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java基本概念解釋:封裝 (encapsulation) ,繼承 (inherit) ,this用法,static ,final,super
標簽： encapsulation inherit static final
上傳時間： 2016-08-11
上傳用戶：gundamwzc
We propose and analyze several timestamping of an MPEG-2 Transport Stream transmitted strategies for performing over a packet-switched network using the PCR-unaware encapsulation scheme, and analyze their effect on the quality of the recovered clock at the MPEG-2 Systems decoder.
標簽： timestamping transmitted strategies Transport
上傳時間： 2014-12-05
上傳用戶：450976175
IPsec VPN的RFC文檔集合: RFC 2401 《Security Architecture for the Internet Protocol》 RFC 2402 《IP Authentication Header》 RFC 2406 《IP Encapsulating Security Payload (ESP)》 RFC 2407 《The Internet IP Security Domain of Interpretation for ISAKMP》 RFC 2408 《Internet Security Association and Key Management Protocol (ISAKMP)》 RFC 2409 《The Internet Key Exchange (IKE)》 RFC 3947 《Negotiation of NAT-Traversal in the IKE》 RFC 3948 《UDP encapsulation of IPsec ESP Packets》
標簽： RFC Architecture Internet Protocol
上傳時間： 2015-04-21
上傳用戶：hebmuljb
The Stanford IBE library is a C implementation of the Boneh-Franklin identity-based encryption scheme. (See Boneh and Franklin, "Identity-Based Encryption from the Weil Pairing", CRYPTO 2001.) There are a few modifications and additions. The Boneh-Franklin scheme is used as a Key encapsulation Mechanism, and off-the-shelf ciphers and HMACs are used for the actual encryption. (See Lynn, "Authenticated Identity-Based Encryption", available on eprint.
標簽： Boneh-Franklin implementation identity-based encryption
上傳時間： 2013-12-20
上傳用戶：yan2267246
Inside the C++ Object Model Inside the C++ Object Model focuses on the underlying mechanisms that support object-oriented programming within C++: constructor semantics, temporary generation, support for encapsulation, inheritance, and "the virtuals"-virtual functions and virtual inheritance. This book shows how your understanding the underlying implementation models can help you code more efficiently and with greater confidence. Lippman dispells the misinformation and myths about the overhead and complexity associated with C++, while pointing out areas in which costs and trade offs, sometimes hidden, do exist. He then explains how the various implementation models arose, points out areas in which they are likely to evolve, and why they are what they are. He covers the semantic implications of the C++ object model and how that model affects your programs.
上傳時間： 2013-12-24
上傳用戶：zhouli
If you are a C++ programmer who desires a fuller understanding of what is going on "under the hood," then Inside the C++ Object Model is for you! Inside the C++ Object Model focuses on the underlying mechanisms that support object-oriented programming within C++: constructor semantics, temporary generation, support for encapsulation, inheritance, and "the virtuals"-virtual functions and virtual inheritance. This book shows how your understanding the underlying implementation models can help you code more efficiently and with greater confidence. Lippman dispells the misinformation and myths about the overhead and complexity associated with C++, while pointing out areas in which costs and trade offs, sometimes hidden, do exist. He then explains how the various implementation models arose, points out areas in which they are likely to evolve, and why they are what they are. He covers the semantic implications of the C++ object model and how that model affects your programs.
標簽： understanding programmer desires fuller
上傳時間： 2017-09-25
上傳用戶：gtzj
A power semiconductor module is basically a power circuit of different materials assembled together using hybrid technology, such as semiconduc- tor chip attachment, wire bonding, encapsulation, etc. The materials involved cover a wide range from insulators, conductors, and semiconduc- tors to organics and inorganics. Since these materials all behave differently under various environmental, electrical, and thermal stresses, proper selec- tion of these materials and the assembly processes are critical. In-depth knowledge of the material properties and the processing techniques is there- fore required to build a high-performance and highly reliable power module.
標簽： Manufacture Electronic Modules Design Power
上傳時間： 2020-06-07
上傳用戶：shancjb
