Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
標(biāo)簽： Base-Station Applications Single-Chip Transceiver
上傳時間： 2013-11-07
上傳用戶：songrui
WP369可擴(kuò)展式處理平臺-各種嵌入式系統(tǒng)的理想解決方案 ：Delivering unrivaled levels of system performance,flexibility, scalability, and integration to developers,Xilinx's architecture for a new Extensible Processing Platform is optimized for system power, cost, and size. Based on ARM's dual-core Cortex™-A9 MPCore processors and Xilinx’s 28 nm programmable logic,the Extensible Processing Platform takes a processor-centric approach by defining a comprehensive processor system implemented with standard design methods. This approach provides Software Developers a familiar programming environment within an optimized, full featured,powerful, yet low-cost, low-power processing platform.
標(biāo)簽： 369 WP 擴(kuò)展式 處理平臺
上傳時間： 2013-10-22
上傳用戶：685
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標(biāo)簽： Methodology Design Reuse FPGA
上傳時間： 2013-10-23
上傳用戶：旗魚旗魚
波長信號的解調(diào)是實現(xiàn)光纖光柵傳感網(wǎng)絡(luò)的關(guān)鍵，基于現(xiàn)有的光纖光柵傳感器解調(diào)方法，提出一種基于FPGA的雙匹配光纖光柵解調(diào)方法，此系統(tǒng)是一種高速率、高精度、低成本的解調(diào)系統(tǒng)，并且通過引入雙匹配光柵有效地克服了雙值問題同時擴(kuò)大了檢測范圍。分析了光纖光柵的測溫原理并給出了該方案軟硬件設(shè)計，綜合考慮系統(tǒng)的解調(diào)精度和FPGA的處理速度給出了基于拉格朗日的曲線擬合算法。 Abstract: Sensor is one of the most important application of the fiber grating. Wavelength signal demodulating is the key techniques to carry out fiber grating sensing network， based on several existing methods of fiber grating sensor demodulation inadequate， a two-match fiber grating demodulation method was presented. This system is a high-speed， high precision， low-cost demodulation system. And by introducing a two-match grating effectively overcomes the problem of double value while expands the scope of testing. This paper analyzes the principle of fiber Bragg grating temperature and gives the software and hardware design of the program. Considering the system of demodulation accuracy and processing speed of FPGA，this paper gives the curve fitting algorithm based on Lagrange.
標(biāo)簽： FPGA 光纖光柵 解調(diào)系統(tǒng)
上傳時間： 2014-07-24
上傳用戶：caiguoqing
The Maxim Integrated 71M6541-DB REV 3.0 Demo Board is a demonstration board for evaluating the 71M6541 device for single-phase electronic energy metering applications in conjunction with the Remote Sensor Inter-face. It incorporates a 71M6541 integrated circuit, a 71M6601 Remote Interface IC, peripheral circuitry such as a serial EEPROM, emulator port, and on-board power supply. A serial to USB converter allows communication to a PC through a USB port. The Demo Board allows the evaluation of the 71M6541 energy meter chip for measurement accuracy and overall system use.
上傳時間： 2013-11-06
上傳用戶：雨出驚人love
Abstract: The process of designing a radio system can be complex and often involves many project tradeoffs. Witha little insight, balancing these various characteristics can make the job of designing a radio system easier. Thistutorial explores these tradeoffs and provides details to consider for various radio applications. With a focus on theindustrial, scientific, medical (ISM) bands, the subjects of frequency selection, one-way versus two-way systems,modulation techniques, cost, antenna options, power-supply influences, effects on range, and protocol selectionare explored.
標(biāo)簽： 無線
上傳時間： 2013-12-13
上傳用戶：eastgan
為滿足無線網(wǎng)絡(luò)技術(shù)具有低功耗、節(jié)點體積小、網(wǎng)絡(luò)容量大、網(wǎng)絡(luò)傳輸可靠等技術(shù)要求，設(shè)計了一種以MSP430單片機(jī)和CC2420射頻收發(fā)器組成的無線傳感節(jié)點。通過分析其節(jié)點組成，提出了ZigBee技術(shù)中的幾種網(wǎng)絡(luò)拓?fù)湫问剑⒀芯苛薢igBee路由算法。針對不同的傳輸要求形式選用不同的網(wǎng)絡(luò)拓?fù)湫问娇梢员M大可能地減少系統(tǒng)成本。同時針對不同網(wǎng)絡(luò)選用正確的ZigBee路由算法有效地減少了網(wǎng)絡(luò)能量消耗，提高了系統(tǒng)的可靠性。應(yīng)用試驗表明，采用ZigBee方式通信可以提高傳輸速率且覆蓋范圍大，與傳統(tǒng)的有線通信方式相比可以節(jié)約40%左右的成本。 Abstract: To improve the proposed technical requirements such as low-ower， small nodes， large capacity and reliable network transmission， wireless sensor nodes based on MSP430 MCU and CC2420 RF transceiver were designed. This paper provided network topology of ZigBee technology by analysing the component of the nodes and researched ZigBee routing algorithm. Aiming at different requirements of transmission mode to choose the different network topologies form can most likely reduce the system cost. And aiming at different network to choose the correct ZigBee routing algorithm can effectively reduced the network energy consumption and improved the reliability of the system. Results show that the communication which used ZigBee mode can improve the transmission rate， cover more area and reduce 40% cost compared with traditional wired communications mode.
標(biāo)簽： ZigBee 無線傳感網(wǎng)絡(luò) 協(xié)議研究 路由
上傳時間： 2013-10-09
上傳用戶：robter
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
標(biāo)簽： Considerations Guidelines and Design
上傳時間： 2013-11-09
上傳用戶：ls530720646
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-11-21
上傳用戶：不懂夜的黑
Abstract: This application note discusses the development and deployment of 3G cellular femtocell base stations. The technicalchallenges for last-mile residential connectivity and adding system capacity in dense urban environments are discussed, with 3Gfemtocell base stations as a cost-effective solution. Maxim's 3GPP TS25.104-compliant transceiver solution is presented along withcomplete radio reference designs such as RD2550. For more information on the RD2550, see reference design 5364, "FemtocellRadio Reference Designs Using the MAX2550–MAX2553 Transceivers."
標(biāo)簽： Base-Station Applications Single-Chip Transceiver
上傳時間： 2013-11-05
上傳用戶：超凡大師
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