<li id="wkua2"></li> This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
標(biāo)簽： Modelling Guide Navy VHDL
上傳時間： 2014-12-23
上傳用戶：xinhaoshan2016
模擬集成電路的設(shè)計與其說是一門技術(shù)，還不如說是一門藝術(shù)。它比數(shù)字集成電路設(shè)計需要更嚴(yán)格的分析和更豐富的直覺。嚴(yán)謹堅實的理論無疑是嚴(yán)格分析能力的基石，而設(shè)計者的實踐經(jīng)驗無疑是誕生豐富直覺的源泉。這也正足初學(xué)者對學(xué)習(xí)模擬集成電路設(shè)計感到困惑并難以駕馭的根本原因。.美國加州大學(xué)洛杉機分校(UCLA)Razavi教授憑借著他在美國多所著名大學(xué)執(zhí)教多年的豐富教學(xué)經(jīng)驗和在世界知名頂級公司(AT&T，Bell Lab，HP)卓著的研究經(jīng)歷為我們提供了這本優(yōu)秀的教材。本書自2000午出版以來得到了國內(nèi)外讀者的好評和青睞，被許多國際知名大學(xué)選為教科書。同時，由于原著者在世界知名頂級公司的豐富研究經(jīng)歷，使本書也非常適合作為CMOS模擬集成電路設(shè)計或相關(guān)領(lǐng)域的研究人員和工程技術(shù)人員的參考書。... 本書介紹模擬CMOS集成電路的分析與設(shè)計。從直觀和嚴(yán)密的角度闡述了各種模擬電路的基本原理和概念，同時還闡述了在SOC中模擬電路設(shè)計遇到的新問題及電路技術(shù)的新發(fā)展。本書由淺入深，理論與實際結(jié)合，提供了大量現(xiàn)代工業(yè)中的設(shè)計實例。全書共18章。前10章介紹各種基本模塊和運放及其頻率響應(yīng)和噪聲。第11章至第13章介紹帶隙基準(zhǔn)、開關(guān)電容電路以及電路的非線性和失配的影響，第14、15章介紹振蕩器和鎖相環(huán)。第16章至18章介紹MOS器件的高階效應(yīng)及其模型、CMOS制造工藝和混合信號電路的版圖與封裝。 1 Introduction to Analog Design 2 Basic MOS Device Physics 3 Single-Stage Amplifiers 4 Differential Amplifiers 5 Passive and Active Current Mirrors 6 Frequency Response of Amplifiers 7 Noise 8 Feedback 9 Operational Amplifiers 10 Stability and Frequency Compensation 11 Bandgap References 12 Introduction to Switched-Capacitor Circuits 13 Nonlinearity and Mismatch 14 Oscillators 15 Phase-Locked Loops 16 Short-Channel Effects and Device models 17 CMOS Processing Technology 18 Layout and Packaging
標(biāo)簽： analog design cmos of
上傳時間： 2014-12-23
上傳用戶：杜瑩12345
Hyperlynx仿真應(yīng)用:阻抗匹配.下面以一個電路設(shè)計為例，簡單介紹一下PCB仿真軟件在設(shè)計中的使用。下面是一個DSP硬件電路部分元件位置關(guān)系(原理圖和PCB使用PROTEL99SE設(shè)計)，其中DRAM作為DSP的擴展Memory(64位寬度，低8bit還經(jīng)過3245接到FLASH和其它芯片)，DRAM時鐘頻率133M。因為頻率較高，設(shè)計過程中我們需要考慮DRAM的數(shù)據(jù)、地址和控制線是否需加串阻。下面，我們以數(shù)據(jù)線D0仿真為例看是否需要加串阻。模型建立首先需要在元件公司網(wǎng)站下載各器件IBIS模型。然后打開Hyperlynx,新建LineSim File(線路仿真—主要用于PCB前仿真驗證)新建好的線路仿真文件里可以看到一些虛線勾出的傳輸線、芯片腳、始端串阻和上下拉終端匹配電阻等。下面，我們開始導(dǎo)入主芯片DSP的數(shù)據(jù)線D0腳模型。左鍵點芯片管腳處的標(biāo)志，出現(xiàn)未知管腳，然后再按下圖的紅線所示線路選取芯片IBIS模型中的對應(yīng)管腳。 3http://bbs.elecfans.com/ 電子技術(shù)論壇 http://www.elecfans.com 電子發(fā)燒友點OK后退到“ASSIGN models”界面。選管腳為“Output”類型。這樣，一樣管腳的配置就完成了。同樣將DRAM的數(shù)據(jù)線對應(yīng)管腳和3245的對應(yīng)管腳IBIS模型加上(DSP輸出，3245高阻，DRAM輸入)。下面我們開始建立傳輸線模型。左鍵點DSP芯片腳相連的傳輸線，增添傳輸線，然后右鍵編輯屬性。因為我們使用四層板，在表層走線，所以要選用“Microstrip”，然后點“Value”進行屬性編輯。這里，我們要編輯一些PCB的屬性，布線長度、寬度和層間距等，屬性編輯界面如下：再將其它傳輸線也添加上。這就是沒有加阻抗匹配的仿真模型(PCB最遠直線間距1.4inch，對線長為1.7inch)。現(xiàn)在模型就建立好了。仿真及分析下面我們就要為各點加示波器探頭了，按照下圖紅線所示路徑為各測試點增加探頭：為發(fā)現(xiàn)更多的信息，我們使用眼圖觀察。因為時鐘是133M，數(shù)據(jù)單沿采樣，數(shù)據(jù)翻轉(zhuǎn)最高頻率為66.7M，對應(yīng)位寬為7.58ns。所以設(shè)置參數(shù)如下：之后按照芯片手冊制作眼圖模板。因為我們最關(guān)心的是接收端(DRAM)信號，所以模板也按照DRAM芯片HY57V283220手冊的輸入需求設(shè)計。芯片手冊中要求輸入高電平VIH高于2.0V，輸入低電平VIL低于0.8V。DRAM芯片的一個NOTE里指出，芯片可以承受最高5.6V，最低-2.0V信號(不長于3ns)：按下邊紅線路徑配置眼圖模板：低8位數(shù)據(jù)線沒有串阻可以滿足設(shè)計要求，而其他的56位都是一對一，經(jīng)過仿真沒有串阻也能通過。于是數(shù)據(jù)線不加串阻可以滿足設(shè)計要求，但有一點需注意，就是寫數(shù)據(jù)時因為存在回沖，DRAM接收高電平在位中間會回沖到2V。因此會導(dǎo)致電平判決裕量較小，抗干擾能力差一些，如果調(diào)試過程中發(fā)現(xiàn)寫RAM會出錯，還需要改版加串阻。
