<li id="uiamo"></li> 中文版詳情瀏覽：http://www.elecfans.com/emb/fpga/20130715324029.html Xilinx UltraScale:The Next-Generation Architecture for Your Next-Generation Architecture The Xilinx® UltraScale™ architecture delivers unprecedented levels of integration and capability with ASIC-class system- level performance for the most demanding applications. The UltraScale architecture is the industr y's f irst application of leading-edge ASIC architectural enhancements in an All Programmable architecture that scales from 20 nm planar through 16 nm FinFET technologies and beyond, in addition to scaling from monolithic through 3D ICs. Through analytical co-optimization with the X ilinx V ivado® Design Suite, the UltraScale architecture provides massive routing capacity while intelligently resolving typical bottlenecks in ways never before possible. This design synergy achieves greater than 90% utilization with no performance degradation. Some of the UltraScale architecture breakthroughs include: • Strategic placement (virtually anywhere on the die) of ASIC-like system clocks, reducing clock skew by up to 50% • Latency-producing pipelining is virtually unnecessary in systems with massively parallel bus architecture, increasing system speed and capability • Potential timing-closure problems and interconnect bottlenecks are eliminated, even in systems requiring 90% or more resource utilization • 3D IC integration makes it possible to build larger devices one process generation ahead of the current industr y standard • Greatly increased system performance, including multi-gigabit serial transceivers, I/O, and memor y bandwidth is available within even smaller system power budgets • Greatly enhanced DSP and packet handling The Xilinx UltraScale architecture opens up whole new dimensions for designers of ultra-high-capacity solutions.
標(biāo)簽： UltraScale Xilinx 架構(gòu)
上傳時(shí)間： 2013-11-21
上傳用戶：wxqman
Abstract: Using a wafer-level package (WLP) can reduce the overall size and cost of your solution.However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, ifnot carefully planned, result in an unreliable design. This article presents some PCB designconsiderations and general recommendations for choosing a 0.4mm- or 0.5mm-pitch WLP for yourapplication.
標(biāo)簽： Considerations Guidelines and Design
上傳時(shí)間： 2013-11-09
上傳用戶：ls530720646
