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LTP5903 Hardware Integration Guide

This product integration guide provides application circuit information for theSmartMesh® LTP5903PC wireless embedded network manager. This guide is acompanion to the 020-0039 SmartMesh LTP5903PC Datasheet, whichdescribes overall product behavior, including detailed information about normaloperating conditions, electrical and mechanical specifications, hardware andsoftware interfaces, and connector pinouts.

標簽： Integration Hardware Guide 5903

上傳時間： 2013-11-14

上傳用戶：農藥鋒6
電平轉換控制功率MOSFET

Abstract: Some power architectures require the power supply sequencer (or system manager) to controldownstream power MOSFETs to allow power to flow into branch circuits. This application note explains howsystem power sequencing and level shifting can be accomplished using a low-voltage system manager

標簽： MOSFET 電平轉換控制功率

上傳時間： 2013-11-02

上傳用戶：wys0120
LTC4099 USB電源管理和電池充電

The LTC®4099 high effi ciency USB power manager andLi-Ion/Polymer battery charger seamlessly managespower distribution from multiple sources in portableapplications. It is differentiated from other USB powermanagers by its bidirectional I2C port that allows the hostmicroprocessor to control and monitor all aspects of theUSB power management and battery charging processes.In addition, a programmable interrupt generation functionalerts the host microprocessor to changes in device statusand provides unprecedented control of power managementfunctions. This high degree of confi gurability allowspost-layout changes in operation, even changes in thefi eld, and it allows a single qualifi ed device to be usedin a variety of products, thus reducing design time andeasing inventory management.

標簽： 4099 LTC USB 電源管理

上傳時間： 2013-10-22

上傳用戶：18602424091
SCOM2007詳細部署方案

安裝SCOM 2007 的大致步驟如下： 1. 部署活動目錄域環境。 2. 部署SQL Server2005，并安裝SP2 補丁。 3. 部署SCOM 2007 管理服務器和WEB 控制臺。 4. 部署SCOM 2007 報表服務。 5. 發現計算機和網絡設備, 將他們配置為被Operations manager 2007 所管理。 6. 從微軟官方網站下載合適的管理軟件包（Management Packs）并導入到Operations manager 2007 管理組中。

標簽： SCOM 2007 方案

上傳時間： 2014-01-22

上傳用戶：cjh1129
Multisim10破解補丁_破解使用方法

破解使用方法： 1。安裝Multisim 10。 2。運行破解程序，生成3個許可文件。 3。進入開始—所有程序—National Instruments—NI License manager。 4。選項—安裝許可證文件，裝入前面生成的3個許可文件，完成破解。

標簽： Multisim 破解 10 補丁

上傳時間： 2013-10-18

上傳用戶：xinzhch
OfficePicturemanager增量安裝（office圖片信息補丁包）

office picture manager圖片閱讀和批量處理工具，非常實用，針對有些簡化系統上沒有的軟件，想用最快最方便的進行處理或批處理圖片者，這就是不二之選 office圖片信息補丁包

標簽： OfficePicturemanager office 增量補丁

上傳時間： 2013-10-30

上傳用戶：稀世之寶039
Multisim10破解補丁_破解使用方法

破解使用方法： 1。安裝Multisim 10。 2。運行破解程序，生成3個許可文件。 3。進入開始—所有程序—National Instruments—NI License manager。 4。選項—安裝許可證文件，裝入前面生成的3個許可文件，完成破解。

標簽： Multisim 破解 10 補丁

上傳時間： 2013-10-22

上傳用戶：完瑪才讓
OfficePicturemanager增量安裝（office圖片信息補丁包）

office picture manager圖片閱讀和批量處理工具，非常實用，針對有些簡化系統上沒有的軟件，想用最快最方便的進行處理或批處理圖片者，這就是不二之選 office圖片信息補丁包

標簽： OfficePicturemanager office 增量補丁

上傳時間： 2013-10-14

上傳用戶：playboys0
高速PCB基礎理論及內存仿真技術(經典推薦)

