅可以存儲配置信息，同時迓可以實現NIOS II軟件程序存儲，你編寫癿程序再大也沒有后頊乀憂了。 20M癿有源晶振也是必丌可少癿，他是整個系統癿時鐘源泉;4個LED對亍調試來說更是提供了徑多方便;復位按鍵，重新配置按鍵，配置指示燈一個也丌能少;同時支持AS模式和JTAG模式; 除此以外，核心板一個更大的特點是它可以獨立亍底板單獨運行，為此配備了5V癿電源接口，高質量癿紅色開關，為了安全迓加入了自恢復保險絲。當然擴展口是丌能少癿，除了SDRAM占用癿38個IO口外，其他100個IO全部擴展出來，為大家可以迕行自我擴展實驗做好了充分癿準備。 四、 下擴展板配置 為了讓FPGA収揮它癿強大功能，黑釐開収板為其謳計一款資源豐富癿下擴展板(乀所以叨下擴展板，是因為我們后續迓會有上擴展板)。下面我們就來簡單介終一下下擴展板癿資源配置。 支持網絡功能，配置ENC28J60網口芯片。ENC28J60是Microchip Technology(美國微芯科技公司)推出癿28引腳獨立以太網控刢器。目前市場上大部分以太網控刢器癿封裝均赸過80引腳，而符吅IEEE 802.3協議癿ENC28J60叧有28引腳，既能提供相應癿功能，又可以大大簡化相關謳計，減小空間; 支持USB功能，配置CH376芯片。CH376 支持USB 謳備方式和USB 主機方式，幵丏內置了USB 途訊協議癿基本固件，內置了處理Mass-Storage海量存儲謳備癿與用途訊協議癿固件，內置了SD 卡癿途訊接口固件，內置了FAT16和FAT32 以及FAT12 文件系統癿管理固件，支持常用癿USB 存儲謳備(包括U 盤/USB 硬盤/USB 閃存盤/USB 讀卡器)和SD 卡(包括標準容量SD 卡和高容量HC-SD 卡以及協議兼容癿MMC 卡和TF 卡); 支持板載128*64的點陣LCD。ST7565P控刢芯片，內置DC/DC電路，途過軟件調節對比度。該芯片支持，幵口和串口丟種方式;
上傳時間： 2013-11-23
上傳用戶：ouyangtongze
Linear Technology offers some of the highest performance RF and signal chain solutions for wireless and cellularinfrastructure. These products support worldwide standards including, LTE, WiMAX, GSM,W-CDMA, TD-SCDMA,CDMA, and CDMA2000. Other wireless systems include broadband microwave data links, secure communications,satellite receivers, broadband wireless access, wireless broadcast systems, RFID readers and cable infrastructure
上傳時間： 2013-11-04
上傳用戶：kiklkook
