#include "iostream" using namespace std; class Matrix { private: double** A; //矩陣A double *b; //向量b public: int size; Matrix(int ); ~Matrix(); friend double* Dooli(Matrix& ); void Input(); void Disp(); }; Matrix::Matrix(int x) { size=x; //為向量b分配空間并初始化為0 b=new double [x]; for(int j=0;j<x;j++) b[j]=0; //為向量A分配空間并初始化為0 A=new double* [x]; for(int i=0;i<x;i++) A[i]=new double [x]; for(int m=0;m<x;m++) for(int n=0;n<x;n++) A[m][n]=0; } Matrix::~Matrix() { cout<<"正在析構(gòu)中~~~~"<<endl; delete b; for(int i=0;i<size;i++) delete A[i]; delete A; } void Matrix::Disp() { for(int i=0;i<size;i++) { for(int j=0;j<size;j++) cout<<A[i][j]<<" "; cout<<endl; } } void Matrix::Input() { cout<<"請(qǐng)輸入A:"<<endl; for(int i=0;i<size;i++) for(int j=0;j<size;j++){ cout<<"第"<<i+1<<"行"<<"第"<<j+1<<"列:"<<endl; cin>>A[i][j]; } cout<<"請(qǐng)輸入b:"<<endl; for(int j=0;j<size;j++){ cout<<"第"<<j+1<<"個(gè):"<<endl; cin>>b[j]; } } double* Dooli(Matrix& A) { double *Xn=new double [A.size]; Matrix L(A.size),U(A.size); //分別求得U，L的第一行與第一列 for(int i=0;i<A.size;i++) U.A[0][i]=A.A[0][i]; for(int j=1;j<A.size;j++) L.A[j][0]=A.A[j][0]/U.A[0][0]; //分別求得U，L的第r行，第r列 double temp1=0,temp2=0; for(int r=1;r<A.size;r++){ //U for(int i=r;i<A.size;i++){ for(int k=0;k<r-1;k++) temp1=temp1+L.A[r][k]*U.A[k][i]; U.A[r][i]=A.A[r][i]-temp1; } //L for(int i=r+1;i<A.size;i++){ for(int k=0;k<r-1;k++) temp2=temp2+L.A[i][k]*U.A[k][r]; L.A[i][r]=(A.A[i][r]-temp2)/U.A[r][r]; } } cout<<"計(jì)算U得:"<<endl; U.Disp(); cout<<"計(jì)算L的:"<<endl; L.Disp(); double *Y=new double [A.size]; Y[0]=A.b[0]; for(int i=1;i<A.size;i++ ){ double temp3=0; for(int k=0;k<i-1;k++) temp3=temp3+L.A[i][k]*Y[k]; Y[i]=A.b[i]-temp3; } Xn[A.size-1]=Y[A.size-1]/U.A[A.size-1][A.size-1]; for(int i=A.size-1;i>=0;i--){ double temp4=0; for(int k=i+1;k<A.size;k++) temp4=temp4+U.A[i][k]*Xn[k]; Xn[i]=(Y[i]-temp4)/U.A[i][i]; } return Xn; } int main() { Matrix B(4); B.Input(); double *X; X=Dooli(B); cout<<"~~~~解得:"<<endl; for(int i=0;i<B.size;i++) cout<<"X["<<i<<"]:"<<X[i]<<" "; cout<<endl<<"呵呵呵呵呵"; return 0; }
標(biāo)簽： 道理特分解法
上傳時(shí)間： 2018-05-20
上傳用戶：Aa123456789
The new digital radio system DAB (Digital Audio Broadcasting, nowadays often called Digital Radio) is a very innovative and universal multimedia broadcast system which will replace the existing AM and FM audio broadcast services in many parts of the world in the future. It was developed in the 1990s by the Eureka 147/DAB project. DAB is very well suited for mobile reception and provides very high robustness against multipath reception. It allows use of single frequency networks (SFNs) for high frequency efficiency.
標(biāo)簽： Broadcasting Principles Digital Audio
上傳時(shí)間： 2020-05-27
上傳用戶：shancjb
In the nineteenth century, scientists, mathematician, engineers and innovators started investigating electromagnetism. The theory that underpins wireless communications was formed by Maxwell. Early demonstrations took place by Hertz, Tesla and others. Marconi demonstrated the first wireless transmission. Since then, the range of applications has expanded at an immense rate, together with the underpinning technology. The rate of development has been incredible and today the level of technical and commercial maturity is very high. This success would not have been possible without understanding radio- wave propagation. This knowledge enables us to design successful systems and networks, together with waveforms, antennal and transceiver architectures. The radio channel is the cornerstone to the operation of any wireless system.
標(biāo)簽： LTE-Advanced Generation Next and
上傳時(shí)間： 2020-05-27
上傳用戶：shancjb
Changes in telecommunications are impacting all types of user group, which include business users, traveling users, small and home offices, and residential users. The acceptance rate of telecom- munications and information services is accelerating significantly. Voice services needed approximately 50 years to reach a very high teledensity; television needed just 15 years to change the culture and lives of many families; the Internet and its related services have been penetrating and changing business practices and private com- munications over the last 2 to 3 years.
標(biāo)簽： Telecommunications Handbook The
上傳時(shí)間： 2020-06-01
上傳用戶：shancjb
Electrostatic discharge (ESD) is one of the most prevalent threats to the reliability of electronic components. It is an event in which a finite amount of charge is trans- ferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time, and, hence, more than 35% of chip damages can be attributed to an ESD-related event. As such, designing on-chip ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.