上傳時間： 2013-11-05
上傳用戶：dudu121
Integrated EMI/Thermal Design forSwitching Power SuppliesWei ZhangThesis submitted to the Faculty of theVirginia Polytechnic Institute and State Universityin partial fulfillment of the requirements for the degree of Integrated EMI/Thermal Design forSwitching Power SuppliesWei Zhang(ABSTRACT)This work presents the modeling and analysis of EMI and thermal performancefor switch power supply by using the CAD tools. The methodology and design guidelinesare developed.By using a boost PFC circuit as an example, an equivalent circuit model is builtfor EMI noise prediction and analysis. The parasitic elements of circuit layout andcomponents are extracted analytically or by using CAD tools. Based on the model, circuitlayout and magnetic component design are modified to minimize circuit EMI. EMI filtercan be designed at an early stage without prototype implementation.In the second part, thermal analyses are conducted for the circuit by using thesoftware Flotherm, which includes the mechanism of conduction, convection andradiation. Thermal models are built for the components. Thermal performance of thecircuit and the temperature profile of components are predicted. Improved thermalmanagement and winding arrangement are investigated to reduce temperature.In the third part, several circuit layouts and inductor design examples are checkedfrom both the EMI and thermal point of view. Insightful information is obtained.
標(biāo)簽： EMI 開關(guān)電源 英文
上傳時間： 2013-11-10
上傳用戶：1595690
MPLAB C30用戶指南(英文) HIGHLIGHTSThe information covered in this chapter is as follows:• About this Guide• Recommended Reading• Troubleshooting• The Microchip Web Site• Development Systems Customer Notification Service• Customer Support Document LayoutThe document layout is as follows:• Chapter 1: Compiler Overview – describes MPLAB C30, development tools andfeature set.• Chapter 2: Differences between MPLAB C30 and ANSI C – describes thedifferences between the C language supported by MPLAB C30 syntax and thestandard ANSI-89 C.• Chapter 3: Using MPLAB C30 – describes how to use the MPLAB C30 compilerfrom the command line.• Chapter 4: MPLAB C30 Runtime Environment – describes the MPLAB C30runtime model, including information on sections, initialization, memory models, thesoftware stack and much more.• Chapter 5: Data Types – describes MPLAB C30 integer, floating point and pointerdata types.• Chapter 6: Device Support Files – describes the MPLAB C30 header and registerdefinition files, as well as how to use with SFR’s.• Chapter 7: Interrupts – describes how to use interrupts.• Chapter 8: Mixing Assembly Language and C Modules – provides guidelines tousing MPLAB C30 with MPLAB ASM30 assembly language modules.
