Differential Nonlinearity: Ideally, any two adjacent digitalcodes correspond to output analog voltages that are exactlyone LSB apart. Differential non-linearity is a measure of theworst case deviation from the ideal 1 LSB step. For example,a DAC with a 1.5 LSB output change for a 1 LSB digital codechange exhibits 1⁄2 LSB differential non-linearity. Differentialnon-linearity may be expressed in fractional bits or as a percentageof full scale. A differential non-linearity greater than1 LSB will lead to a non-monotonic transfer function in aDAC.Gain Error (Full Scale Error): The difference between theoutput voltage (or current) with full scale input code and theideal voltage (or current) that should exist with a full scale inputcode.Gain Temperature Coefficient (Full Scale TemperatureCoefficient): Change in gain error divided by change in temperature.Usually expressed in parts per million per degreeCelsius (ppm/°C).Integral Nonlinearity (Linearity Error): Worst case deviationfrom the line between the endpoints (zero and full scale).Can be expressed as a percentage of full scale or in fractionof an LSB.LSB (Lease-Significant Bit): In a binary coded system thisis the bit that carries the smallest value or weight. Its value isthe full scale voltage (or current) divided by 2n, where n is theresolution of the converter.Monotonicity: A monotonic function has a slope whose signdoes not change. A monotonic DAC has an output thatchanges in the same direction (or remains constant) for eachincrease in the input code. the converse is true for decreasing codes.
標簽： Converters Defini DAC
上傳時間： 2013-10-30
上傳用戶：stvnash
•Founded in Jan. 08, 2001 in Shanghai, China.•Fabless IDH focused on Analog & Mixed Signal Chip design & marketing •Over 100 IC introduced.•Over 200 OEM Customer worldwide•ISO-9000 Certified•Distribution Channel in Taiwan, China & Japan To achieve 100% customer satisfactionby producing the technically advanced product with the best quality, on-time delivery and service. Leverages on proprietary process and world-class engineering team to develop innovative & high quality analog solutions that add value to electronics equipment.
標簽： Circuit Analog Design Porta
上傳時間： 2013-10-24
上傳用戶：songnanhua
前面討論了很多內容，基本上涉及了有關PCB板的絕大部分相關的知識。第二章探討了傳輸線的基本原理，第三章探討了串擾，在第四章里我們闡述了許多在現代設計中必須關注的非理想互連的問題。對于信號從驅動端引腳到接收端引腳的電氣路徑的相關問題，我們已經做了一些探究，然而對于硅芯片，即處于封裝內部的IC來說，其信號傳輸通常要通過過孔和連接器來進行，對這樣的情況我們該如何處理？在本章中，我們將通過對封裝、過孔和連接器的研究，闡述其原理，從而指導大家在設計的時候對整個電氣路徑進行完整地分析，即從驅動端內部IC芯片的焊盤到接受器IC芯片的焊盤。
標簽： High-Speed Digital System desi
上傳時間： 2013-11-24
上傳用戶：maizezhen
高速數字系統設計下載pdf:High-Speed Digital SystemDesign—A Handbook ofInterconnect Theory and DesignPracticesStephen H. HallGarrett W. HallJames A. McCallA Wiley-Interscience Publication JOHN WILEY & SONS, INC.New York • Chichester • Weinheim • Brisbane • Singapore • TorontoCopyright © 2000 by John Wiley & Sons, Inc.speeddigital systems at the platform level. The book walks the reader through everyrequired concept, from basic transmission line theory to digital timing analysis, high-speedmeasurement techniques, as well as many other topics. In doing so, a unique balancebetween theory and practical applications is achieved that will allow the reader not only tounderstand the nature of the problem, but also provide practical guidance to the solution.The level of theoretical understanding is such that the reader will be equipped to see beyondthe immediate practical application and solve problems not contained within these pages.Much of the information in this book has not been needed in past digital designs but isabsolutely necessary today. Most of the information covered here is not covered in standardcollege curricula, at least not in its focus on digital design, which is arguably one of the mostsignificant industries in electrical engineering.The focus of this book is on the design of robust high-volume, high-speed digital productssuch as computer systems, with particular attention paid to computer busses. However, thetheory presented is applicable to any high-speed digital system. All of the techniquescovered in this book have been applied in industry to actual digital products that have beensuccessfully produced and sold in high volume.Practicing engineers and graduate and undergraduate students who have completed basicelectromagnetic or microwave design classes are equipped to fully comprehend the theorypresented in this book. At a practical level, however, basic circuit theory is all thebackground required to apply the formulas in this book.
上傳時間： 2013-10-26
上傳用戶：縹緲
OPTOELECTRONICS CIRCUIT COLLECTION AVALANCHE PHOTODIODE BIAS SUPPLY 1Provides an output voltage of 0V to +80V for reverse biasingan avalanche photodiode to control its gain. This circuit canalso be reconfigured to supply a 0V to –80V output.LINEAR TEC DRIVER–1This is a bridge-tied load (BTL) linear amplifier for drivinga thermoelectric cooler (TEC). It operates on a single +5Vsupply and can drive ±2A into a common TEC.LINEAR TEC DRIVER–2This is very similar to DRIVER–1 but its power output stagewas modified to operate from a single +3.3V supply in orderto increase its efficiency. Driving this amplifier from astandard +2.5V referenced signal causes the output transistorsto have unequal power dissipation.LINEAR TEC DRIVER–3This BTL TEC driver power output stage achieves very highefficiency by swinging very close to its supply rails, ±2.5V.This driver can also drive ±2A into a common TEC. Operationis shown with the power output stage operating on±1.5V supplies. Under these conditions, this linear amplifiercan achieve very high efficiency. Application ReportThe following collection of analog circuits may be useful in electro-optics applications such as optical networkingsystems. This page summarizes their salient characteristics.
