This document provides practical, common guidelines for incorporating PCI Express interconnect
layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10-
layer or more server baseboard designs. Guidelines and constraints in this document are intended
for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI
Express devices located on the same baseboard (chip-to-chip routing) and interconnects between
a PCI Express device located “down” on the baseboard and a device located “up” on an add-in
card attached through a connector.
This document is intended to cover all major components of the physical interconnect including
design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card
edge-finger and connector considerations. The intent of the guidelines and examples is to help
ensure that good high-speed signal design practices are used and that the timing/jitter and
loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect.
However, while general physical guidelines and suggestions are given, they may not necessarily
guarantee adequate performance of the interconnect for all layouts and implementations.
Therefore, designers should consider modeling and simulation of the interconnect in order to
ensure compliance to all applicable specifications.
The document is composed of two main sections. The first section provides an overview of
general topology and interconnect guidelines. The second section concentrates on physical layout
constraints where bulleted items at the beginning of a topic highlight important constraints, while
the narrative that follows offers additional insight.
Abstract: We can apply a BiCMOS integrated circuit with only resistors and no transistors to solve adifficult design problem. The mythically perfect operational amplifier's gain and temperature coefficient aredependent on external resistor values. Maxim precision resistor arrays are manufactured together on asingle die and then automatically trimmed, to ensure close ratio matching. This guarantees that theoperational amplifier (op amp) gain and temperature coefficient are predictable and reliable, even withlarge production volumes.
Abstract: There are differences between the operation of low-frequency AC transformers and electronic transformersthat supply current to MR16 lamps, and there are also differences in the current draw for MR16 halogen lamps andMR16 LED lamps. These contrasts typically prevent an MR16 LED lamp from operating with most electronictransformers. This article explains how a high-brightness (HB) LED driver optimized for MR16 lamps will allow LEDlamps to be compatible with most electronic transformers.A similar version of this article appeared on Display Plus, July 7, 2012 and in German in Elektronikpraxis, October 1,2012.
Abstract: This application note details a step-by-step design process for the MAX16833 high-voltagehigh-brightness LED driver. This process can speed up prototyping and increase the chance for firstpass
We provide complete power solutions with a full lineup of power managementproducts. This brochure provides an overview of our high performance DC/DC switching regulatorcontrollers for applications including datacom, telecom, industrial, automotive, medical, avionicsand control systems. We make power design easier with our industry-leading field applicationengineering support; a broad selection of demonstration boards with schematics, layout filesand parts lists; SwitcherCAD® software for simulation, application notes and comprehensivetechnical documentation.
In industrial applications, high voltage power supply spikes with durations ranging from a few microseconds to hundreds of millisecondsare commonly encountered. The electronics in these systems must not only survive transient voltage spikes, but in many cases alsooperate reliably throughout the event.
Linear Technology’s high performance battery management ICsenable long battery life and run time, while providing precision charging control, constantstatus monitoring and stringent battery protection. Our proprietary design techniques seamlesslymanage multiple input sources while providing small solution footprints, faster charging and100% standalone operation. Battery and circuit protection features enable improved thermalperformance and high reliability operation.
Abstract: This document details the Oceanside (MAXREFDES9#) subsystem reference design, a 3.3V to 15V input,±15V (±12V) output, isolated power supply. The Oceanside design includes a high-efficiency step-up controller, a36V H-bridge transformer driver for isolated supplies, a wide input range, and adjustable output low-dropout linearregulator (LDO). Test results and hardware files are included.
Abstract: The DS1875 features a pulse-width modulation (PWM) controller that can be used to control aDC-DC converter. The DC-DC converter can then be used to generate the high bias voltages necessaryfor avalanche photodiodes (APDs). This application note describes the operation of a boost converterthat uses the DS1875. Discussion covers the selection of the inductor and switching frequency, and theselection of components that improve the efficiency of the converter. Test data are presented.
Abstract: There are many things to consider when designing a power supply for a field-programmablegate array (FPGA). These include (but are not limited to) the high number of voltage rails, and thediffering requirements for both sequencing/tracking and the voltage ripple limits. This application noteexplains these and other power-supply considerations that an engineer must think through whendesigning a power supply for an FPGA.