第一部分信號完整性知識基礎.................................................................................5第一章高速數字電路概述.....................................................................................51.1 何為高速電路...............................................................................................51.2 高速帶來的問題及設計流程剖析...............................................................61.3 相關的一些基本概念...................................................................................8第二章傳輸線理論...............................................................................................122.1 分布式系統和集總電路.............................................................................122.2 傳輸線的RLCG 模型和電報方程...............................................................132.3 傳輸線的特征阻抗.....................................................................................142.3.1 特性阻抗的本質.................................................................................142.3.2 特征阻抗相關計算.............................................................................152.3.3 特性阻抗對信號完整性的影響.........................................................172.4 傳輸線電報方程及推導.............................................................................182.5 趨膚效應和集束效應.................................................................................232.6 信號的反射.................................................................................................252.6.1 反射機理和電報方程.........................................................................252.6.2 反射導致信號的失真問題.................................................................302.6.2.1 過沖和下沖.....................................................................................302.6.2.2 振蕩：.............................................................................................312.6.3 反射的抑制和匹配.............................................................................342.6.3.1 串行匹配.........................................................................................352.6.3.1 并行匹配.........................................................................................362.6.3.3 差分線的匹配.................................................................................392.6.3.4 多負載的匹配.................................................................................41第三章串擾的分析...............................................................................................423.1 串擾的基本概念.........................................................................................423.2 前向串擾和后向串擾.................................................................................433.3 后向串擾的反射.........................................................................................463.4 后向串擾的飽和.........................................................................................463.5 共模和差模電流對串擾的影響.................................................................483.6 連接器的串擾問題.....................................................................................513.7 串擾的具體計算.........................................................................................543.8 避免串擾的措施.........................................................................................57第四章 EMI 抑制....................................................................................................604.1 EMI/EMC 的基本概念..................................................................................604.2 EMI 的產生..................................................................................................614.2.1 電壓瞬變.............................................................................................614.2.2 信號的回流.........................................................................................624.2.3 共模和差摸EMI ..................................................................................634.3 EMI 的控制..................................................................................................654.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................654.3.1.2 磁場屏蔽.........................................................................................674.3.1.3 電磁場屏蔽.....................................................................................674.3.1.4 電磁屏蔽體和屏蔽效率.................................................................684.3.2 濾波.....................................................................................................714.3.2.1 去耦電容.........................................................................................714.3.2.3 磁性元件.........................................................................................734.3.3 接地.....................................................................................................744.4 PCB 設計中的EMI.......................................................................................754.4.1 傳輸線RLC 參數和EMI ........................................................................764.4.2 疊層設計抑制EMI ..............................................................................774.4.3 電容和接地過孔對回流的作用.........................................................784.4.4 布局和走線規則.................................................................................79第五章電源完整性理論基礎...............................................................................825.1 電源噪聲的起因及危害.............................................................................825.2 電源阻抗設計.............................................................................................855.3 同步開關噪聲分析.....................................................................................875.3.1 芯片內部開關噪聲.............................................................................885.3.2 芯片外部開關噪聲.............................................................................895.3.3 等效電感衡量SSN ..............................................................................905.4 旁路電容的特性和應用.............................................................................925.4.1 電容的頻率特性.................................................................................935.4.3 電容的介質和封裝影響.....................................................................955.4.3 電容并聯特性及反諧振.....................................................................955.4.4 如何選擇電容.....................................................................................975.4.5 電容的擺放及Layout ........................................................................99第六章系統時序.................................................................................................1006.1 普通時序系統...........................................................................................1006.1.1 時序參數的確定...............................................................................1016.1.2 時序約束條件...................................................................................1063.2 高速設計的問題.......................................................................................2093.3 SPECCTRAQuest SI Expert 的組件.......................................................2103.3.1 SPECCTRAQuest Model Integrity .................................................2103.3.2 SPECCTRAQuest Floorplanner/Editor .........................................2153.3.3 Constraint manager .......................................................................2163.3.4 SigXplorer Expert Topology Development Environment .......2233.3.5 SigNoise 仿真子系統......................................................................2253.3.6 EMControl .........................................................................................2303.3.7 SPECCTRA Expert 自動布線器.......................................................2303.4 高速設計的大致流程...............................................................................2303.4.1 拓撲結構的探索...............................................................................2313.4.2 空間解決方案的探索.......................................................................2313.4.3 使用拓撲模板驅動設計...................................................................2313.4.4 時序驅動布局...................................................................................2323.4.5 以約束條件驅動設計.......................................................................2323.4.6 設計后分析.......................................................................................233第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................2344.1 SPECCTRAQuest Signal Explorer 的功能包括：................................2344.2 圖形化的拓撲結構探索...........................................................................2344.3 全面的信號完整性(Signal Integrity)分析.......................................2344.4 完全兼容 IBIS 模型...............................................................................2344.5 PCB 設計前和設計的拓撲結構提取.......................................................2354.6 仿真設置顧問...........................................................................................2354.7 改變設計的管理.......................................................................................2354.8 關鍵技術特點...........................................................................................2364.8.1 拓撲結構探索...................................................................................2364.8.2 SigWave 波形顯示器........................................................................2364.8.3 集成化的在線分析(Integration and In-process Analysis) .236第五章部分特殊的運用...............................................................................2375.1 Script 指令的使用..................................................................................2375.2 差分信號的仿真.......................................................................................2435.3 眼圖模式的使用.......................................................................................249第四部分：HYPERLYNX 仿真工具使用指南............................................................251第一章使用LINESIM 進行前仿真.......................................................................2511.1 用LineSim 進行仿真工作的基本方法...................................................2511.2 處理信號完整性原理圖的具體問題.......................................................2591.3 在LineSim 中如何對傳輸線進行設置...................................................2601.4 在LineSim 中模擬IC 元件.....................................................................2631.5 在LineSim 中進行串擾仿真...................................................................268第二章使用BOARDSIM 進行后仿真......................................................................2732.1 用BOARDSIM 進行后仿真工作的基本方法...................................................2732.2 BoardSim 的進一步介紹..........................................................................2922.3 BoardSim 中的串擾仿真..........................................................................309

標簽： PCB 內存仿真技術

上傳時間： 2013-11-07

上傳用戶：aa7821634
通過SIMATIC HMI進行控制和監視

反復提示需要重新啟動：在”運行“，輸入”Regedit“打開注冊表，出如下的注冊表鍵值”HKEY_LOCAL_MACHINE\SYSTEM\CurrentControl Set\Control\Session manager\PendingFileRenameOperations” 顯示出錯消息1645”安裝Microsoft Net Framework”時出錯，返回代碼1601，安裝被取消：用戶的操作系統DCOM組態出錯。在“運行”中，輸入“dcomcnfg.exe”回車。在彈出的DCOM組態屬性設置對話框的”標準屬性“選項卡中，不要同時選擇”缺省驗證級別“＝”無”和“缺省身份更改級別‘＝”隱名’。

標簽： SIMATIC HMI 控制監視

上傳時間： 2013-11-22

上傳用戶：myworkpost