標(biāo)簽： Electrostatic Protection Discharge
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
The goal of this book is to introduce the simulation methods necessary to describe the behaviour of semiconductor devices during an electrostatic discharge (ESD). The challenge of this task is the correct description of semiconductor devices under very high current density and high temperature transients. As it stands, the book can be no more than a snapshot and a summary of the research in this field during the past few years. The authors hope that the book will provide the basis for further development of simulation methods at this current frontier of device physics.
標(biāo)簽： Development Protection ESD
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
The challenges associated with the design and implementation of Electro- static Discharge (ESD) protection circuits become increasingly complex as technology is scaled well into nano-metric regime. One must understand the behavior of semiconductor devices under very high current densities, high temperature transients in order to surmount the nano-meter ESD challenge. As a consequence, the quest for suitable ESD solution in a given technology must start from the device level. Traditional approaches of ESD design may not be adequate as the ESD damages occur at successively lower voltages in nano-metric dimensions.
標(biāo)簽： Protection Circuit Device Design ESD and
上傳時(shí)間： 2020-06-05
上傳用戶：shancjb
基于TMS320F28335的超聲波流量計(jì)硬件原理圖+軟件源碼本文以TMS320F28335 處理器為核心，設(shè)計(jì)一種用于管道流量測(cè)量的超聲波流量計(jì)。系統(tǒng)硬件由核心板，超聲波發(fā)射和接收電路，切換電路，超聲換能器，基于ADS805 的高速信號(hào)采集電路，人機(jī)交互以及電源等模塊構(gòu)成。采用時(shí)差法進(jìn)行管道流量測(cè)量，時(shí)差測(cè)量采用SCOT 加權(quán)的廣義互相關(guān)時(shí)延估計(jì)算法。本論文設(shè)計(jì)的超聲波流量計(jì)具有測(cè)量速度快、準(zhǔn)確性好、成本低等優(yōu)點(diǎn)。關(guān)鍵字：C2000，超聲波，流量，廣義互相關(guān)算法AbstractA kind of ultrasonic flowmeter using for the pipe flow measurement is designed based onTMS320F28335 in this paper. The system hardware consists of the following parts: the core board,ultrasonic signal transmitter and receiver circuits, switch circuit, ultrasonic transducer, signalacquisition circuit based on ADS805, human-computer interaction module and power supplymodule, etc. The system use the method of time difference for pipeline flow measurement and thetime difference is calculated by the time-delay algorithm of SCOT weighted generalizedcross-correlation. The ultrasonic flowmeter has the features of high testing speed, high precisionand low cost, etc.Keywords: C2000,Ultrasonic, Flow, Generalized Cross-Correlation Algorithm
標(biāo)簽： tms320f28335 超聲波流量計(jì)
上傳時(shí)間： 2022-05-06
上傳用戶：
AR0231AT7C00XUEA0-DRBR（RGB濾光）安森美半導(dǎo)體推出采用突破性減少LED閃爍 (LFM)技術(shù)的新的230萬像素CMOS圖像傳感器樣品AR0231AT，為汽車先進(jìn)駕駛輔助系統(tǒng)(ADAS)應(yīng)用確立了一個(gè)新基準(zhǔn)。新器件能捕獲1080p高動(dòng)態(tài)范圍(HDR)視頻，還具備支持汽車安全完整性等級(jí)B(ASIL B)的特性。LFM技術(shù)(專利申請(qǐng)中)消除交通信號(hào)燈和汽車LED照明的高頻LED閃爍，令交通信號(hào)閱讀算法能于所有光照條件下工作。AR0231AT具有1/2.7英寸(6.82 mm)光學(xué)格式和1928(水平) x 1208(垂直)有源像素陣列。它采用最新的3.0微米背照式(BSI)像素及安森美半導(dǎo)體的DR-Pix?技術(shù)，提供雙轉(zhuǎn)換增益以在所有光照條件下提升性能。它以線性、HDR或LFM模式捕獲圖像，并提供模式間的幀到幀情境切換。 AR0231AT提供達(dá)4重曝光的HDR，以出色的噪聲性能捕獲超過120dB的動(dòng)態(tài)范圍。AR0231AT能同步支持多個(gè)攝相機(jī)，以易于在汽車應(yīng)用中實(shí)現(xiàn)多個(gè)傳感器節(jié)點(diǎn)，和通過一個(gè)簡(jiǎn)單的雙線串行接口實(shí)現(xiàn)用戶可編程性。它還有多個(gè)數(shù)據(jù)接口，包括MIPI(移動(dòng)產(chǎn)業(yè)處理器接口)、并行和HiSPi(高速串行像素接口)。其它關(guān)鍵特性還包括可選自動(dòng)化或用戶控制的黑電平控制，支持?jǐn)U頻時(shí)鐘輸入和提供多色濾波陣列選擇。封裝和現(xiàn)狀：AR0231AT采用11 mm x 10 mm iBGA-121封裝，現(xiàn)提供工程樣品。工作溫度范圍為-40℃至105℃(環(huán)境溫度)，將完全通過AEC-Q100認(rèn)證。
標(biāo)簽： 圖像傳感器
上傳時(shí)間： 2022-06-27
上傳用戶：XuVshu
EIA（ELECTRONIC INDUSTRIES ALLIANCE）標(biāo)準(zhǔn)文檔EIA-CEA-861-B，A DTV Profile for Uncompressed High Speed Digital Interfaces。
標(biāo)簽： ELECTRONIC INDUSTRIES ALLIANCE EIA-CEA
上傳時(shí)間： 2015-09-27
上傳用戶：hphh
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