IEEE 802.11h-2003 IEEE Standard for Information technology—Telecommunications and Information Exchange Between Systems—LAN/MAN Specific Requirements—Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Spectrum and Transmit Power Management Extensions in the 5GHz band in Europe
Under the Energy Independence and Security Act of 2007 (EISA), the National Institute of
Standards and Technology (NIST) was assigned “primary responsibility to coordinate
development of a framework that includes protocols and model standards for information
management to achieve interoperability of Smart Grid devices and systems…” [EISA Section
1305]. 35 This responsibility comes at a time when the electric power grid and electric power
industry are undergoing the most dramatic transformation in many decades. Very significant
investments are being made by industry and the federal government to modernize the power grid.
To realize the full benefits of these investments—and the continued investments forecast for the
coming decades—there is a continued need to establish effective smart grid 36 standards and
protocols for interoperability.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
為了有效地提升鉛酸蓄電池的使用壽命，同時實現對充電過程的監控，設計出一種用單片機控制的36 V鉛酸蓄電池充電電源。本電路采用反激式拓撲，連續電流工作模式，電源管理IC設計在電源的副邊，由ELAN公司的EM78P258N單片機模擬，是用可編程器件模擬電源管理IC，實現智能電源低成本化的一次成功嘗試，通過對單片機的軟件設計實現了充電電源的狀態顯示、充電時間控制、報警、過溫保護、過壓保護、過流保護等功能。本充電器真正的實現了鉛酸蓄電池的三段式充電過程，其最高輸出功率可達90 W，效率約85%，成本不到20元，具有很高的市場競爭力。
Abstract: In order to extend the life of lead-acid battery efficiently and supervise the charging process meanwhile， a 36V lead-acid battery charge powe supply controlled by microcontroller is designed. The charger is flyback switching power supply and works in CCM mode. A EM78P258N microcontroller made by ELAN microelectronics corporation is used as power management IC which is designed at the secondary circuit. The project is a successful attempt to low-cost intelligent power used microcontroller simulating power management IC. The charger also has the functions of the status reveal， charge time control， alarming， thermal protect， current limit and overvoltage protect by the software design. The circuit actually implements the three-step charge process， whose power is up to 90W and whose efficiency can get 85%. The net cost of this charger is less than 20 RMB， so that the charger is of powerful market competitiveness.
介紹了電力操作電源與智能電池巡檢系統的特點，給出了一種基于超低功耗單片機MSP430 F149針對中小型變電站自動化運行的專用設備的基本設計原理及實現方法，最后給出了詳細硬件構成和軟件實現。該系統能滿足中小型變電站安全、可靠、自動運行的要求，并通過與上位機的串行通信實現變電站的遠程管理和控制。
Abstract:
The characters of the intelligent battery data logging system of the electric operation power are introduced.The basic design principle and the implemented methods of the special equipment which only designed for the middle or small transformer substation based on MSP430F149 are prescribed. Finally, the hardware block diagram and the software flow chart are also given. The function that the system finally needs to realize can basically meet with the middle or small transformer substation’s satisfy, reliably,and automatic running.And it can also realize the transformer substation long-distance management and control by serial communicating with the host computer.
The PL2303 USB to Serial adapter is your smart and convenient accessory forconnecting RS-232 serial devices to your USB-equipped Windows host computer. Itprovides a bridge connection with a standard DB 9-pin male serial port connector inone end and a standard Type-A USB plug connector on the other end. You simplyattach the serial device onto the serial port of the cable and plug the USB connectorinto your PC USB port. It allows a simple and easy way of adding serial connectionsto your PC without having to go thru inserting a serial card and traditional portconfiguration.This USB to Serial adapter is ideal for connecting modems, cellular phones, PDAs,digital cameras, card readers and other serial devices to your computer. It providesserial connections up to 1Mbps of data transfer rate. And since USB does not requireany IRQ resource, more devices can be attached to the system without the previoushassles of device and resource conflicts.Finally, the PL-2303 USB to Serial adapter is a fully USB Specification compliantdevice and therefore supports advanced power management such as suspend andresume operations as well as remote wakeup. The PL-2303 USB Serial cable adapteris designed to work on all Windows operating systems.
The NXP LPC314x combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, three channel10-bit A/D, and a myriad of serial and parallel interfaces in a single chip targeted atconsumer, industrial, medical, and communication markets. To optimize system powerconsumption, the LPC314x have multiple power domains and a very flexible ClockGeneration Unit (CGU) that provides dynamic clock gating and scaling.
The NXP LPC315x combine an 180 MHz ARM926EJ-S CPU core, High-speed USB 2.0OTG, 192 KB SRAM, NAND flash controller, flexible external bus interface, an integratedaudio codec, Li-ion charger, Real-Time Clock (RTC), and a myriad of serial and parallelinterfaces in a single chip targeted at consumer, industrial, medical, and communicationmarkets. To optimize system power consumption, the LPC315x have multiple powerdomains and a very flexible Clock Generation Unit (CGU) that provides dynamic clockgating and scaling.The LPC315x is implemented as multi-chip module with two side-by-side dies, one fordigital fuctions and one for analog functions, which include a Power Supply Unit (PSU),audio codec, RTC, and Li-ion battery charger.
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of
Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