Verilog_HDL的基本語(yǔ)法詳解（夏宇聞版）:Verilog HDL是一種用于數(shù)字邏輯電路設(shè)計(jì)的語(yǔ)言。用Verilog HDL描述的電路設(shè)計(jì)就是該電路的Verilog HDL模型。Verilog HDL既是一種行為描述的語(yǔ)言也是一種結(jié)構(gòu)描述的語(yǔ)言。這也就是說(shuō)，既可以用電路的功能描述也可以用元器件和它們之間的連接來(lái)建立所設(shè)計(jì)電路的Verilog HDL模型。Verilog模型可以是實(shí)際電路的不同級(jí)別的抽象。這些抽象的級(jí)別和它們對(duì)應(yīng)的模型類型共有以下五種： 系統(tǒng)級(jí)（system）：用高級(jí)語(yǔ)言結(jié)構(gòu)實(shí)現(xiàn)設(shè)計(jì)模塊的外部性能的模型。 算法級(jí)（algorithm）：用高級(jí)語(yǔ)言結(jié)構(gòu)實(shí)現(xiàn)設(shè)計(jì)算法的模型。 RTL級(jí)（Register Transfer Level）：描述數(shù)據(jù)在寄存器之間流動(dòng)和如何處理這些數(shù)據(jù)的模型。 門級(jí)（gate-level）：描述邏輯門以及邏輯門之間的連接的模型。 開關(guān)級(jí)（switch-level）：描述器件中三極管和儲(chǔ)存節(jié)點(diǎn)以及它們之間連接的模型。 一個(gè)復(fù)雜電路系統(tǒng)的完整Verilog HDL模型是由若干個(gè)Verilog HDL模塊構(gòu)成的，每一個(gè)模塊又可以由若干個(gè)子模塊構(gòu)成。其中有些模塊需要綜合成具體電路，而有些模塊只是與用戶所設(shè)計(jì)的模塊交互的現(xiàn)存電路或激勵(lì)信號(hào)源。利用Verilog HDL語(yǔ)言結(jié)構(gòu)所提供的這種功能就可以構(gòu)造一個(gè)模塊間的清晰層次結(jié)構(gòu)來(lái)描述極其復(fù)雜的大型設(shè)計(jì)，并對(duì)所作設(shè)計(jì)的邏輯電路進(jìn)行嚴(yán)格的驗(yàn)證。 Verilog HDL行為描述語(yǔ)言作為一種結(jié)構(gòu)化和過(guò)程性的語(yǔ)言，其語(yǔ)法結(jié)構(gòu)非常適合于算法級(jí)和RTL級(jí)的模型設(shè)計(jì)。這種行為描述語(yǔ)言具有以下功能： · 可描述順序執(zhí)行或并行執(zhí)行的程序結(jié)構(gòu)。 · 用延遲表達(dá)式或事件表達(dá)式來(lái)明確地控制過(guò)程的啟動(dòng)時(shí)間。 · 通過(guò)命名的事件來(lái)觸發(fā)其它過(guò)程里的激活行為或停止行為。 · 提供了條件、if-else、case、循環(huán)程序結(jié)構(gòu)。 · 提供了可帶參數(shù)且非零延續(xù)時(shí)間的任務(wù)（task）程序結(jié)構(gòu)。 · 提供了可定義新的操作符的函數(shù)結(jié)構(gòu)（function）。 · 提供了用于建立表達(dá)式的算術(shù)運(yùn)算符、邏輯運(yùn)算符、位運(yùn)算符。 · Verilog HDL語(yǔ)言作為一種結(jié)構(gòu)化的語(yǔ)言也非常適合于門級(jí)和開關(guān)級(jí)的模型設(shè)計(jì)。因其結(jié)構(gòu)化的特點(diǎn)又使它具有以下功能： - 提供了完整的一套組合型原語(yǔ)（primitive）; - 提供了雙向通路和電阻器件的原語(yǔ); - 可建立MOS器件的電荷分享和電荷衰減動(dòng)態(tài)模型。 Verilog HDL的構(gòu)造性語(yǔ)句可以精確地建立信號(hào)的模型。這是因?yàn)樵赩erilog HDL中，提供了延遲和輸出強(qiáng)度的原語(yǔ)來(lái)建立精確程度很高的信號(hào)模型。信號(hào)值可以有不同的的強(qiáng)度，可以通過(guò)設(shè)定寬范圍的模糊值來(lái)降低不確定條件的影響。 Verilog HDL作為一種高級(jí)的硬件描述編程語(yǔ)言，有著類似C語(yǔ)言的風(fēng)格。其中有許多語(yǔ)句如：if語(yǔ)句、case語(yǔ)句等和C語(yǔ)言中的對(duì)應(yīng)語(yǔ)句十分相似。如果讀者已經(jīng)掌握C語(yǔ)言編程的基礎(chǔ)，那么學(xué)習(xí)Verilog HDL并不困難，我們只要對(duì)Verilog HDL某些語(yǔ)句的特殊方面著重理解，并加強(qiáng)上機(jī)練習(xí)就能很好地掌握它，利用它的強(qiáng)大功能來(lái)設(shè)計(jì)復(fù)雜的數(shù)字邏輯電路。下面我們將對(duì)Verilog HDL中的基本語(yǔ)法逐一加以介紹。
標(biāo)簽： Verilog_HDL
上傳時(shí)間： 2014-12-04
上傳用戶：cppersonal
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時(shí)間： 2013-11-21
上傳用戶：不懂夜的黑
The introduction of Spartan-3™ devices has createdmultiple changes in the evolution of embedded controldesigns and pushed processing capabilities to the “almostfreestage.” With these new FPGAs falling under $20, involume, with over 1 million system gates, and under $5for 100K gate-level units, any design with programmablelogic has a readily available 8- or 16-bit processor costingless than 75 cents and 32-bit processor for less than $1.50.
