本文簡單討論并總結了VHDL、Verilog，System verilog 這三中語言的各自特點和區別As the number of enhancements to variousHardware Description Languages (HDLs) hasincreased over the past year, so too has the complexityof determining which language is best fora particular design. Many designers and organizationsare contemplating whether they shouldswitch from one HDL to another.
標簽： Verilog verilog System VHDL
上傳時間： 2013-10-16
上傳用戶：牛布牛
One of the most misunderstood constructs in the Verilog language is the nonblockingassignment. Even very experienced Verilog designers do not fully understand how nonblockingassignments are scheduled in an IEEE compliant Verilog simulator and do not understand whenand why nonblocking assignments should be used. This paper details how Verilog blocking andnonblocking assignments are scheduled, gives important coding guidelines to infer correctsynthesizable logic and details coding styles to avoid Verilog simulation race conditions
上傳時間： 2013-10-17
上傳用戶：tb_6877751
CAM350 為PCB 設計和PCB 生產提供了相應的工具（CAM350 for PCB designers 和CAM350 for CAM Engineers），很容易地把PCB設計和PCB生產融合起來。CAM350 v8.7的目標是在PCB設計和PCB制造之間架起一座橋梁隨著如今電子產品的朝著小體積、高速度、低價格的趨勢發展，導致了設計越來越復雜，這就要求精確地把設計數據轉換到PCB生產加工中去。CAM350為您提供了從PCB設計到生產制程的完整流程，從PCB設計數據到成功的PCB生產的轉化將變得高效和簡化。基于PCB制造過程，CAM350為PCB設計和PCB生產提供了相應的工具（CAM350 for PCB designers和CAM350 for CAM Engineers），很容易地把PCB設計和PCB生產融合起來。平滑流暢地轉換完整的工程設計意圖到PCB生產中提高PCB設計的可生產性，成就成功的電子產品為PCB設計和制造雙方提供有價值的橋梁作用CAM350是一款獨特、功能強大、健全的電子工業應用軟件。DOWNSTREAM開發了最初的基于PCB設計平臺的CAM350，到基于整個生產過程的CAM350并且持續下去。CAM350功能強大，應用廣泛，一直以來它的信譽和性能都是無與倫比的。 CAM350PCB設計的可制造性分析和優化工具今天的PCB 設計和制造人員始終處于一種強大的壓力之下，他們需要面對業界不斷縮短將產品推向市場的時間、品質和成本開銷的問題。在48 小時，甚至在24 小時內完成工作更是很平常的事，而產品的復雜程度卻在日益增加，產品的生命周期也越來越短，因此，設計人員和制造人員之間協同有效工作的壓力也隨之越來越大！隨著電子設備的越來越小、越來越復雜，使得致力于電子產品開發每一個人員都需要解決批量生產的問題。如果到了完成制造之后發現設計失敗了，則你將錯過推向市場的大好時間。所有的責任并不在于制造加工人員，而是這個項目的全體人員。多年的實踐已經證明了，你需要清楚地了解到有關制造加工方面的需求是什么，有什么方面的限制，在PCB設計階段或之后的處理過程是什么。為了在制造加工階段能夠協同工作，你需要在設計和制造之間建立一個有機的聯系橋梁。你應該始終保持清醒的頭腦，記住從一開始，你的設計就應該是容易制造并能夠取得成功的。CAM350 在設計領域是一個物有所值的制造分析工具。CAM350 能夠滿足你在制造加工方面的需求，如果你是一個設計人員，你能夠建立你的設計，將任務完成后提交給產品開發過程中的下一步工序。現在采用CAM350，你能夠處理面向制造方面的一些問題，進行一些簡單地處理，但是對于PCB設計來說是非常有效的，這就被成為"可制造性(Manufacturable)"。可制造性設計(Designing for Fabrication)使用DFF Audit，你能夠確保你的設計中不會包含任何制造規則方面的沖突(Manufacturing Rule Violations)。DFF Audit 將執行超過80 種裸板分析檢查，包括制造、絲印、電源和地、信號層、鉆孔、阻焊等等。建立一種全新的具有藝術特征的Latium 結構，運行DFF Audit 僅僅需要幾分鐘的時間，并具有很高的精度。在提交PCB去加工制造之間，就能夠定位、標識并立刻修改所有的沖突，而不是在PCB板制造加工之后。DFF Audit 將自動地檢查酸角(acid traps)、阻焊條(soldermask slivers)、銅條(copper slivers)、殘缺熱焊盤(starved thermals)、焊錫搭橋(soldermask coverage)等等。它將能夠確保阻焊數據的產生是根據一定安全間距，確保沒有潛在的焊錫搭橋的條件、解決酸角(Acid Traps)的問題，避免在任何制造車間的CAM部門產生加工瓶頸。
上傳時間： 2013-11-23
上傳用戶：四只眼
Abstract: Specifications such as noise, effective number of bits (ENOB), effective resolution, and noise-free resolution inlarge part define how accurate an ADC really is. Consequently, understanding the performance metrics related to noise isone of the most difficult aspects of transitioning from a SAR to a delta-sigma ADC. With the current demand for higherresolution, designers must develop a better understanding of ADC noise, ENOB, effective resolution, and signal-to-noiseratio (SNR). This application note helps that understanding.
上傳時間： 2013-10-16
上傳用戶：x18010875091
This unique guide to designing digital VLSI circuits takes a top-down approach, reflecting the natureof the design process in industry. Starting with architecture design, the book explains the why andhow of digital design, using the physics that designers need to know, and no more.Covering system and component aspects, design verification, VHDL modelling, clocking, signalintegrity, layout, electricaloverstress, field-programmable logic, economic issues, and more, thescope of the book is singularly comprehensive.
標簽： Integrated Digital Circuit Design
上傳時間： 2013-11-04
上傳用戶：life840315
designers of signal receiver systems often need to performcascaded chain analysis of system performancefrom the antenna all the way to the ADC. Noise is a criticalparameter in the chain analysis because it limits theoverall sensitivity of the receiver. An application’s noiserequirement has a signifi cant infl uence on the systemtopology, since the choice of topology strives to optimizethe overall signal-to-noise ratio, dynamic range andseveral other parameters. One problem in noise calculationsis translating between the various units used by thecomponents in the chain: namely the RF, IF/baseband,and digital (ADC) sections of the circuit.
上傳時間： 2014-12-05
上傳用戶：cylnpy
Most circuit designers are familiar with diode dynamiccharacteristics such as charge storage, voltage dependentcapacitance and reverse recovery time. Less commonlyacknowledged and manufacturer specifi ed is diode forwardturn-on time. This parameter describes the timerequired for a diode to turn on and clamp at its forwardvoltage drop. Historically, this extremely short time, unitsof nanoseconds, has been so small that user and vendoralike have essentially ignored it. It is rarely discussed andalmost never specifi ed. Recently, switching regulator clockrate and transition time have become faster, making diodeturn-on time a critical issue. Increased clock rates aremandated to achieve smaller magnetics size; decreasedtransition times somewhat aid overall effi ciency but areprincipally needed to minimize IC heat rise. At clock speedsbeyond about 1MHz, transition time losses are the primarysource of die heating.
上傳時間： 2013-10-10
上傳用戶：誰偷了我的麥兜
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上傳時間： 2014-12-23
上傳用戶：han_zh
The Circuit Designer’s Companion Second edition Tim Williams
標簽： designers Companion Circuit PCB
上傳時間： 2013-11-04
上傳用戶：fredguo
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