上傳時間： 2013-10-27
上傳用戶：落花無痕
Radio Frequency Integrated Circuit Design I enjoyed reading this book for a number of reasons. One reason is that itaddresses high-speed analog design in the context of microwave issues. This isan advanced-level book, which should follow courses in basic circuits andtransmission lines. Most analog integrated circuit designers in the past workedon applications at low enough frequency that microwave issues did not arise.As a consequence, they were adept at lumped parameter circuits and often notcomfortable with circuits where waves travel in space. However, in order todesign radio frequency (RF) communications integrated circuits (IC) in thegigahertz range, one must deal with transmission lines at chip interfaces andwhere interconnections on chip are far apart. Also, impedance matching isaddressed, which is a topic that arises most often in microwave circuits. In mycareer, there has been a gap in comprehension between analog low-frequencydesigners and microwave designers. Often, similar issues were dealt with in twodifferent languages. Although this book is more firmly based in lumped-elementanalog circuit design, it is nice to see that microwave knowledge is brought inwhere necessary.Too many analog circuit books in the past have concentrated first on thecircuit side rather than on basic theory behind their application in communications.The circuits usually used have evolved through experience, without asatisfying intellectual theme in describing them. Why a given circuit works bestcan be subtle, and often these circuits are chosen only through experience. Forthis reason, I am happy that the book begins first with topics that require anintellectual approach—noise, linearity and filtering, and technology issues. Iam particularly happy with how linearity is introduced (power series). In therest of the book it is then shown, with specific circuits and numerical examples,how linearity and noise issues arise.
上傳時間： 2014-12-23
上傳用戶：han_zh
介紹高速電路的設計
標簽： High-speed Digital Design 高速數字
上傳時間： 2013-10-16
上傳用戶：yt1993410
【摘要】本文結合作者多年的印制板設計經驗，著重印制板的電氣性能，從印制板穩定性、可靠性方面，來討論多層印制板設計的基本要求。【關鍵詞】印制電路板；表面貼裝器件；高密度互連；通孔【Key words】Printed Circuit Board；Surface Mounting Device；High Density Interface；Via一．概述印制板（PCB－Printed Circuit Board）也叫印制電路板、印刷電路板。多層印制板，就是指兩層以上的印制板，它是由幾層絕緣基板上的連接導線和裝配焊接電子元件用的焊盤組成，既具有導通各層線路，又具有相互間絕緣的作用。隨著SMT（表面安裝技術）的不斷發展，以及新一代SMD（表面安裝器件）的不斷推出，如QFP、QFN、CSP、BGA（特別是MBGA），使電子產品更加智能化、小型化，因而推動了PCB工業技術的重大改革和進步。自1991年IBM公司首先成功開發出高密度多層板（SLC）以來，各國各大集團也相繼開發出各種各樣的高密度互連（HDI）微孔板。這些加工技術的迅猛發展，促使了PCB的設計已逐漸向多層、高密度布線的方向發展。多層印制板以其設計靈活、穩定可靠的電氣性能和優越的經濟性能，現已廣泛應用于電子產品的生產制造中。下面，作者以多年設計印制板的經驗，著重印制板的電氣性能，結合工藝要求，從印制板穩定性、可靠性方面，來談談多層制板設計的基本要領。
上傳時間： 2013-11-19
上傳用戶：zczc
討論、研究高性能覆銅板對它所用的環氧樹脂的性能要求，應是立足整個產業鏈的角度去觀察、分析。特別應從HDI多層板發展對高性能CCL有哪些主要性能需求上著手研究。HDI多層板有哪些發展特點，它的發展趨勢如何——這都是我們所要研究的高性能CCL發展趨勢和重點的基本依據。而HDI多層板的技術發展，又是由它的應用市場——終端電子產品的發展所驅動（見圖1）。 圖1 在HDI多層板產業鏈中各類產品對下游產品的性能需求關系圖 1．HDI多層板發展特點對高性能覆銅板技術進步的影響1.1 HDI多層板的問世，對傳統PCB技術及其基板材料技術是一個嚴峻挑戰20世紀90年代初，出現新一代高密度互連（High Density Interconnection，簡稱為 HDI）印制電路板——積層法多層板（Build—Up Multiplayer printed board，簡稱為 BUM）的最早開發成果。它的問世是全世界幾十年的印制電路板技術發展歷程中的重大事件。積層法多層板即HDI多層板，至今仍是發展HDI的PCB的最好、最普遍的產品形式。在HDI多層板之上，將最新PCB尖端技術體現得淋漓盡致。HDI多層板產品結構具有三大突出的特征：“微孔、細線、薄層化”。其中“微孔”是它的結構特點中核心與靈魂。因此，現又將這類HDI多層板稱作為“微孔板”。HDI多層板已經歷了十幾年的發展歷程，但它在技術上仍充滿著朝氣蓬勃的活力，在市場上仍有著前程廣闊的空間。
上傳時間： 2013-11-22
上傳用戶：gundan
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
上傳時間： 2013-11-10
上傳用戶：1595690