上傳時間： 2013-10-21
上傳用戶：13925096126
針對嵌入式機器視覺系統(tǒng)向獨立化、智能化發(fā)展的要求，介紹了一種嵌入式視覺系統(tǒng)--智能相機。基于對智能相機體系結(jié)構(gòu)、組成模塊和圖像采集、傳輸和處理技術(shù)的分析，對國內(nèi)外的幾款智能相機進行比較。綜合技術(shù)發(fā)展現(xiàn)狀，提出基于FPGA+DSP模式的硬件平臺，并提出智能相機的發(fā)展方向。分析結(jié)果表明，該系統(tǒng)設(shè)計可以實現(xiàn)脫離PC運行，完成圖像獲取與分析，并作出相應(yīng)輸出。 Abstract: This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP models and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
上傳時間： 2013-10-24
上傳用戶：bvdragon
Single-Ended and Differential S-Parameters Differential circuits have been important incommunication systems for many years. In the past,differential communication circuits operated at lowfrequencies, where they could be designed andanalyzed using lumped-element models andtechniques. With the frequency of operationincreasing beyond 1GHz, and above 1Gbps fordigital communications, this lumped-elementapproach is no longer valid, because the physicalsize of the circuit approaches the size of awavelength.Distributed models and analysis techniques are nowused instead of lumped-element techniques.Scattering parameters, or S-parameters, have beendeveloped for this purpose [1]. These S-parametersare defined for single-ended networks. S-parameterscan be used to describe differential networks, but astrict definition was not developed until Bockelmanand others addressed this issue [2]. Bockelman’swork also included a study on how to adapt single-ended S-parameters for use with differential circuits[2]. This adaptation, called “mixed-mode S-parameters,” addresses differential and common-mode operation, as well as the conversion betweenthe two modes of operation.This application note will explain the use of single-ended and mixed-mode S-parameters, and the basicconcepts of microwave measurement calibration.
上傳時間： 2014-03-25
上傳用戶：yyyyyyyyyy
In this paper, we discuss efficient coding and design styles using verilog. This can beimmensely helpful for any digital designer initiating designs. Here, we address different problems rangingfrom RTL-Gate Level simulation mismatch to race conditions in writing behavioral models. All theseproblems are accompanied by an example to have a better idea, and these can be taken care off if thesecoding guidelines are followed. Discussion of all the techniques is beyond the scope of this paper, however,here we try to cover a few of them.
標(biāo)簽： Efficient Verilog Digital Coding
上傳時間： 2013-11-23
上傳用戶：我干你啊
This document was developed under the Standard Hardware and Reliability Program (SHARP) TechnologyIndependent Representation of Electronic Products (TIREP) project. It is intended for use by VHSIC HardwareDescription Language (VHDL) design engineers and is offered as guidance for the development of VHDL modelswhich are compliant with the VHDL Data Item Description (DID DI-EGDS-80811) and which can be providedto manufacturing engineering personnel for the development of production data and the subsequent productionof hardware. Most VHDL modeling performed to date has been concentrated at either the component level orat the conceptual system level. The assembly and sub-assembly levels have been largely disregarded. Under theSHARP TIREP project, an attempt has been made to help close this gap. The TIREP models are based upon lowcomplexity Standard Electronic Modules (SEM) of the format A configuration. Although these modules are quitesimple, it is felt that the lessons learned offer guidance which can readily be applied to a wide range of assemblytypes and complexities.
標(biāo)簽： Modelling Guide Navy VHDL
上傳時間： 2013-11-20
上傳用戶：pzw421125
針對嵌入式機器視覺系統(tǒng)向獨立化、智能化發(fā)展的要求，介紹了一種嵌入式視覺系統(tǒng)--智能相機。基于對智能相機體系結(jié)構(gòu)、組成模塊和圖像采集、傳輸和處理技術(shù)的分析，對國內(nèi)外的幾款智能相機進行比較。綜合技術(shù)發(fā)展現(xiàn)狀，提出基于FPGA+DSP模式的硬件平臺，并提出智能相機的發(fā)展方向。分析結(jié)果表明，該系統(tǒng)設(shè)計可以實現(xiàn)脫離PC運行，完成圖像獲取與分析，并作出相應(yīng)輸出。 Abstract: This paper introduced an embedded vision system-intelligent camera ，which was for embedded machine vision systems to an independent and intelligent development requirements. Intelligent camera architecture， component modules and image acquisition， transmission and processing technology were analyzed. After comparing integrated technology development of several intelligent cameras at home and abroad， the paper proposed the hardware platform based on FPGA+DSP models and made clear direction of development of intelligent cameras. On the analysis of the design， the results indicate that the system can run from the PC independently to complete the image acquisition and analysis and give a corresponding output.
上傳時間： 2013-11-14
上傳用戶：無聊來刷下
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