Connector to maxdsl accounts
標簽： Connector accounts maxdsl to
上傳時間： 2017-06-20
上傳用戶：BOBOniu
connector DWGconnector DWGconnector DWGconnector DWGconnector DWG
標簽： DWGconnector connector DWG
上傳時間： 2017-06-24
上傳用戶：894898248
Printer interface with 89c51 controller (LPT Port connector)
標簽： controller interface connector Printer
上傳時間： 2017-08-12
上傳用戶：xjz632
DuPont connector,杜邦連接器,2.54 DuPont connector,2.54杜邦端子,2.54杜邦terminal,DuPont terminal ,杜邦連接器圖紙,
標簽： DuPont connector 杜邦連接器 2.54 DuPont connector 2.54杜邦端子 2.54杜邦terminal DuPont terminal 杜邦連接器圖紙
上傳時間： 2016-01-08
上傳用戶：1234lucy
DuPont connector杜邦2.54HSG端子規格書含有端子，各種PIN位的膠殼
標簽： connector DuPont 2.54 HSG 杜邦 端子 規格書
上傳時間： 2016-08-06
上傳用戶：sztfjm
TJC3連接器，端子，膠殼，針座承認書,PIN位 2PIN-20PIN可選
標簽： TJC3承認書 TJC3規格書 TJC3針座 TJC3插座 TJC3端子 TJC3連接器 TJC3連接器承認書 TJC3
上傳時間： 2016-09-07
上傳用戶：sztfjm
ANSI-VITA 46.7 Ethernet on VPX Fabric Connector
標簽： ANSI-VITA
上傳時間： 2022-06-26
上傳用戶：bluedrops
確保產品之制造性, R&D在設計階段必須遵循Layout相關規范, 以利制造單位能順利生產, 確保產品良率, 降低因設計而重工之浪費. “PCB Layout Rule” Rev1.60 (發文字號： MT-8-2-0029)發文后, 尚有訂定不足之處, 經補充修正成“PCB Layout Rule” Rev1.70. PCB Layout Rule Rev1.70, 規范內容如附件所示, 其中分為: (1) ”PCB LAYOUT 基本規范”:為R&D Layout時必須遵守的事項, 否則SMT,DIP,裁板時無法生產. (2) “錫偷LAYOUT RULE建議規范”: 加適合的錫偷可降低短路及錫球. (3) “PCB LAYOUT 建議規范”:為制造單位為提高量產良率,建議R&D在design階段即加入PCB Layout. (4) ”零件選用建議規范”: Connector零件在未來應用逐漸廣泛, 又是SMT生產時是偏移及置件不良的主因,故制造希望R&D及采購在購買異形零件時能顧慮制造的需求, 提高自動置件的比例. (5) “零件包裝建議規范”:,零件taping包裝時, taping的公差尺寸規范,以降低拋料率.
上傳時間： 2013-04-24
上傳用戶：vendy
PCB Layout Rule Rev1.70, 規範內容如附件所示, 其中分為: (1) ”PCB LAYOUT 基本規範”:為R&D Layout時必須遵守的事項, 否則SMT,DIP,裁板時無法生產. (2) “錫偷LAYOUT RULE建議規範”: 加適合的錫偷可降低短路及錫球. (3) “PCB LAYOUT 建議規範”:為製造單位為提高量產良率,建議R&D在design階段即加入PCB Layout. (4) ”零件選用建議規範”: Connector零件在未來應用逐漸廣泛, 又是SMT生產時是偏移及置件不良的主因,故製造希望R&D及採購在購買異形零件時能顧慮製造的需求, 提高自動置件的比例.
上傳時間： 2013-10-28
上傳用戶：zhtzht
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