上傳時(shí)間： 2013-10-21
上傳用戶：ligi201200
WP409利用Xilinx FPGA打造出高端比特精度和周期精度浮點(diǎn)DSP算法實(shí)現(xiàn)方案： High-Level Implementation of Bit- and Cycle-Accurate Floating-Point DSP Algorithms with Xilinx FPGAs
上傳時(shí)間： 2013-10-21
上傳用戶：huql11633
In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
標(biāo)簽： Efficient Verilog Digital Coding
上傳時(shí)間： 2013-11-23
上傳用戶：我干你啊
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
標(biāo)簽： Modelling Guide Navy VHDL
上傳時(shí)間： 2013-11-20
上傳用戶：pzw421125
FPGAs have changed dramatically since Xilinx first introduced them just 15 years ago. In thepast, FPGA were primarily used for prototyping and lower volume applications; custom ASICswere used for high volume, cost sensitive designs. FPGAs had also been too expensive and tooslow for many applications, let alone for System Level Integration (SLI). Plus, the development
標(biāo)簽： Methodology Design Reuse FPGA
上傳時(shí)間： 2013-11-01
上傳用戶：shawvi
數(shù)字與模擬電路設(shè)計(jì)技巧IC與LSI的功能大幅提升使得高壓電路與電力電路除外，幾乎所有的電路都是由半導(dǎo)體組件所構(gòu)成，雖然半導(dǎo)體組件高速、高頻化時(shí)會(huì)有EMI的困擾，不過(guò)為了充分發(fā)揮半導(dǎo)體組件應(yīng)有的性能，電路板設(shè)計(jì)與封裝技術(shù)仍具有決定性的影響。 模擬與數(shù)字技術(shù)的融合由于IC與LSI半導(dǎo)體本身的高速化，同時(shí)為了使機(jī)器達(dá)到正常動(dòng)作的目的，因此技術(shù)上的跨越競(jìng)爭(zhēng)越來(lái)越激烈。雖然構(gòu)成系統(tǒng)的電路未必有clock設(shè)計(jì)，但是毫無(wú)疑問(wèn)的是系統(tǒng)的可靠度是建立在電子組件的選用、封裝技術(shù)、電路設(shè)計(jì)與成本，以及如何防止噪訊的產(chǎn)生與噪訊外漏等綜合考慮。機(jī)器小型化、高速化、多功能化使得低頻/高頻、大功率信號(hào)/小功率信號(hào)、高輸出阻抗/低輸出阻抗、大電流/小電流、模擬/數(shù)字電路，經(jīng)常出現(xiàn)在同一個(gè)高封裝密度電路板，設(shè)計(jì)者身處如此的環(huán)境必需面對(duì)前所未有的設(shè)計(jì)思維挑戰(zhàn)，例如高穩(wěn)定性電路與吵雜(noisy)性電路為鄰時(shí)，如果未將噪訊入侵高穩(wěn)定性電路的對(duì)策視為設(shè)計(jì)重點(diǎn)，事后反復(fù)的設(shè)計(jì)變更往往成為無(wú)解的夢(mèng)魘。模擬電路與高速數(shù)字電路混合設(shè)計(jì)也是如此，假設(shè)微小模擬信號(hào)增幅后再將full scale 5V的模擬信號(hào)，利用10bit A/D轉(zhuǎn)換器轉(zhuǎn)換成數(shù)字信號(hào)，由于分割幅寬祇有4.9mV，因此要正確讀取該電壓level并非易事，結(jié)果造成10bit以上的A/D轉(zhuǎn)換器面臨無(wú)法順利運(yùn)作的窘境。另一典型實(shí)例是使用示波器量測(cè)某數(shù)字電路基板兩點(diǎn)相隔10cm的ground電位，理論上ground電位應(yīng)該是零，然而實(shí)際上卻可觀測(cè)到4.9mV數(shù)倍甚至數(shù)十倍的脈沖噪訊(pulse noise)，如果該電位差是由模擬與數(shù)字混合電路的grand所造成的話，要測(cè)得4.9 mV的信號(hào)根本是不可能的事情，也就是說(shuō)為了使模擬與數(shù)字混合電路順利動(dòng)作，必需在封裝與電路設(shè)計(jì)有相對(duì)的對(duì)策，尤其是數(shù)字電路switching時(shí)，ground vance noise不會(huì)入侵analogue ground的防護(hù)對(duì)策，同時(shí)還需充分檢討各電路產(chǎn)生的電流回路(route)與電流大小，依此結(jié)果排除各種可能的干擾因素。以上介紹的實(shí)例都是設(shè)計(jì)模擬與數(shù)字混合電路時(shí)經(jīng)常遇到的瓶頸，如果是設(shè)計(jì)12bit以上A/D轉(zhuǎn)換器時(shí)，它的困難度會(huì)更加復(fù)雜。
標(biāo)簽： 數(shù)字 模擬電路 設(shè)計(jì)技巧
上傳時(shí)間： 2014-02-12
上傳用戶：wenyuoo
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