PhD research, you have already made a decision that will have a major impact on the success of your project, and perhaps even on your future career. You have chosen to work in a particular research group, under the guidance of a particular thesis advisor or supervisor.
標簽： have research decision already
上傳時間： 2017-09-14
上傳用戶：cursor
·SystemVerilog is a rich set of extensions to the IEEE 1364-2001 Verilog Hardware Description Language (Verilog HDL). These extensions address two major aspects of HDL-based design. First, modeling ver
標簽： nbsp SystemVerilog Design for
上傳時間： 2013-07-14
上傳用戶：ainimao
Abstract: A perfect voltage reference produces a stable voltage independent of any external factors. Real-world voltagereferences, of course, are subject to errors caused by many external factors. One causeof these major errors istemperature. Without care, it is easy to operate a voltage reference outside its operating temperature range. Thisapplication note describes how references respond to temperature changes, and how self-heating can cause a voltagereference to operate outside its recommended temperature range. Once understood, this knowledge can then be used toavoid making this design error.
上傳時間： 2013-11-08
上傳用戶：xianglee
This document provides practical, common guidelines for incorporating PCI Express interconnect layouts onto Printed Circuit Boards (PCB) ranging from 4-layer desktop baseboard designs to 10- layer or more server baseboard designs. Guidelines and constraints in this document are intended for use on both baseboard and add-in card PCB designs. This includes interconnects between PCI Express devices located on the same baseboard (chip-to-chip routing) and interconnects between a PCI Express device located “down” on the baseboard and a device located “up” on an add-in card attached through a connector. This document is intended to cover all major components of the physical interconnect including design guidelines for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge-finger and connector considerations. The intent of the guidelines and examples is to help ensure that good high-speed signal design practices are used and that the timing/jitter and loss/attenuation budgets can also be met from end-to-end across the PCI Express interconnect. However, while general physical guidelines and suggestions are given, they may not necessarily guarantee adequate performance of the interconnect for all layouts and implementations. Therefore, designers should consider modeling and simulation of the interconnect in order to ensure compliance to all applicable specifications. The document is composed of two main sections. The first section provides an overview of general topology and interconnect guidelines. The second section concentrates on physical layout constraints where bulleted items at the beginning of a topic highlight important constraints, while the narrative that follows offers additional insight.
上傳時間： 2013-10-15
上傳用戶：busterman
Abstract: The "vampire" drain on electricity by household gadgets is only one indicator of the lack of policies to conserve energy and protect people and businesses from a major energy disaster. Most
上傳時間： 2013-11-18
上傳用戶：wgh_kf
Switching regulators are of universal interest. LinearTechnology has made a major effort to address this topic.A catalog of circuits has been compiled so that a designengineer can swiftly determine which converter type isbest. This catalog serves as a visual index to be browsedthrough for a specific or general interest.
標簽： Collection Switching Regulator Circuit
上傳時間： 2013-11-09
上傳用戶：mh_zhaohy
Designing read/write device (RWD) units for industrial RF-Identification applications is strongly facilitated by the NXP Semiconductors HITAG Reader Chip HTRC110. All needed function blocks, like the antenna driver, modulator demodulator and antenna diagnosis unit, are integrated in the HTRC110. Therefore only a minimum number of additional passive components are required for a complete RWD. This Application Note describes how to design an industrial RF-Identification system with the HTRC110. The major focus is dimensioning of the antenna, all other external components including clock and power supply, as well as the demodulation principle and its implementatio
上傳時間： 2013-10-22
上傳用戶：zhengjian
Although Stellaris microcontrollers have generous internal SRAM capabilities, certain applicationsmay have data storage requirements that exceed the 8 KB limit of the Stellaris LM3S8xx seriesdevices. Since microcontrollers do not have an external parallel data-bus, serial memory optionsmust be considered. Until recently, the ubiquitous serial EEPROM/flash device was the only serialmemory solution. The major limitations of EEPROM and flash technology are slow write speed, slowerase times, and limited write/erase endurance.Recently, serial SRAM devices have become available as a solution for high-speed dataapplications. The N256S08xxHDA series of devices, from AMI Semiconductor, offer 32 K x 8 bits oflow-power data storage, a fast Serial Peripheral Interface (SPI) serial bus, and unlimited write cycles.The parts are available in 8-pin SOIC and compact TSSOP packages.
上傳時間： 2013-10-14
上傳用戶：cxl274287265
In this document, the term Ô60xÕ is used to denote a 32-bit microprocessor from the PowerPC architecture family that conforms to the bus interface of the PowerPC 601ª, PowerPC 603ª, or PowerPC 604 microprocessors. Note that this does not include the PowerPC 602ª microprocessor which has a multiplexed address/data bus. 60x processors implement the PowerPC architecture as it is speciÞed for 32-bit addressing, which provides 32-bit effective (logical) addresses, integer data types of 8, 16, and 32 bits,and ßoating-point data types of 32 and 64 bits (single-precision and double-precision).1.1 Overview The MPC106 provides an integrated high-bandwidth, high-performance, TTL-compatible interface between a 60x processor, a secondary (L2) cache or additional (up to four total) 60x processors, the PCI bus,and main memory. This section provides a block diagram showing the major functional units of the 106 and describes brießy how those units interact.Figure 1 shows the major functional units within the 106. Note that this is a conceptual block diagram intended to show the basic features rather than an attempt to show how these features are physically implemented on the device.
上傳時間： 2013-10-08
上傳用戶：18711024007
Introduction to Xilinx Packaging Electronic packages are interconnectable housings for semiconductor devices. The major functions of the electronic packages are to provide electrical interconnections between the IC and the board and to efficiently remove heat generated by the device. Feature sizes are constantly shrinking, resulting in increased number of transistors being packed into the device. Today's submicron technology is also enabling large-scale functional integration and system-on-a-chip solutions. In order to keep pace with these new advancements in silicon technologies, semiconductor packages have also evolved to provide improved device functionality and performance. Feature size at the device level is driving package feature sizes down to the design rules of the early transistors. To meet these demands, electronic packages must be flexible to address high pin counts, reduced pitch and form factor requirements. At the same time,packages must be reliable and cost effective.
上傳時間： 2013-10-22
上傳用戶：ztj182002
